PIC16LF1703T-I/ML - 8-bit 32MHz MCU 3.5KB Flash QFN-16 | Microchip
MPN: PIC16LF1703T-I/ML ✓ AktifPIC16LF1703T-I/ML Ringkasan
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, Flash program memory, SRAM, and peripherals on one die. The PIC16F/LF family uses Microchip's enhanced mid-range RISC core with 14-bit instruction words, balancing code density, deterministic interrupt response, and ultra-low standby current. Within Microchip's taxonomy, PIC16 sits below PIC18 and dsPIC33 families in performance, above PIC10/12/14/15 in peripheral integration, and competes with AVR ATtiny and low-end STM32G0 devices in cost-sensitive battery-powered designs.
Key features include 256 bytes of SRAM, 256 bytes of EEPROM, 12 I/O pins, a 10-bit ADC with up to 8 channels, two 8-bit timers, one 16-bit timer, Enhanced Universal Synchronous/Asynchronous Receiver/Transmitter (EUSART), and an MSSP (I2C/SPI) peripheral. The XLP nanoWatt technology delivers standby currents below 50 nA typical, making the device suitable for always-on battery applications.
The architecture is built around a 14-bit instruction word, single-cycle ALU, and hardware stack with 16 levels, providing predictable real-time behavior. The internal 32MHz oscillator eliminates the need for an external crystal in cost-sensitive designs, while the HFINTOSC supports frequency tuning via the OSCTUNE register for protocols requiring precise baud rates.
Typical applications include consumer electronics remote controls, IoT sensor nodes, battery-powered wireless accessories, low-end LED lighting controllers, and small home appliances. The 1.8V minimum supply voltage allows direct connection to single-cell lithium or two-cell alkaline battery chemistries.
When designing with this device, engineers should note that the QFN-16 exposed pad must be soldered to the PCB ground plane for proper thermal dissipation and electrical grounding, and that debug/programming requires a dedicated ICSP pinout on PCB pads accessible to the PICkit or MPLAB SNAP programmer.
This page synthesizes distributor pricing, drop-in package equivalents, and practical design notes not found in the standalone Microchip datasheet, giving engineers a single reference for evaluation and sourcing.
Alternatif penggantian untuk PIC16LF1703T-I/ML — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian PIC16LF1703T-I/ML (sama faktor bentuk dan footprint) — berbeda di dalam Package, ADC, Operating Temperature, Program Memory (Flash), Core.
PIC16LF1703-I/ML
✅ Drop-InKontak untuk harga
Lihat Datasheet →PIC16LF1703-E/ML
✅ Drop-InKontak untuk harga
Lihat Datasheet →PIC16F1703T-I/ML
✅ Drop-InKontak untuk harga
Lihat Datasheet →PIC16LF1559T-I/ML
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →PIC16LF1554T-I/ML
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →PIC16LF1454T-I/ML
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →PIC16LF1703T-I/ML Rating Maksimal & Karakteristik Listrik
| Core Architecture | 8-bit PIC16 enhanced mid-range |
| Program Memory (Flash) | 3.5 KB (2K x 14 words) |
| Data SRAM | 256 B |
| Data EEPROM | 256 B |
| Maximum CPU Speed | 32 MHz |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| Suhu Kerja | -40 C to +85 C (Industrial) |
| I/O Pins | 12 |
| ADC | 10-bit, up to 8 channels |
| Timers | 2 x 8-bit, 1 x 16-bit |
| Communication | EUSART + MSSP (I2C/SPI) |
| Paket | 16-pin QFN (4x4 mm) with exposed pad |
| Tipe Mounting | Surface Mount |
| Level MSL | 1 |
| Status RoHS | Compliant |
| ICSP/ICD Support | Yes (PICkit, MPLAB SNAP compatible) |
| Low-Power Technology | XLP nanoWatt |
