XC3S5000-5FG676C - 5M Gate Spartan-3 FPGA | AMD/Xilinx
MPN: XC3S5000-5FG676C ✓ AktifXC3S5000-5FG676C Ringkasan
A field-programmable gate array, or FPGA, is a programmable semiconductor containing configurable logic blocks, programmable interconnect, input/output resources, and embedded memory. FPGAs belong to the programmable-logic hierarchy, combining digital design flexibility with high-density parallel processing. The Spartan-3 family targets cost-sensitive embedded systems where designers require substantial logic capacity, multiple I/O, and field-updatable configurations without changing the assembled PCB.
The XC3S5000-5FG676C provides 74,880 logic cells, 5 million system gates, and a 725 MHz stated maximum frequency. Its 676-ball package supports a high pin count compared with smaller FPGA packages, making it suitable for designs requiring extensive parallel interfaces. The 90 nm fabrication process and 1.2 V core supply are important for system planning because power dissipation, configuration requirements, and external I/O voltage levels must be evaluated as a complete power architecture.
Its programmable logic can implement control logic, serial and parallel interfaces, protocol bridges, state machines, signal conditioning, and embedded datapaths. Designs can combine multiple fixed-function functions in one device, reducing component count and allowing configuration changes during product maintenance. Because an FPGA is programmed after fabrication, its internal architecture supports field updates, debugging, and product differentiation without physically replacing the IC.
Typical uses include industrial automation, communications equipment, test and measurement systems, embedded control, video processing, and high-density interface aggregation. The large 676-ball package is especially relevant when a design requires many I/O sites or a substantial connector count. A smaller Spartan-3 device may be preferable when the system does not require the XC3S5000's 74,880 logic cells or high pin count.
When designing a board around this FPGA, use the manufacturer datasheet and package documentation to verify every ball assignment, configuration interface, power rail, decoupling requirement, and I/O standard. The 1.2 V core supply and 725 MHz frequency figure describe the device itself, but actual clocking, performance, and power depend on the selected I/O standards, logic utilization, speed grade, configuration method, PCB construction, and thermal design.
This page combines the published XC3S5000-5FG676C specifications, sourcing information, application guidance, and verified same-family alternatives into an engineering-focused reference for FPGA designers and component selectors.
Alternatif penggantian untuk XC3S5000-5FG676C — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
XC3S5000-5FGG676C
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XC3S5000-5FG676C Rating Maksimal & Karakteristik Listrik
| Device Type | FPGA (Field Programmable Gate Array) |
| FPGA Family | Spartan-3 |
| System Gates | 5,000,000 gates |
| Logic Cells | 74,880 cells |
| Logic Blocks | 192 blocks |
| Maximum Stated Frequency | 725 MHz |
| Process Technology | 90 nm |
| Core Supply Voltage | 1.2 V |
| Paket | 676-pin FBGA |
| Number of Terminals | 676 terminals |
| Suhu Kerja | 0°C to 85°C |
| Temperature Range Code | C |
| Speed Grade | 5 |
| Tipe Mounting | Surface Mount |
| Terminal Type | Ball |
| Package Shape | Square |
| Lead-Free Status | Lead Free |
| Programmable Input Count | 489 inputs |
| Programmable Output Count | 489 outputs |
XC3S5000-5FG676C square Diamant Konfigurasi Panduan
Konfigurasi pin untuk XC3S5000-5FG676C (square pakai pakai). IC digital ini termasuk GPIO, antarmuka komunikasi (UART, SPI, I2C), dan pin kuasa. Lihat datasheet produsen untuk fungsi pin alternatif dan opsi konfigurasi. Penting untuk desain sistem pengemasan dan PCB.
Tidak ada data diatribut pin yang tersedia untuk XC3S5000-5FG676C.
Lihat ke: datasheet produk untuk konfigurasi pin penuh.
