5CSXFC4C6U23I7LN - Cyclone V SX SoC FPGA 40K LE Dual ARM Cortex-A9 925MHz 672-UBGA | Altera
部品番号: 5CSXFC4C6U23I7LN ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $462 | $462.00 |
| 10 | $438.9 | $4,389.00 |
| 100 | $393.55 | $39,355.00 |
| 500 | $354.2 | $177,100.00 |
| 1,000 | $312.4 | $312,400.00 |
5CSXFC4C6U23I7LN 概要
A System-on-Chip FPGA combines a hard ARM Cortex-A9 application processor subsystem (HPS) with programmable FPGA logic on a single die. The HPS section includes dual ARM Cortex-A9 cores, Level 2 cache, integrated SDRAM controller, and a rich peripheral set (USB, Ethernet, CAN, UART, SPI, I2C), while the FPGA fabric implements customer-defined accelerators and I/O protocols. The HPS-to-FPGA bridges enable high-throughput on-chip data movement between hard CPU cores and custom logic, which is why SoC FPGAs are widely used in industrial vision, motor control, and protocol bridging.
Key features include integrated transceivers up to 5 Gbps supporting PCIe Gen2 and multiple CPRI data rates, variable-precision DSP blocks for signal processing, dedicated memory controller hard IP, and on-chip Phase-Locked Loops for clock management. The device supports LPDDR2, DDR2, and DDR3 SDRAM interfaces through the HPS and FPGA I/O. Industrial temperature range -40C to +100C is provided by the I7 speed grade with industrial suffix.
Typical applications include industrial motor drives, programmable logic controllers, machine vision, software-defined radio front ends, and military/aerospace signal processing where deterministic latency and parallel processing are required. The SoC architecture eliminates the need for a separate processor MCU on the board.
Design consideration: the 672-UBGA package requires multi-layer PCB with high-density escape routing; thermal dissipation under heavy HPS and fabric utilization should be validated using the Altera PowerPlay early power estimator. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone datasheet.
ドロップイン代替品: 5CSXFC4C6U23I7LN — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 5CSXFC4C6U23I7LN （同一形状・フットプリント） — 相違点: Package, Transceivers, Logic Elements, DSP Blocks, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
5CSXFC4C6U23C8N
✅ ドロップイン✓ 在庫あり
$90 / 個
データシートを見る →5CSXFC4C6U23C7N
✅ ドロップイン✓ 在庫あり
$64.95 / 個
データシートを見る →5CSXFC4C6U23C6N
✅ ドロップイン✓ 在庫あり
$215.4 / 個
データシートを見る →5CSXFC4C6U23A7N
✅ ドロップイン✓ 在庫あり
$136.24 / 個
データシートを見る →5CSXFC2C6U23I7N
✅ ドロップイン✓ 在庫あり
$285 / 個
データシートを見る →5CSXFC2C6U23I7LN
✅ ドロップイン✓ 在庫あり
$198 / 個
データシートを見る →5CSXFC4C6U23I7LN 最大定格＆電気的特性
| Family | Cyclone V SX SoC FPGA |
| Device Variant | 5CSXFC4 (U23 package code) |
| Logic Elements | 40,000 |
| Processor Cores | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Processor Clock | 925 MHz |
| Process Technology | 28 nm low-power |
| パッケージ | 672-ball UBGA (23x23 mm) |
| 動作温度 | -40C to +100C (Industrial) |
| Speed Grade | I7 |
| Transceivers | Integrated high-speed transceivers (PCIe Gen2 capable) |
| 実装タイプ | Surface Mount (BGA) |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
5CSXFC4C6U23I7LN 672-ball ubga (23x23 mm) ピン配置ガイド
5CSXFC4C6U23I7LN (672-ball ubga (23x23 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 5CSXFC4C6U23I7LN.
詳細は データシート をご参照ください。
主な用途
5CSXFC4C6U23I7LN の用途: 7 件s: Industrial Motor Control and Drives, Machine Vision and Industrial Imaging, Software Defined Radio Front End, Programmable Logic Controller (PLC) and PAC, Automotive Driver Assistance and Telematics, Medical Imaging and Diagnostic Equipment, Military and Aerospace Signal Processing.
Industrial Motor Control and Drives
The 5CSXFC4C6U23I7LN is well suited for multi-axis industrial motor drives and servo controllers. The dual ARM Cortex-A9 at 925 MHz executes real-time control loops (FOC, PI, space-vector) and industrial Ethernet protocols (EtherCAT, PROFINET, EtherNet/IP), while the 40K-LE FPGA fabric implements parallel multi-axis PWM generation, encoder interfaces (EnDat, BISS, SSI), and safety logic. The industrial -40C to +100C temperature grade allows deployment directly inside factory cabinets, and the integrated HPS eliminates a separate MCU. Unlike discrete MCU+FPGA solutions, the SoC architecture reduces board area by roughly 30% and removes a chip-to-chip interconnect bottleneck.
おすすめ
Machine Vision and Industrial Imaging
In machine vision systems, the 5CSXFC4C6U23I7LN combines FPGA-based image pre-processing with ARM Cortex-A9 application-level inference. The FPGA fabric ingests MIPI CSI-2 or LVDS camera streams at gigabit rates and applies real-time filtering, edge detection, or histogram equalization, while the dual ARM Cortex-A9 runs OpenCV or a quantized CNN for classification. The 925 MHz HPS clock supports Linux with PREEMPT-RT for deterministic frame timing. Compared with discrete processor+FPGA designs, the SoC's shared DDR3 controller eliminates frame-copy latency, achieving end-to-end latency below 5 ms in typical 720p pipelines.
おすすめ
Software Defined Radio Front End
The 5CSXFC4C6U23I7LN's integrated high-speed transceivers up to 5 Gbps and variable-precision DSP blocks make it a strong fit for SDR baseband processing. The FPGA fabric implements DDC/DUC, channelization filters, and digital predistortion, while the dual ARM Cortex-A9 at 925 MHz handles waveform stack execution and network interfaces. The industrial -40C to +100C rating supports outdoor deployment in small-cell and tactical radio enclosures. Versus a pure-FPGA SDR, the SoC eliminates an external CPU module, reducing BOM cost and enabling single-board radio designs.
おすすめ
Programmable Logic Controller (PLC) and PAC
Used as the central controller in PLCs and PACs, the 5CSXFC4C6U23I7LN provides deterministic scan-time execution. The dual ARM Cortex-A9 at 925 MHz runs the IEC 61131-3 runtime (CODESYS, Beremiz), HMI graphics, and fieldbus masters, while the 40K-LE FPGA fabric implements high-speed counters, PWM outputs, and proprietary protocol stacks. The integrated HPS peripherals (USB, Ethernet, CAN, SPI) directly interface with industrial I/O modules. The 672-UBGA package allows compact DIN-rail mounted controllers with full feature density.
おすすめ
Automotive Driver Assistance and Telematics
For ADAS sensor fusion and telematics, the 5CSXFC4C6U23I7LN's dual ARM Cortex-A9 MPCore fuses data from multiple cameras and radar sensors, while the FPGA fabric runs preprocessing pipelines at low latency. The integrated PCIe Gen2-capable transceivers link to external radar MMICs, and the HPS Ethernet MACs connect to vehicle networks (100BASE-T1, CAN-FD). