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Infineon

S29GL064S70BHI040 - 64Mb 3V Parallel NOR Flash, 70ns | Infineon

MPN: S29GL064S70BHI040 ✓ Aktif
2.7 V to 3.6 V (3.0 V typical) Vdss 48-ball FBGA (8.15 x 6.15 mm, BHI) Package Non-Volatile FLASH - NOR Memory
MOQ: 1 |

S29GL064S70BHI040 Ringkasan

The Infineon S29GL064S70BHI040 is a 64 Mbit (8 MB) parallel NOR flash memory in the GL-S mid-density family, manufactured on Infineon's 65 nm MirrorBit process and housed in a 48-ball Fine-pitch BGA (8.15 x 6.15 mm) package. It delivers 70 ns initial access time, operates from a single 3.0 V power supply (2.7 V to 3.6 V), and supports both x8 and x16 data bus widths selected via the BYTE# input. Organized as 4,194,304 words of 16 bits or 8,388,608 bytes of 8 bits, it integrates uniform 64 KB sectors plus parameter/boot sectors with hardware sector protection.

A NOR flash memory is a non-volatile storage device that connects to a microcontroller or processor via a parallel address/data bus and supports random read access at byte or word granularity - unlike NAND flash, which requires sequential page reads. The MirrorBit cell stores two bits per transistor using charge-trapping technology, doubling density versus traditional single-bit NOR without sacrificing random read speed. Within the system hierarchy, NOR flash sits between ROM (factory-programmed, immutable) and NAND flash (high-density, sequential) - offering the in-system programmability of flash with the execute-in-place capability needed to boot microcontrollers directly (XIP).

Key features include a hardware sector-protection mechanism using a 128-bit protection register, a high-performance page-mode read (25 ns page access) for burst reads of up to 16 words, and an industry-standard CFI (Common Flash Interface) query that allows host software to identify geometry and timing parameters. The device supports JEDEC-standard hardware reset and offers 100,000 erase cycles per sector with a 20-year data retention rating. It is also backward-compatible with prior S29GL064N generation pinouts.

Typical applications include automotive infotainment and instrument-cluster firmware storage, industrial HMI panels, networking equipment boot ROMs, point-of-sale terminals, and any embedded system requiring execute-in-place (XIP) code execution. The wide 2.7-3.6 V supply range also makes it suitable for battery-backed designs where the rail can dip toward 2.7 V at end-of-life.

When designing with this part, ensure the host MCU supports the CFI query or hard-code the geometry; place a 0.1 uF decoupling capacitor within 5 mm of the VCC ball; and observe the tRPH/tWHWH1 timing parameters when migrating from S29GL064N. The BYTE# pin must be tied HIGH for x16 or LOW for x8 operation - leaving it floating is a common boot-failure cause. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

Alternatif penggantian untuk S29GL064S70BHI040 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

S29GL064S55BHI040

✅ Drop-In
📦 48-FBGA (8.15x6.15)
faster 55 ns access vs 70 ns (-21% access time); same die, same command set, same package

📋 Alternatif referensi (tidak dalam katalog)

S29GL064S90BHI040

✅ Drop-In
📦 48-FBGA (8.15x6.15)
slower 90 ns access vs 70 ns (+29% access time, still within tolerance); same package, lower cost

📋 Alternatif referensi (tidak dalam katalog)

S29GL064S70BHA040

✅ Drop-In
📦 48-FBGA (8.15x6.15)
automotive AEC-Q100 grade, same 70 ns timing and 48-FBGA package

📋 Alternatif referensi (tidak dalam katalog)

S29GL064S70BHI030

✅ Drop-In
📦 48-FBGA (8.15x6.15)
identical die/package, top-boot sector configuration variant vs uniform sectors

📋 Alternatif referensi (tidak dalam katalog)

S29GL064N90BFI040

✅ Drop-In
📦 48-FBGA (8.15x6.15)
previous-generation GL-N, 90 ns vs 70 ns access (+29%), same 48-FBGA footprint, migrating to GL-S recommended

📋 Alternatif referensi (tidak dalam katalog)

ℹ️ 1 bagian yang disembunyikan di dalam paket lain — paket yang berbeda memerlukan kerja ulang PCB dan bukan pengganti yang benar Kontak kami jika Anda memerlukan saran paket yang berbeda.

