STA339BWTR
STA339BWTR - 2.1-Channel Digital Audio System | STMicroelectronics
The STMicroelectronics STA339BWTR is a 2.1-channel high-efficiency digital audio system with integrated digital audio processing, digital amplifier control, and an FFX power output stage. It supports a 26 V operating supply range, has a 30 V absolute maximum supply rating, and is supplied in a 36-FSOP surface-mount package with an exposed pad. The device provides multiple power-output configurations, including two channels of ternary PWM in stereo mode and operation as three channels in a 2.1-channel system.
A digital audio system is an integrated audio signal-chain IC that processes digital audio, controls amplification, and delivers power through an efficient output stage. Within the broader hierarchy, the STA339BWTR belongs to the digital amplifier class, which combines a digital signal processor, power-control logic, and speaker-drive circuitry in one package. Its FFX architecture is designed to provide high-quality, high-efficiency, all-digital amplification for compact audio products.
Key features include a wide 26 V operating supply range, a 30 V absolute maximum rating, integrated digital audio processing, digital amplifier control, and an FFX power output stage. The FFX implementation supports ternary PWM output configurations for stereo or 2.1-channel operation. The manufacturer describes the STA339BW as a high-power single-chip solution intended to reduce the number of discrete components required in powered speaker systems.
The device accepts digital audio information and uses its integrated processing and control functions to manage the amplifier channels. According to the manufacturer datasheet, specifications are evaluated under defined conditions including VCC = 18 V, 1 kHz signal frequency, 384 kHz switching frequency, 25°C ambient temperature, and an 8 ohm load unless otherwise specified. These conditions provide the reference point for interpreting the electrical and performance data.
Typical applications include active speaker systems, compact consumer-audio products, sound bars, smart speakers, multimedia equipment, and other 2.1-channel installations where an integrated digital amplifier simplifies the signal path. The exposed-pad package also requires careful PCB layout for heat transfer from the power stage to the board copper.
Designers should follow the manufacturer datasheet for decoupling, output filtering, thermal management, exposed-pad soldering, and loudspeaker-load requirements. In particular, the power-output configuration must be selected for the intended channel count and speaker impedance, and the PCB must provide adequate thermal copper around the exposed pad. Verify maximum supply voltage, current, and thermal limits against the selected operating mode.
This page consolidates the verified manufacturer and distributor information, practical package and thermal guidance, pricing references, and a structured comparison of the available drop-in candidates. It is intended to help engineers confirm footprint, supply, power-output, and sourcing requirements before committing to a board design.
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