XC3S1500-4FG676C - 1.5M Gate Spartan-3 FPGA | AMD
MPN: XC3S1500-4FG676C ✗ Akhir HidupXC3S1500-4FG676C Ringkasan
A field-programmable gate array is a semiconductor device whose digital circuit is defined after manufacture. The FPGA category sits between fixed-function application-specific integrated circuits and software-programmable processors. Unlike an ASIC, it allows logic, interfaces, and signal-processing functions to be revised without changing the PCB. The Spartan-3 FPGA family targets cost-sensitive embedded, communications, industrial, and test applications where reconfigurability and integration are more important than the absolute performance of the largest programmable-logic devices.
The XC3S1500-4FG676C provides 1,500,000 system gates and 487 I/O in a compact 676-ball BGA. Its 1.2 V core voltage identifies it as a modern FPGA architecture relative to older, higher-voltage programmable devices. The -4 speed designation indicates the device's performance grade, while the commercial -C suffix identifies its intended temperature and product grade. Because the BGA package contains 676 terminals, its PCB layout, assembly process, and inspection requirements require more advanced manufacturing support than a leaded or small-outline package.
Spartan-3 devices support parallel logic implementation, high-speed I/O, internal block memory, and dedicated arithmetic resources for DSP-oriented signal processing. These characteristics make the family suitable for embedded control, data acquisition, communications gateways, industrial monitoring, video processing, and instrument-control systems. Designers should map the required clocking, memory, serial links, and I/O standards before selecting the package, because unused balls do not automatically become available for additional interfaces.
Typical deployments include industrial sensor aggregation, data-acquisition front ends, network protocol conversion, embedded video pipelines, and digital test equipment. The large I/O count can reduce the need for external interface expanders in parallel architectures, while the high logic density allows multiple digital functions to be consolidated into one programmable device.
The principal design consideration is BGA implementation. Use the manufacturer's pinout, recommended power planes, decoupling arrangement, and PCB stack-up guidance, and verify assembly capability with the fabricator before release. Configuration storage, clocking, JTAG access, and I/O voltage planning must also be addressed early because these requirements can affect the supporting circuitry and board-level test strategy.
This product page combines the verified device identity, package information, search-query language, pin-compatible family options, and practical design guidance into one engineering-oriented reference. It is intended to help designers locate the correct datasheet, assess a drop-in replacement, plan the BGA layout, and select the most suitable Spartan-3 device without relying on vague family-level descriptions.
Alternatif penggantian untuk XC3S1500-4FG676C — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian XC3S1500-4FG676C (sama faktor bentuk dan footprint) — berbeda di dalam Speed Grade, Temperature Grade, Package, Product Type, Terminal Count.
XC3S1500-4FG676I
✅ Drop-InKontak untuk harga
Lihat Datasheet →XC3S1500-5FG676C
✅ Drop-InKontak untuk harga
Lihat Datasheet →XC3S1500-4FGG676C
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
XC3S1500-4FGG676I
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
XC3S1500A-4FGG676C
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif referensi (tidak dalam katalog)
XC3S1500-4FG676C Rating Maksimal & Karakteristik Listrik
| Device Type | Spartan-3 field-programmable gate array (FPGA) |
| System Gates | 1,500,000 gates |
| Core Supply Voltage | 1.2 V |
| I/O Count | 487 I/O |
| Paket | 676-ball BGA |
| Package Code | BGA |
| Terminal Count | 676 terminals |
| Package Shape | Square |
| Terminal Form | Ball |
| Speed Grade | -4 speed grade |
| Temperature Grade | Commercial (-C) |
| Tipe Mounting | Surface mount |
XC3S1500-4FG676C square Diamant Konfigurasi Panduan
Konfigurasi pin untuk XC3S1500-4FG676C (square pakai pakai). IC digital ini termasuk GPIO, antarmuka komunikasi (UART, SPI, I2C), dan pin kuasa. Lihat datasheet produsen untuk fungsi pin alternatif dan opsi konfigurasi. Penting untuk desain sistem pengemasan dan PCB.
Tidak ada data diatribut pin yang tersedia untuk XC3S1500-4FG676C.
Lihat ke: datasheet produk untuk konfigurasi pin penuh.
Aplikasi Umum
XC3S1500-4FG676C cocok untuk 6 aplikasis: Industrial Data-Acquisition System, Communications Gateway, Embedded Industrial Control, Digital Signal Processing, Video and Image Processing, Programmable Test and Measurement.
Industrial Data-Acquisition System
The XC3S1500-4FG676C fits industrial data-acquisition systems that combine many parallel sensors with local processing and control. Its 1,500,000 system gates provide substantial programmable logic for channel conditioning, timing, filtering, and protocol handling, while 487 I/O can reduce the need for external I/O expanders. The device operates its core at 1.2 V and is supplied in a 676-ball BGA, allowing high pin density on compact multilayer boards. In a typical arrangement, external transducers feed comparator or ADC stages, while the FPGA handles synchronized sampling control, digital filtering, calibration tables, and communication framing. The -4 speed grade should be checked against the acquisition timing closure. Use the -I grade when the installation requires an industrial temperature range.
Direkomendasikan
Communications Gateway
The XC3S1500-4FG676C is appropriate for a communications gateway that must translate among parallel engines, serial links, and control logic. Its 1,500,000 system gates allow concurrent protocol bridges and packet-processing functions, and its 487 I/O provides flexibility for parallel buses, memory interfaces, and status signals. At a 1.2 V core voltage, the Spartan-3 architecture supports dense digital integration without requiring the resources of a larger FPGA family. A practical design can place the FPGA between network or backplane transceivers and a host processor, using block RAM for packet buffering and dedicated DSP resources for selected filters. Because the package is a 676-ball BGA, signal integrity, power-plane symmetry, and clock routing must be planned alongside the protocol design.