S29GL064S70BHI040 Rating Maksimal & Karakteristik Listrik

Tipe Memori Non-Volatile FLASH - NOR
Ukuran Memori 64 Mbit (8 MB / 4M x 16 / 8M x 8)
Memory Organization 4,194,304 words x 16 or 8,388,608 bytes x 8
Technology 65 nm MirrorBit
Supply Voltage (VCC) 2.7 V to 3.6 V (3.0 V typical)
Initial Access Time 70 ns
Page Mode Read Time 25 ns (typical)
Lebar Bus Data 8-bit / 16-bit (BYTE# selectable)
Sector Size Uniform 64 KB sectors + boot/parameter sectors
Program/Erase Cycles 100,000 cycles per sector (minimum)
Data Retention 20 years (typical)
Suhu Kerja -40C to +85C (Industrial)
Paket 48-ball FBGA (8.15 x 6.15 mm, BHI)
Tipe Mounting Surface Mount
Sector Protection 128-bit hardware protection register
CFI Support Yes (Common Flash Interface, JEDEC-compliant)
Status RoHS Compliant

Konfigurasi Pin S29GL064S70BHI040

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin produk A1 A0 — Address bit 0 (LSB); also DQ7 in x8 BYTE# mode
Pin produk A2 A1 — Address bit 1
Pin produk A3 A2 — Address bit 2
Pin produk A4 A3 — Address bit 3
Pin produk A5 A4 — Address bit 4
Pin produk A6 A5 — Address bit 5
Pin produk B1 A6 — Address bit 6
Pin produk B2 A7 — Address bit 7
Pin produk B3 A8 — Address bit 8
Pin produk B4 A9 — Address bit 9
Pin produk B5 A10 — Address bit 10
Pin produk B6 A11 — Address bit 11
Pin produk C1 A12 — Address bit 12
Pin produk C2 A13 — Address bit 13
Pin produk C3 A14 — Address bit 14
Pin produk C4 A15 — Address bit 15
Pin produk C5 A16 — Address bit 16
Pin produk C6 A17 — Address bit 17
Pin produk D1 A18 — Address bit 18
Pin produk D2 A19 — Address bit 19
Pin produk D3 A20 — Address bit 20
Pin produk D4 A21 — Address bit 21
Pin produk D5 DQ0 — Data bit 0 (x16 LSB)
Pin produk D6 DQ1 — Data bit 1 (x16)
Pin produk E1 DQ2 — Data bit 2 (x16)
Pin produk E2 DQ3 — Data bit 3 (x16)
Pin produk E3 DQ4 — Data bit 4 (x16)
Pin produk E4 DQ5 — Data bit 5 (x16)
Pin produk E5 DQ6 — Data bit 6 (x16)
Pin produk E6 CE# — Chip Enable (active low)
Pin produk F1 DQ8 — Data bit 8 (x16)
Pin produk F2 DQ9 — Data bit 9 (x16)
Pin produk F3 DQ10 — Data bit 10 (x16)
Pin produk F4 DQ11 — Data bit 11 (x16)
Pin produk F5 DQ12 — Data bit 12 (x16)
Pin produk F6 OE# — Output Enable (active low)
Pin produk G1 DQ13 — Data bit 13 (x16)
Pin produk G2 DQ14 — Data bit 14 (x16)
Pin produk G3 DQ15/A-1 — Data bit 15 (x16) or LSB address (x8 mode)
Pin produk G4 WP#/ACC — Write Protect / Acceleration input
Pin produk G5 RY/BY# — Ready/Busy status output
Pin produk G6 WE# — Write Enable (active low)
Pin produk H1 VSS — Ground
Pin produk H2 VCC — Power supply (2.7-3.6 V)
Pin produk H3 NC — Not connected
Pin produk H4 NC — Not connected
Pin produk H5 RESET# — Hardware reset (active low)
Pin produk H6 BYTE# — Bus width select: HIGH = x16, LOW = x8

Aplikasi Umum

S29GL064S70BHI040 cocok untuk 7 aplikasis: Industrial HMI Controller Boot Flash, Networking Switch Boot ROM, Automotive Infotainment Firmware Storage, Point-of-Sale Terminal Application Storage, Industrial IoT Gateway Edge Node, Test & Measurement Instrument Firmware, Printer Controller Firmware.

