XC6SLX16-3CSG225I - Spartan-6 14,579-LC FPGA | AMD
MPN: XC6SLX16-3CSG225I ✓ AktifXC6SLX16-3CSG225I Ringkasan
A field-programmable gate array is a programmable-logic semiconductor in which digital logic functions are configured after fabrication. An FPGA belongs to the broader hierarchy of programmable logic devices, semiconductor integrated circuits, and digital logic components. Spartan-6 devices combine configurable logic, block RAM, programmable I/O, and dedicated processing resources in a single package, allowing compact implementations of control, interface, signal-processing, and communication systems.
The -3 speed designation identifies the highest-performance Spartan-6 LX speed grade identified in the manufacturer documentation. This device provides 576 kbit of embedded memory, 24 multipliers, and 160 user I/O. Its 225-LFBGA, CSPBGA package supports dense PCB integration, while the lead-free construction and RoHS-compliant status suit current production requirements. The industrial-order suffix distinguishes this ordering option from the commercial-temperature CSG225C version.
Spartan-6 LX architecture is intended for medium-complexity designs where programmable logic offers faster schedule flexibility than a custom ASIC. The 45 nm CMOS process combines configurable logic blocks with dedicated memory and arithmetic resources. A design can use parallel processing paths, serial transceivers, clock-management resources, and programmable I/O blocks without implementing those functions as separate discrete devices.
Typical uses include industrial automation, embedded control, video and image processing, communications infrastructure, instrumentation, and consumer equipment requiring a compact logic platform. The 160-I/O count supports interfaces to external memory, converters, transceivers, and display or sensing hardware, while 576 kbit of block RAM enables packet buffering, data acquisition, and local storage.
PCB implementation requires careful BGA escape routing, uninterrupted supply and ground distribution, and decoupling close to the power balls. Because the -3 grade provides the highest performance in the Spartan-6 LX family, verify timing closure at the intended clock frequency and use the manufacturer pinout and configuration guidance before releasing the board layout.
This product page combines the principal FPGA specifications, package details, ordering-grade differences, and same-footprint alternatives with practical design guidance. It helps engineers distinguish speed-grade, temperature-grade, and package variations before making a production BOM decision.
Alternatif penggantian untuk XC6SLX16-3CSG225I — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian XC6SLX16-3CSG225I (sama faktor bentuk dan footprint) — berbeda di dalam Device Type, Temperature Grade, Package, Speed Grade, Process Technology.
XC6SLX16-3CSG225C
✅ Drop-InKontak untuk harga
Lihat Datasheet →XC6SLX16-2CSG225I
✅ Drop-InKontak untuk harga
Lihat Datasheet →XC6SLX16-2CSG225C
✅ Drop-InKontak untuk harga
Lihat Datasheet →XA6SLX16-3CSG225I
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
XC6SLX16-3CSG225I Rating Maksimal & Karakteristik Listrik
| Device Type | Spartan-6 LX Field-Programmable Gate Array (FPGA) |
| Logic Cells | 14,579 cells |
| Adaptive Logic Modules | 2,278 ALMs |
| Configurable Logic Blocks | 1,139 CLBs |
| User I/O | 160 I/O |
| Embedded Memory | 576 kbit |
| Hardware Multipliers | 24 multipliers |
| Maximum Internal Frequency | 862 MHz |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Paket | 225-LFBGA, CSPBGA |
| Package Body Size | 13 mm × 13 mm |
| Ball Pitch | 0.80 mm |
| Number of Pins or Balls | 225 pins |
| Suhu Kerja | 0°C to 85°C |
| Speed Grade | -3 performance grade |
| Status RoHS | RoHS Compliant |
| Lead-Free Status | Lead Free |
XC6SLX16-3CSG225I 13 mm × 13 mm Diamant Konfigurasi Panduan
Konfigurasi pin untuk XC6SLX16-3CSG225I (13 mm × 13 mm pakai pakai). IC digital ini termasuk GPIO, antarmuka komunikasi (UART, SPI, I2C), dan pin kuasa. Lihat datasheet produsen untuk fungsi pin alternatif dan opsi konfigurasi. Penting untuk desain sistem pengemasan dan PCB.
Tidak ada data diatribut pin yang tersedia untuk XC6SLX16-3CSG225I.
Lihat ke: datasheet produk untuk konfigurasi pin penuh.
Aplikasi Umum
XC6SLX16-3CSG225I cocok untuk 6 aplikasis: Industrial Automation Controller, Video Image Processing, Communications Interface, Data Acquisition and Instrumentation, Embedded Control System, Network Packet Processing.
Industrial Automation Controller
The XC6SLX16-3CSG225I fits compact industrial controllers that combine sequencing, machine I/O, diagnostics, and communications in one programmable device. Its 14,579 logic cells support parallel control logic, while 160 user I/O can connect sensors, actuators, encoders, and field-bus transceivers. The 24 hardware multipliers and 576 kbit of block RAM support motion calculations and local data buffering. Using the -3 grade provides the family’s highest listed performance class for timing-sensitive control loops, while the CSBGA package reduces board area compared with a leaded FPGA.
Direkomendasikan
Video Image Processing
The XC6SLX16-3CSG225I can implement parallel pixel pipelines, color processing, thresholding, and interface bridging in embedded imaging equipment. Its 2,278 adaptive logic modules provide flexible combinational and sequential logic, while 576 kbit of embedded memory supports line buffers and multi-frame processing windows. The 160 I/O allow parallel sensor input, display timing, and control signaling to be integrated without a separate large programmable-logic device. The 225-pin CSBGA also supports dense routing between the FPGA and external memory or image-sensor interfaces.