Direkomendasikan
Embedded Industrial Control
The XC3S1500-4FG676C can serve as the central programmable-logic controller in a complex embedded industrial system. Its 1,500,000 system gates are well suited to deterministic sequencing, motor-control supervisory logic, state machines, diagnostics, and safety interlocks, while 487 I/O supports encoders, sensors, actuators, and external memory or bus connections. The device's 1.2 V core and dense 676-ball package allow control logic, communications, and monitoring functions to be consolidated on a high-density board. Designers should establish clock domains, isolation boundaries, and fail-safe behavior before layout, since a programmable logic device does not replace independent hardware protection required for hazardous machinery. Select the industrial -I ordering code when the equipment's temperature range exceeds the commercial -C grade.
Direkomendasikan
Digital Signal Processing
The XC3S1500-4FG676C is suitable for digital signal-processing front ends that combine parallel sampling, filtering, and spectral analysis in one FPGA. The Spartan-3 architecture provides 1,500,000 system gates for parallel arithmetic and control logic, while dedicated DSP resources can accelerate multiply-accumulate operations. Its 487 I/O is useful for connecting multiple converter channels, capture memories, and external processing blocks without excessive multiplexing. A typical front end might digitize sensor or communications signals, perform decimation and windowing in the FPGA, and transfer results to a processor over a parallel interface. Power and timing closure should use the -4 speed grade as a constraint, and the 676-ball package requires careful decoupling, clock distribution, and BGA-aware PCB design.
Direkomendasikan
Video and Image Processing
The XC3S1500-4FG676C can implement parallel video timing, pixel processing, color conversion, and interface adaptation in a Spartan-3 design. Its 1,500,000 system gates accommodate significant pipelines, while 487 I/O supports parallel sensor or display interfaces. The 1.2 V core fits the device into modern multi-rail FPGA power architectures, and the large 676-ball BGA exposes the I/O needed for high-parallelism image paths. In a practical camera or display controller, the FPGA can receive a parallel pixel stream, perform lookup-table or matrix processing, generate timing signals, and pass frames to external memory. Signal-integrity analysis is essential for high-speed pixel buses, so use controlled-impedance routing and follow the manufacturer's BGA layout guidance rather than treating the package as a generic fine-pitch footprint.
Direkomendasikan
Programmable Test and Measurement
The XC3S1500-4FG676C is useful in programmable test equipment where pattern generation, timing control, measurement sequencing, and instrument communication can be consolidated in one FPGA. Its 1,500,000 system gates and 487 I/O support parallel DUT stimulus, response capture, timing generation, and interface multiplexing. The 1.2 V core operation supports modern FPGA power design, while the 676-ball BGA provides extensive connectivity to converters, memory, and host interfaces. A bench instrument can use the FPGA to coordinate acquisition sequences and apply configurable patterns while a processor handles user interface and result storage. Validate timing margins for the target I/O rates and isolate analog measurement paths from the digital core. The -4 grade should be included in the timing-budget review, and manufacturing should confirm X-ray inspection and BGA assembly capability.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk XC3S1500-4FG676C — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | XC3S1500-4FG676I | XC3S1500-5FG676C | XC3S1500-4FGG676C | XC3S1500-4FGG676I | XC3S1500A-4FGG676C |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 676-BGA | 676-BGA | 676-BGA | 676-BGA | 676-BGA | 676-BGA |
| FPGA Family | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 |
| Speed Grade | -4 | -4 | -5 | -4 | -4 | -4 |
| Product Grade | Commercial (-C) | Industrial (-I) | Commercial (-C) | Commercial (-C) | Industrial (-I) | Commercial (-C) |
Diferensiator Kunci
- Commercial-grade option in a high-pin-count Spartan-3 package (vsXC3S1500-4FG676I)
- Lower speed designation supports a defined -4 timing target (vsXC3S1500-5FG676C)
- Exact catalog grade and package combination (vsXC3S1500-4FGG676C)
- Provides 487 I/O for dense parallel interfaces (vsXC3S1500-4FGG676C)
Catatan Desain
Treat the 676-ball BGA as a high-density, board-layout-critical package. Use the manufacturer's ball map and reference stack-up to assign power, ground, configuration, clock, and I/O nets. Keep power and ground planes continuous beneath the device, place decoupling capacitors close to their assigned balls, and maintain the specified via geometry. Do not change pad, mask, or paste layouts without confirming them with the PCB fabricator and assembly house.
Plan clock distribution and high-speed interfaces before finalizing the BGA escape routing. Use the -4 speed designation as a timing constraint, define clock domains explicitly, and apply the manufacturer's guidance for dedicated clock-capable pins. Account for package escape delay and via transitions in simulation rather than assigning ideal timing at the BGA ball. A post-route extraction should include the actual layer stack-up and via models.
Do not substitute the -I grade for the -C grade solely because the package matches. The -I ordering code changes the temperature grade, which can improve industrial suitability but must still be checked against the required operating range, qualification target, and purchasing specification. Similarly, an -5 same-package device should not replace an -4 design without rerunning timing analysis and confirming power behavior for the selected grade.
The 1.2 V core requirement must be separated from the voltage tolerances of the configurable I/O banks. Follow the manufacturer power-up, sequencing, decoupling, and I/O voltage constraints rather than assuming every bank can use the core rail. Validate the complete power tree under the maximum intended clock activity and I/O load, and include adequate local bypass capacitance without creating excessive loop area or inrush during configuration.
Informasi Konformitas
The device is an FPGA rather than an automotive-qualified component, so AEC-Q100 is not applicable. Specific RoHS, REACH, lead-free, halogen-free, and conflict-minerals declarations are not established by the cited product information.