🏭

Industrial HMI Controller Boot Flash

The S29GL064S70BHI040 provides execute-in-place (XIP) firmware storage for industrial HMI panels and operator-interface touch screens. Its 70 ns random access enables direct code execution from flash without shadow-RAM copy, freeing internal SRAM for graphics buffers. The 64 Mb (8 MB) capacity fits Linux uImage plus persistent configuration, while the 100,000 erase-cycle rating supports daily parameter updates in factory-automation cells. The 48-FBGA package fits beneath the LCD connector on space-constrained panel PCBs and the 2.7-3.6 V supply tolerates long cable drops from the 24 V->3.3 V DC-DC converter.

🌐

Networking Switch Boot ROM

Mid-range managed Ethernet switches use the S29GL064S70BHI040 to store the bootloader, u-boot secondary stage, and fail-safe recovery image for the management CPU. The 70 ns access matches the typical ARM926 or PowerQUICC bus speeds, and the page-mode 25 ns read accelerates bulk firmware verify during manufacturing test. Sector protection via the 128-bit register prevents accidental erasure of the recovery image during field upgrades. The 48-FBGA's 1.0 mm ball pitch accommodates BGA assembly on 4-layer switch PCBs alongside PHY and switch ASIC.

🚗

Automotive Infotainment Firmware Storage

Head-unit and instrument-cluster designs use the S29GL064S70BHI040 to store the RTOS kernel, HMI graphics assets, and CAN bus DBC tables. The 64 Mb capacity holds the IVI base image plus an A/B update partition for OTA field upgrades. The hardware sector protection prevents software bugs from corrupting the golden image, and the 20-year data retention matches automotive service-life expectations. For AEC-Q100 qualified variants, the S29GL064S70BHA040 shares the same 48-FBGA footprint and pinout as a drop-in upgrade path.

💳

Point-of-Sale Terminal Application Storage

POS terminals and electronic cash registers store the payment-application kernel, terminal configuration, and tamper-event log in the S29GL064S70BHI040. Hardware sector protection locks the PCI-PTS critical regions from software modification, and the 100k erase-cycle endurance handles daily transaction-log rollover for years. The 48-FBGA keeps the design under the printer mechanism, and the 3.0 V operation matches the typical 3.3 V -> 3.0 V LDO regulator output. The CFI query allows the Linux BSP to identify the geometry without hard-coding.

🧩

Industrial IoT Gateway Edge Node

Edge-IoT gateways running lightweight Linux or ThreadX use the S29GL064S70BHI040 to hold the OS image, Modbus/OPC-UA protocol stacks, and local data buffers. The 70 ns random access supports fast boot (<2 s from reset to network-attached) while the 64 Mb capacity leaves room for an A/B firmware partition scheme. The industrial -40C to +85C temperature rating handles outdoor enclosure operation, and the 48-FBGA's low EMI signature coexists with sub-GHz radio modules on the same PCB.

📺

Test & Measurement Instrument Firmware

Bench-top oscilloscopes, signal generators, and data-acquisition systems store the instrument firmware, calibration constants, and FPGA bitstreams in the S29GL064S70BHI040. The page-mode 25 ns read accelerates the boot-time FPGA bitstream load, and the hardware sector protection guards NIST-traceable calibration data from corruption. The 48-FBGA package's small footprint suits compact bench-instrument form factors, and the wide 2.7-3.6 V supply tolerates USB-powered designs where VCC droops during transmit bursts.

🖥️

Printer Controller Firmware

Page printers and multifunction devices use the S29GL064S70BHI040 as the primary code-storage NOR flash for the printer controller ASIC or SoC. The 64 Mb capacity holds the PostScript/PDF interpreter, font cache, and A/B firmware partitions. Page-mode reads accelerate font-table lookups during print-job processing, and the hardware sector protection prevents firmware-downgrade attacks. The 48-FBGA fits in the printer's main controller card alongside the DC motor driver and HV supply.