Direkomendasikan
Communications Interface
The XC6SLX16-3CSG225I is suitable for protocol conversion, packet filtering, framing, and embedded communication gateways. Programmable logic can accelerate parallel-to-serial data handling, while the 160 I/O provide connectivity to transceivers and memory. The device includes 576 kbit of block RAM for packet buffering and 24 multipliers that can support filtering or signal-processing functions. Its maximum listed internal frequency of 862 MHz gives designers substantial timing margin for parallel datapaths, subject to the speed grade selected in the final design.
Direkomendasikan
Data Acquisition and Instrumentation
The XC6SLX16-3CSG225I can coordinate converters, sensors, memory devices, and control outputs in a programmable acquisition system. Its 14,579 logic cells handle channel multiplexing, timing, digital filtering, and status logic, while 576 kbit of embedded RAM supports sample buffering. The 160 available user I/O simplify connections to analog-to-digital and digital-to-analog converters. For laboratory or test equipment, the -3 grade supports demanding parallel data paths, and the compact 225-ball package leaves board space for precision analog circuitry.
Direkomendasikan
Embedded Control System
The XC6SLX16-3CSG225I integrates control logic, memory-intensive state machines, and multiple peripheral interfaces into a compact embedded subsystem. Programmable I/O blocks allow designers to adapt bus widths and timing to external converters, memories, and actuators without relying on a fixed peripheral set. The 24 multipliers support arithmetic in motor, power, or signal-control applications, while 2,278 ALMs provide logic capacity for protocol and sequencing tasks. Its 225-pin CSBGA is particularly useful where component density limits constrain conventional leaded packages.
Direkomendasikan
Network Packet Processing
The XC6SLX16-3CSG225I can serve as a fixed-function network accelerator when a design needs deterministic latency and flexible protocol handling. Parallel logic can perform header inspection, filtering, queuing, and traffic shaping, while 576 kbit of block RAM accommodates packet buffers. The 160 I/O provide direct access to parallel network PHYs or bridge devices, reducing unnecessary external glue logic. Designers should use the -3 speed grade for the most demanding pipelines and validate board-level signal integrity on the compact 0.80 mm-pitch BGA footprint.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk XC6SLX16-3CSG225I — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | XC6SLX16-3CSG225C | XC6SLX16-2CSG225I | XC6SLX16-2CSG225C | XA6SLX16-3CSG225I |
|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD |
| Package | 225-LFBGA, CSPBGA | 225-LFBGA, CSPBGA | 225-LFBGA, CSPBGA | 225-LFBGA, CSPBGA | 225-LFBGA, CSPBGA |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | XA Spartan-6 |
| Speed Grade | -3 | -3 | -2 | -2 | -3 |
| Ordering Grade | Industrial-order suffix I | Commercial-temperature suffix C | Industrial-order suffix I | Commercial-temperature suffix C | XA-family industrial-order suffix I |
| Logic Cells | 14,579 cells | 14,579 cells | 14,579 cells | 14,579 cells | 14,579 cells |
| User I/O | 160 I/O | 160 I/O | 160 I/O | 160 I/O | 160 I/O |
Diferensiator Kunci
- Highest Spartan-6 LX speed-grade option in the matching CSG225 family (vsXC6SLX16-2CSG225I)
- Industrial-order configuration with a direct commercial-temperature counterpart (vsXC6SLX16-3CSG225C)
- Same-footprint option preserves PCB reuse (vsXC6SLX16-2CSG225C)
- Full Spartan-6 LX resource set in a compact package (vsXA6SLX16-3CSG225I)
Catatan Desain
Plan CSG225 escape routing before placing the FPGA. The 225-ball package uses a 0.80 mm ball pitch within a 13 mm × 13 mm body, so power, ground, configuration, clock, and high-speed I/O must fan out across multiple layers. Keep ground planes continuous beneath the device, provide short decoupling connections at the assigned power balls, and avoid voids or splits in the primary power plane.
Do not assume that every XC6SLX16 suffix combination is interchangeable. The -3 and -2 identifiers identify different speed grades, while the final C or I ordering suffix identifies different temperature classes. XC6SLX16-2CSG225I has the same package and logic resources as the target but a lower speed grade. Revalidate timing, I/O standards, power behavior, and environmental requirements after any substitution.
Separate clocks, configuration signals, and sensitive I/O from noisy switching paths during BGA fan-out. Use continuous reference planes and short return paths for clocks, then confirm all external timing constraints in the selected -3 design. After board fabrication, use the AMD boundary-scan or configuration diagnostics appropriate to the device to identify open, shorted, or incorrectly connected BGA nets.
Design the supply network around the package-specific power and ground-ball assignments in the AMD documentation. Place required bulk and high-frequency decoupling capacitance close to the relevant balls, maintain low-impedance distribution paths, and account for the simultaneous switching demand of the configurable logic, block RAM, and I/O activity. Validate the assembled board across speed and temperature corners rather than estimating the result from logic utilization alone.
Informasi Konformitas
RoHS Compliant and Lead Free are stated in the product and comparison information. REACH, halogen-free, and conflict-minerals status were not stated. AEC-Q100 is not applicable to the standard Spartan-6 LX ordering option.
