SS24-0B00-02
SS24-0B00-02 - 104-Lane PCIe 5.0 Switch | Broadcom PEX89000
The Broadcom SS24-0B00-02 is a 104-lane PCI Express 5.0 switch based on the Broadcom / Avago PEX89104B0-2-DB device, designed as an integrated, multi-function PCI Interface IC for high-performance server, storage, and accelerator fabrics. It is sold as a specialized PCI Interface component and serves as the silicon core used in Broadcom PEX89000-series evaluation boards and OEM modules. The part operates as a fan-out switching element with internal non-transparent and transparent bridge capability, enabling multi-host and domain partitioning topologies required by modern disaggregated compute designs.
A PCI Express switch is a hot-pluggable, packet-routing device that sits between a root complex and one or more endpoints (or additional switches), forwarding Transaction Layer packets according to PCIe routing rules. SS24-0B00-02 belongs to the hierarchical product family PCIe switch -> PCI bridge / switch -> PCI Express switch -> peripheral / interface IC, and ultimately to integrated circuits -> specialized / interface ICs. The PCIe 5.0 specification doubles the per-lane signaling rate to 32 GT/s compared with PCIe 4.0, doubling bandwidth to roughly 3.94 GB/s per direction per lane. By aggregating 104 lanes, the switch can deliver multi-terabit fabric throughput and is engineered to support the higher port counts demanded by NVMe-oF, CXL-attached memory pools, and heterogeneous AI/GPU compute racks.
Key features of the SS24-0B00-02 include PCIe 5.0 compliance with backward support for PCIe 4.0/3.0 devices, a 104-lane configuration organized into multiple ports, advanced error reporting and AER support, hot-plug readiness, NVMe and CXL-aware QoS structures, and support for SR-IOV and multiple function hierarchies. The silicon also includes Enhanced Hot-Plug controllers, ECRC, Poisoned TLP handling, and Advanced Power Management (ASPM L0s/L1/L2) capabilities typical of the PEX89000 generation.
Architecturally, the device integrates SerDes blocks capable of PCIe 5.0 long-reach signaling, a non-blocking internal switch fabric with credit-based flow control, and embedded MCUs for I2C/SMBus manageability. The silicon targets enterprise servers, NVMe SSD arrays, GPU/CPU accelerator backplanes, and composable infrastructure platforms, where it typically appears as a stand-up PCIe card or a BGA-mounted mezzanine.
Typical applications include high-port-count NVMe-oF SSD backplanes, disaggregated CXL memory pools, AI training cluster fabric switches, hyperscale accelerator baseboards, and high-speed test & measurement PCIe capture cards. When integrating this part, designers must follow Broadcom's reference layout for the BGA-EP package, manage the multi-rail power-up sequence, and provide sufficient airflow to dissipate the high SerDes power at PCIe 5.0 data rates.
Engineers typically source the SS24-0B00-02 from authorized distributors such as DigiKey, Mouser, and Avnet Americas for new designs; later-stage replacement is sometimes supported by Broadcom via the cross-reference SS26-0B00-02 (60V equivalent) for higher-voltage tolerance retrofit programs.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
USD $825.00
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