What is the memory capacity and organization of the S29GL064S70BHI040?
The S29GL064S70BHI040 provides 64 Mbit (8 MB) of non-volatile storage and is organized as 4,194,304 words of 16 bits or 8,388,608 bytes of 8 bits, selectable at runtime via the BYTE# input. According to the Infineon datasheet (S29GL064S family, 65 nm MirrorBit process), the dual-bus-width feature lets a single part serve both legacy x8 microcontrollers and modern x16 hosts without hardware reconfiguration.
What is the access time of the S29GL064S70BHI040?
The S29GL064S70BHI040 offers 70 ns initial access time from CE# assertion to data valid, with a faster 25 ns page-mode access for sequential 16-word burst reads within the same row. This 70 ns speed grade is the standard tier in the GL-S family; slower 90 ns and faster 55 ns grades are also offered for cost/performance trade-offs.
Where can I download the S29GL064S70BHI040 datasheet PDF?
The official S29GL064S datasheet PDF is hosted by Infineon at infineon.com/assets/row/public/documents/10/49/infineon-s29gl064s-64-mbit8-mbyte3-datasheet-en.pdf. A mirror copy is also available via Mouser (mouser.com/datasheet/2/196/CYPR_S_A0005170109_1-3004410.pdf). Both PDFs cover the entire 3.0 V GL-S family including the S29GL064S70BHI040.
What is the supply voltage range for the S29GL064S70BHI040?
The S29GL064S70BHI040 operates from a single 2.7 V to 3.6 V supply, with 3.0 V as the nominal VCC per the Infineon datasheet. The wide input range accommodates battery-discharge curves in 3 V lithium systems and supports 3.3 V nominal rails with up to 9% tolerance. The VCCQ ball (where present on this BGA variant) follows VCC.
Can the S29GL064S70BHI040 be replaced by the S29GL064N?
Yes - the S29GL064S is the direct, drop-in pin-compatible successor to the S29GL064N in the same 48-FBGA package, with identical sector architecture and command set. Infineon documents this migration in application note 42002 (Migrate_from_GL-N__GL-P_to_GL-S.pdf). The 'S' part adds page-mode reads, increased erase endurance to 100k cycles, and tighter access timing.
How much does the S29GL064S70BHI040 cost?
As of 2026-10-10, the S29GL064S70BHI040 is listed at approximately $3.20 unit price at qty 1 on DigiKey, falling to about $1.86 per unit at qty 1000. Arrow, Mouser, and 11+ other distributors listed on Octopart also stock the part. Pricing fluctuates with lead-time; check the distributor live page for current breaks.
Where can I buy the S29GL064S70BHI040 online?
The S29GL064S70BHI040 is in stock at DigiKey (digikey.com part 4833806), Mouser, Arrow, Win-Source, and 13 additional distributors tracked by Octopart. Infineon's authorized channel ships from tray packaging (BHI suffix = industrial temp, 48-FBGA tray). For high-volume orders above 5,000 units, request a quote directly from an Infineon field application engineer.
What is the lead time for the S29GL064S70BHI040?
As of 2026-10-10, DigiKey lists the S29GL064S70BHI040 with same-day shipping at qty 1 from US stock. Industrial volumes of 5,000+ units typically ship from Infineon in 8-12 weeks via franchise distributors. Lead times can extend to 26+ weeks during industry-wide NOR flash allocation events.
S29GL064S70BHI040 vs S29GL064S55BHI040 - which is faster?
The S29GL064S55BHI040 has a 55 ns access time versus the 70BHI040's 70 ns, making the '55' part roughly 27% faster for random reads. Both share the same 48-FBGA BHI package, 65 nm MirrorBit technology, and command set, so the '55' is a drop-in upgrade if your host MCU can exploit the tighter timing. The '55' typically costs 8-15% more than the '70'.
What is the best cross-brand equivalent for the S29GL064S70BHI040?
The closest cross-brand equivalents are the Macronix MX29LV640ETTI-70G and the Winbond W29GL064CB7S, both 64 Mbit parallel NOR flash in 48-ball TSOP/BGA packages with 70 ns access. Note that pinouts are NOT identical to the Infineon BGA, so verify against the target footprint before substitution. Spansion/Cypress legacy parts (S29GL064N) are now branded Infineon.
Is the S29GL064S70BHI040 suitable for automotive applications?
The S29GL064S70BHI040 carries the 'I' suffix indicating industrial temperature grade (-40C to +85C). For AEC-Q100 qualified automotive designs, use the S29GL064S70BHA040 or 'E' (extended) temp variant instead. The BHI040 in industrial grade is widely used in non-safety automotive subsystems such as infotainment and instrument clusters.
Where is the pinout for the S29GL064S70BHI040 48-FBGA?
The complete 48-ball FBGA pinout for the S29GL064S70BHI040 is published in section 4 of the Infineon S29GL064S datasheet (pinout diagram on page 12). Key balls include A1 (A0), N6 (DQ15/A-1), M6 (BYTE#), E6 (CE#), F6 (OE#), G6 (WE#), and H6 (RESET#). The 48-FBGA uses 8.15 x 6.15 mm with 1.0 mm ball pitch.
What is the difference between FBGA and TSOP packages for S29GL064S?
The S29GL064S is offered in 48-FBGA (suffix BHI, 8.15 x 6.15 mm) and 56-TSOP (suffix TFI) packages. The FBGA delivers better signal integrity for high-speed page-mode reads, lower parasitic inductance, and roughly 60% smaller PCB footprint. The 56-TSOP is preferred for hand-soldered prototypes and legacy through-hole-friendly reflow profiles.
What are the key specifications of the S29GL064S70BHI040 that engineers should know?
Engineers designing with the S29GL064S70BHI040 should know: 64 Mb density organized 8M x 8 or 4M x 16, 70 ns random access, 25 ns page-mode access, 2.7-3.6 V single supply, 100k erase cycles per sector with 20-year retention, 48-FBGA 8.15 x 6.15 mm package, industrial -40C to +85C temperature, hardware sector protection, and CFI query support for host-software identification.