Konfigurasi Pin PIC16LF1703T-I/ML
| Pin produk 1 | RA2/AN2 — Bidirectional I/O / Analog input channel 2 |
| Pin produk 2 | RA3 — Bidirectional I/O (input-only on this device) |
| Pin produk 3 | RA4/AN3 — Bidirectional I/O / Analog input channel 3 |
| Pin produk 4 | RA5/AN4 — Bidirectional I/O / Analog input channel 4 |
| Pin produk 5 | VSS — Ground reference |
| Pin produk 6 | RA1/AN1 — Bidirectional I/O / Analog input channel 1 |
| Pin produk 7 | RA0/AN0 — Bidirectional I/O / Analog input channel 0 |
| Pin produk 8 | RA7 — Bidirectional I/O |
| Pin produk 9 | RA6 — Bidirectional I/O |
| Pin produk 10 | RC0 — Bidirectional I/O |
| Pin produk 11 | RC1 — Bidirectional I/O |
| Pin produk 12 | RC2 — Bidirectional I/O |
| Pin produk 13 | RC3 — Bidirectional I/O |
| Pin produk 14 | RC4 — Bidirectional I/O |
| Pin produk 15 | RC5 — Bidirectional I/O |
| Pin produk 16 | VDD — Positive supply voltage (1.8V to 3.6V) |
| Pin produk EP | EP — Exposed thermal pad - must be soldered to PCB ground plane |
Aplikasi Umum
PIC16LF1703T-I/ML cocok untuk 6 aplikasis: Battery-Powered IoT Sensor Nodes, Consumer Remote Controls, Low-End LED Lighting Controllers, Small Home Appliance Control, Automotive Interior Accessories (Non-Safety), Industrial Sensor Interface Boards.
Battery-Powered IoT Sensor Nodes
The PIC16LF1703T-I/ML is well suited for IoT sensor nodes requiring multi-year battery life. The XLP nanoWatt technology delivers standby currents below 50 nA typical, while the 32 MHz HFINTOSC eliminates the need for an external crystal, reducing BOM cost. The 10-bit ADC with up to 8 channels allows direct interface to temperature, humidity, or light sensors, and the 1.8V minimum supply supports single-cell lithium chemistries down to end-of-discharge. The 16-QFN exposed pad provides a compact 4x4 mm footprint for miniaturized sensor enclosures.
Direkomendasikan
Consumer Remote Controls
For handheld infrared remote controls, the PIC16LF1703T-I/ML offers the right balance of cost, I/O count, and standby current. Its 12 I/O pins drive LED indicators, button matrix scans, and IR emitter transistors via PWM, while the 32 MHz internal oscillator generates accurate 38 kHz carrier frequencies for NEC or RC5 IR protocols. The XLP sleep current at <50 nA extends shelf life on coin-cell batteries to multi-year durations. The QFN-16 footprint supports thin remote enclosures down to 5 mm total thickness.
Direkomendasikan
Low-End LED Lighting Controllers
The PIC16LF1703T-I/ML can serve as the controller for entry-level LED drivers, dimmer switches, and color-changing decorative lights. Its 10-bit PWM resolution enables smooth dimming without visible flicker, and the MSSP peripheral supports SPI-controlled LED driver ICs or WS2812-style addressable LED strips. The 1.8V-3.6V supply range allows direct operation from rectified mains-derived DC rails. With 3.5 KB of Flash, color-cycle algorithms, motion-sensor interfaces, and DMX-style protocols fit within program memory.
Direkomendasikan
Small Home Appliance Control
Small home appliances such as coffee makers, electric toothbrushes, and air purifiers benefit from the PIC16LF1703T-I/ML's mix of analog and digital peripherals. The 10-bit ADC reads thermistor temperature sensors, battery voltage, and potentiometer user inputs, while EUSART enables Bluetooth or Wi-Fi module communication for connected appliances. The QFN-16 (4x4 mm) exposed pad package provides adequate thermal dissipation for moderate switching losses, and the industrial -40C to +85C temperature range handles kitchen and bathroom environments.
