5CSXFC5C6U23C6N
5CSXFC5C6U23C6N - Cyclone V SX SoC FPGA, 85K LE, Dual ARM Cortex-A9 | Intel
The Intel (formerly Altera) 5CSXFC5C6U23C6N is a Cyclone V SX family System-on-Chip (SoC) FPGA integrating a hard dual-core ARM Cortex-A9 MPCore processor subsystem with CoreSight debug and an 85K logic-element FPGA fabric, housed in a 672-pin UBGA (23x23 mm) package. The device combines up to 925 MHz HPS CPU performance with 85,000 logic elements, 32,070 adaptive logic modules (ALMs), 3.88 Mbit embedded memory, and 145 user I/Os, optimized for low-power, cost-sensitive embedded applications.
A SoC FPGA is a heterogeneous computing device that merges a general-purpose application processor subsystem (the Hard Processor System, or HPS) with a programmable FPGA fabric on a single die. The HPS typically runs an OS such as Linux, VxWorks, or RTOS, while the FPGA fabric accelerates custom logic, DSP, or high-bandwidth I/O. Compared with a discrete CPU-plus-FPGA two-chip solution, a SoC FPGA reduces board area, simplifies the high-speed interconnect (in this case AXI/ACP), lowers BOM cost, and enables tighter latency between software tasks and hardware accelerators.
Key features of this part include the dual ARM Cortex-A9 cores with NEON media engine and single/double-precision FPU, 32 KB of L1 instruction and 32 KB of L1 data cache per core, hardware floating-point support, and integrated CoreSight trace. The FPGA side delivers 85K logic elements, 3.88 Mbit of embedded SRAM, dedicated 18x18 multipliers for DSP, and 145 general-purpose I/Os. The 'C6' speed grade targets commercial temperature operation at -0C to +85C, and '6' denotes the logic and HPS performance bin.
Architecturally, the Cyclone V SX device uses TSMC's 28 nm low-power process, which enables a static power envelope typically 40% lower than the previous Cyclone IV generation. The HPS-to-FPGA interface is implemented through a high-bandwidth AXI-64 coherent bus bridge (ACP) that allows L2 cache-coherent DMA between CPU and FPGA logic, eliminating the need for external FIFOs in many data-movement workloads. The device also integrates hardened memory controllers (LPDDR2, DDR3), PCIe Gen2, Gigabit Ethernet MAC, USB 2.0, and a NAND/SD/eMMC controller inside the HPS block.
Typical applications include industrial motor control, factory automation controllers, machine vision pre-processing, smart-grid measurement hardware, secure payment terminals, and embedded vision/AI edge nodes. The combination of a deterministic real-time OS on the HPS with custom parallel pipelines in the FPGA fabric makes this part especially attractive for protocols such as EtherCAT, PROFINET, EtherNet/IP, and SERCOS-III master implementations, where deterministic cycle times under 100 microseconds are required.
A key design consideration for engineers is that the 672-UBGA package has 0.8 mm ball pitch and demands PCB stack-up with impedance-controlled HPS traces (typically 4-layer minimum with 100-ohm differential pairs for RGMII and 90-ohm for USB). Designers should also plan for the boot configuration source (NAND, SD/eMMC, or QSPI) and provision for the dedicated HPS clock pin to avoid jitter-related DDR3 margin loss.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving procurement, hardware, and embedded engineers a single source for parametric, application, and supply-chain decision-making.
USD $175.00
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