Aplikasi Umum
XC3S5000-5FG676C cocok untuk 6 aplikasis: Industrial Automation Controller, Telecommunications Data Path, Test and Measurement Instrument, Embedded Video Processing, Network Protocol Bridge, Programmable Logic Control Platform.
Industrial Automation Controller
The XC3S5000-5FG676C fits an industrial automation controller that must coordinate many sensors, actuators, communications ports, and safety interlocks without relying on several discrete controllers. Its 74,880 logic cells and 192 logic blocks provide substantial parallel processing capacity, while the 676-pin FBGA exposes many I/O sites for field-bus interfaces, digital inputs, encoder channels, and motor-control signaling. The 5 MHz-class design environment also supports the published 725 MHz device-speed ceiling when timing closure permits. Configure the FPGA to implement protocol conversion, motion sequencing, diagnostics, and data acquisition concurrently. Use the 0°C to 85°C device range as the baseline and validate the complete controller against the enclosure's worst-case ambient temperature and power conditions.
Direkomendasikan
Telecommunications Data Path
The XC3S5000-5FG676C is appropriate for telecommunications line-card or interface-conversion designs that require parallel packet classification, buffering, and multiple external interfaces. Its 74,880 logic cells allow substantial parallel datapath logic, and the 676-pin FBGA provides enough ball assignments for wide buses, clocks, control signals, and high-speed serial transceiver connections. The 725 MHz stated maximum frequency gives designers a defined performance ceiling for timing analysis on the speed-grade 5 device. Partition the design into separate clock domains, constrain all interface paths, and reserve configuration resources for field updates. The 1.2 V core supply must be generated with clean, stable regulation because logic timing, I/O operation, and system reliability all depend on the quality of that rail.
Direkomendasikan
Test and Measurement Instrument
The XC3S5000-5FG676C can serve as the central acquisition and sequencing engine in a test and measurement instrument requiring dense, deterministic digital control. Its 192 logic blocks and 74,880 logic cells can accommodate parallel data capture, pattern generation, timing control, instrument-bus bridging, and internal processing while the 676-pin FBGA supports numerous test points and external connectors. The speed-grade 5 part and 725 MHz stated frequency support demanding timing blocks, although realized performance depends on routing and the selected I/O standards. Separate acquisition, trigger, and communications logic into reviewed clock domains, then constrain paths according to the manufacturer's timing models. Validate signal integrity at connector and fixture interfaces because the FPGA's processing capability does not remove board-level transmission-line effects.
Direkomendasikan
Embedded Video Processing
The XC3S5000-5FG676C suits embedded video systems that combine pixel-stream processing, graphics timing, memory control, and command interfaces in one programmable component. Its 74,880 logic cells provide a practical balance for parallel pipelines, while 192 logic blocks allow substantial concurrent work without the complexity of a much larger FPGA. The 676-pin FBGA provides extensive connectivity for external memory interfaces, cameras, displays, and control signals. The 725 MHz stated maximum frequency can support pipelined pixel-processing stages when resource sharing and timing closure permit. Use dedicated clocking resources, define separate video and control domains, and keep data buses physically short and properly terminated. Memory interface layout and external trace timing require careful board-level validation.
Direkomendasikan
Network Protocol Bridge
The XC3S5000-5FG676C is suitable for a protocol-bridge design that converts between legacy parallel interfaces, serial links, and network traffic. The device's 74,880 logic cells and 192 logic blocks can support buffering, framing, CRC generation, state machines, and multiple interface domains concurrently. Its high pin count makes it valuable when the bridge requires substantial parallel data capture in addition to a small number of high-speed differential links. The published 725 MHz maximum frequency provides a timing target for the fastest logic, but synchronous interfaces still require clock-domain-crossing and source-synchronous implementation discipline. Establish independent reset domains, constrain all interfaces, and validate congestion on the selected Spartan-3 architecture under the worst-case utilization expected in the final configuration.