Direkomendasikan
Automotive Interior Accessories (Non-Safety)
For non-safety automotive interior accessories such as ambient lighting, USB charging ports, or cup-holder illuminators, the PIC16LF1703T-I/ML provides the right feature set. The AEC-Q100 qualified version (PIC16F1703T-I/ML automotive grade) handles 12V battery transients via external regulators and operates reliably in cabin temperatures. The 16-pin QFN package supports compact PCBAs behind dashboards. Note: for safety-critical automotive applications, choose AEC-Q100 qualified variants from the same family.
Direkomendasikan
Industrial Sensor Interface Boards
The PIC16LF1703T-I/ML is suitable for low-cost industrial sensor interface boards including 4-20 mA loop-powered transmitters, RTD conditioners, and bridge sensor digitizers. Its 10-bit ADC with 8 channels multiplexes multiple sensor inputs, while the EUSART provides RS-485 communication via external transceivers. The 1.8V-3.6V supply enables efficient powering from 24V industrial loops via low-dropout regulators. The -40C to +85C industrial temperature range handles factory floor environments.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk PIC16LF1703T-I/ML — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | PIC16LF1703-I/ML | PIC16LF1703-E/ML | PIC16F1703T-I/ML | PIC16LF1559T-I/ML | PIC16LF1454T-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 16-QFN (4x4 mm) | 16-QFN (4x4 mm) - same | 16-QFN (4x4 mm) - same | 16-QFN (4x4 mm) - same | 16-QFN (4x4 mm) - same | 16-QFN (4x4 mm) - same |
| Program Memory (Flash) | 3.5 KB | 3.5 KB | 3.5 KB | 3.5 KB | 7 KB | 14 KB |
| Data SRAM | 256 B | 256 B | 256 B | 256 B | 512 B | 1024 B |
| Maximum CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 48 MHz |
| Supply Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 2.3 V to 5.5 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| ADC Resolution | 10-bit | 10-bit | 10-bit | 10-bit | 10-bit | 10-bit |
| USB Support | No | No | No | No | No | Yes (USB 2.0 FS) |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Diferensiator Kunci
- Lowest 10-bit ADC 8-bit PIC16 in 16-QFN at production pricing (vsPIC16F1703T-I/ML)
- Higher program memory density in same QFN-16 package (vsPIC16LF1503T-I/SL)
- Lower current consumption than USB-capable PIC16LF1454 (vsPIC16LF1454T-I/ML)
Catatan Desain
The QFN-16 exposed pad must be soldered to a PCB ground pad with at least 4 thermal vias connecting to the inner ground plane. The exposed pad serves both as the primary thermal dissipation path and as the chip's electrical ground reference. According to the Microchip QFN package guidelines, missing vias result in junction temperature rise of 20-30 C/W above rated thermal resistance. Use a 0.3 mm solder paste stencil aperture for the EP pad to ensure proper solder joint formation during reflow.
Place a 100 nF decoupling capacitor as close as possible to the VDD pin (pin 16), ideally within 3 mm of the package. Add a bulk 1-10 uF capacitor nearby for transient load handling when the ADC or EUSART is active. The PIC16LF1703T-I/ML's XLP technology requires careful PCB layout to achieve nanoWatt-level standby currents; long ground traces and poor decoupling can introduce noise that prevents the device from entering Sleep mode correctly. Use a star-ground topology connecting the MCU ground directly to the EP pad.
Do not confuse the PIC16LF1703T-I/ML (1.8V-3.6V) with the PIC16F1703T-I/ML (2.3V-5.5V). Programming voltage on the MCLR pin must not exceed VDD + 0.3V or absolute maximum 9.5V per datasheet, which is a common failure mode when designers use 5V programmers on LF parts. For ICSP, ensure the PGC/PGD pins are accessible on test pads and that no series resistors above 4.7 kohm are placed between the programmer and the MCU, or programming will fail intermittently.
Informasi Konformitas
RoHS and REACH compliant per Microchip product page declarations. Not AEC-Q100 qualified in the standard industrial grade; automotive customers should select AEC-Q100 qualified variants or the PIC16F1703T-E/ML extended temperature grade.