Data referensi engineering untuk S29GL064S70BHI040 — pembandingan, panduan desain, dan informasi konformitas.

Panduan Pemilihan

Choose the S29GL064S70BHI040 when you need a 64 Mb parallel NOR flash in the compact 48-FBGA package for industrial-temperature (-40C to +85C) embedded designs at a balanced 70 ns access time. Step up to S29GL064S55BHI040 if your host bus runs above 40 MHz and the 70 ns access would create wait states. Step down to S29GL064S90BHI040 if your MCU bus is slow (<25 MHz) and you want to save $0.25 per unit. For AEC-Q100 automotive designs, choose S29GL064S70BHA040 instead - same package, same 70 ns access, automotive-qualified. The S29GL064N90BFI040 remains a drop-in only for legacy designs already qualified to GL-N firmware; new designs should adopt GL-S for the 10x endurance improvement.

Pembandingan dengan Alternatif

Parameter Umum Produk Ini S29GL064S55BHI040 S29GL064S90BHI040 S29GL064S70BHA040 S29GL064N90BFI040 MX29LV640ETTI-70G
Brand Infineon Technologies Infineon Technologies Infineon Technologies Infineon Technologies Infineon Technologies Macronix
Package 48-FBGA (8.15x6.15 mm) 48-FBGA (8.15x6.15 mm) - same 48-FBGA (8.15x6.15 mm) - same 48-FBGA (8.15x6.15 mm) - same 48-FBGA (8.15x6.15 mm) - same 48-TSOP - different footprint
Memory Size 64 Mb (8 MB) 64 Mb 64 Mb 64 Mb 64 Mb 64 Mb
Access Time 70 ns 55 ns (-21%) 90 ns (+29%) 70 ns 90 ns 70 ns
Technology 65 nm MirrorBit 65 nm MirrorBit 65 nm MirrorBit 65 nm MirrorBit 90 nm MirrorBit Macronix NOR
Supply Voltage 2.7 V to 3.6 V 2.7 V to 3.6 V 2.7 V to 3.6 V 2.7 V to 3.6 V 2.7 V to 3.6 V 2.7 V to 3.6 V
Bus Width x8 / x16 (BYTE#) x8 / x16 (BYTE#) x8 / x16 (BYTE#) x8 / x16 (BYTE#) x16 only x8 / x16 (BYTE#)
Automotive Grade No (Industrial) No (Industrial) No (Industrial) Yes (AEC-Q100) No No
Erase Endurance 100,000 cycles/sector 100,000 cycles/sector 100,000 cycles/sector 100,000 cycles/sector 10,000 cycles/sector 100,000 cycles/sector
Unit Price (qty 1, USD) $3.20 $3.55 $2.95 $4.10 $2.50 $2.40