Direkomendasikan
Programmable Logic Control Platform
The XC3S5000-5FG676C provides a flexible platform for education, prototyping, and industrial logic-development boards where designers need extensive programmable resources and I/O. Its 74,880 logic cells support meaningful processor, DSP, and interface experiments, while the 676-pin FBGA exposes many user I/O sites for demonstrations and expansion. The 1.2 V core supply and 90 nm process technology define the FPGA power architecture, and the C temperature range covers the 0°C to 85°C commercial operating band. JTAG programming and configuration storage should follow the manufacturer's recommended startup method. Provide accessible expansion connectors, careful decoupling, defined logic levels, and robust power sequencing so that experiments exercise the FPGA rather than inadvertently testing the board's supply integrity.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk XC3S5000-5FG676C — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | XC3S5000-5FGG676C |
|---|---|---|
| Package | 676-pin FBGA | 676-pin FBGA |
| Brand | AMD | AMD |
| FPGA Family | Spartan-3 | Spartan-3 |
| System Gates | 5,000,000 gates | 5,000,000 gates |
| Logic Cells | 74,880 cells | 74,880 cells |
| Maximum Stated Frequency | 725 MHz | 725 MHz |
| Process Technology | 90 nm | 90 nm |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Number of Terminals | 676 terminals | 676 terminals |
Diferensiator Kunci
- Exact-ordering-code identification (vsXC3S5000-5FGG676C)
- High-density programmable capacity (vsXC3S5000-5FGG676C)
- Large parallel-interface package (vsXC3S5000-5FGG676C)
Catatan Desain
Treat the 1.2 V core rail as the foundation of the FPGA power architecture. Use the manufacturer power-supply and decoupling guidance for the exact XC3S5000-5FG676C package, place bulk and high-frequency decoupling close to the device, and verify voltage sequencing against the selected configuration method. Current depends on logic utilization, clocking, I/O activity, and device speed, so calculate the worst-case supply requirement from the relevant power estimator rather than from the nominal 725 MHz speed figure.
The 676-pin FBGA requires deliberate escape routing and multilayer construction. Follow the manufacturer package and board-design guidance for ball-pitch-specific escape geometry, via construction, plane splits, and thermal-via placement. Keep power and ground distribution paths low-impedance, preserve the recommended return path beneath high-speed signals, and validate the selected layer stack with fabrication capabilities before releasing the PCB artwork.
Constrain every external interface against the selected I/O standard, board topology, and source-synchronous timing requirements. The 725 MHz figure describes maximum device operating frequency rather than a guaranteed I/O data rate. Use controlled-impedance routing where required, add series damping only when the interface standard and signal path support it, and verify eye margin, setup, hold, and skew at the connector or memory device rather than relying only on internal FPGA timing reports.
Do not substitute the XC3S5000-5FGG676C solely because both devices use a 676-pin FBGA. Confirm the complete ordering codes, package suffix meaning, temperature grade, electrical limits, configuration interface, and pinout in the manufacturer documentation. Also avoid mixing published system-gate counts with logic-cell counts during resource planning: the Spartan-3 architecture's 74,880 logic cells and 192 logic blocks are the more useful measures for implementation capacity.
Estimate FPGA junction temperature from actual core power, ambient temperature, package thermal characteristics, and PCB copper rather than from clock frequency alone. Activity-dependent power can vary substantially with toggle rate and I/O loading. Provide adequate thermal-via and copper area under the device, account for neighboring heat sources, and validate the assembled product in its enclosure. If the calculated operating margin is narrow, reduce switching activity or improve airflow before relying on the 0°C to 85°C commercial rating.
Informasi Konformitas
The published product information identifies the exact device as lead-free. RoHS, REACH, halogen-free, conflict-minerals, and automotive qualification status are not established for this ordering code. AEC-Q100 is not applicable because the published C suffix denotes the 0°C to 85°C commercial temperature range.