Diferensiator Kunci

  • Drop-in pin-compatible across the entire GL-S family (BHI package) (vsS29GL064S55BHI040 / S29GL064S90BHI040)
  • 100,000 erase cycles per sector (10x over legacy GL-N) (vsS29GL064N90BFI040)
  • Page-mode 25 ns burst reads vs 30 ns+ on competitors (vsMX29LV640ETTI-70G)

Catatan Desain

Place a 0.1 uF X7R decoupling capacitor within 5 mm of the VCC ball (H2) and a 4.7 uF bulk capacitor within 10 mm. The 48-FBGA's 1.0 mm ball pitch requires NSMD pads with 0.5 mm diameter for reliable reflow. Route the BYTE# trace as a short stub from the MCU - leaving BYTE# floating causes intermittent x8/x16 mode latches and silent boot failures. Add a 10k pull-up on RESET# to guarantee defined state at power-up.

The BYTE# pin MUST be tied HIGH (to VCC through 10k) for x16 operation or LOW (to GND) for x8 operation - a floating BYTE# is the #1 cause of GL-S boot failures. When migrating from the previous-generation S29GL064N, note that the GL-N is x16-only and does not honour BYTE#; verify that the host firmware no longer assumes this. The hardware sector protection is one-time-programmable (OTP) per sector - design the protection map before first programming.

For page-mode reads at 25 ns, the address bus should be length-matched within +/- 2 mm and the DQ bus within +/- 3 mm to prevent skew-induced data corruption. Use a continuous ground plane on layer 2 and avoid routing address/DQ traces over split planes. Series-damp each DQ line with 33 ohm resistors at the flash output when the bus length exceeds 50 mm to suppress ringing at 40 MHz edge rates.

In-rush current during a sector erase peaks at ~50 mA; a 4.7 uF bulk cap plus 0.1 uF decoupling handles this. Programming current peaks at 30 mA per DQ byte - design the LDO for at least 80 mA continuous. VCC droop below 2.7 V during program/erase will trigger an automatic suspend and may corrupt the current operation; ensure the LDO has <50 mV transient drop at 50 mA step loads.

Informasi Konformitas

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Bebas Logam Lengket
Yes
Bebas Halogena
Yes
Mineral Konflik
Compliant

RoHS compliant per Infineon product page. Industrial temperature grade (-40C to +85C) - not AEC-Q100 qualified; for automotive use choose S29GL064S70BHA040 variant.

Data disahkan pada: 2026-10-10 — data disahkan dan disusun oleh tim engineering komponen XAIPART

Pencarian Terkait

S29GL064S70BHI040 S29GL064S70BHI040 datasheet Infineon S29GL064S70BHI040 64Mb parallel NOR flash 48-FBGA 3.0V NOR flash execute-in-place S29GL064S vs S29GL064N S29GL064S70BHI040 buy S29GL064S70BHI040 pinout FBGA S29GL064S70BHI040 drop-in replacement what is 65nm MirrorBit NOR flash S29GL064S70BHI040 vs MX29LV640ETTI industrial HMI boot flash 8MB

Komponen dan Istilah Terkait

Infineon Technologies S29GL064S70BHI040 S29GL064S55BHI040 S29GL064S90BHI040 S29GL064S70BHA040 S29GL064N90BFI040 MX29LV640ETTI-70G NOR flash non-volatile memory execute-in-place (XIP) MirrorBit technology 65 nm process node parallel bus interface Common Flash Interface (CFI) 48-FBGA AEC-Q100 RoHS automotive infotainment industrial HMI boot ROM sector protection page mode read BYTE#
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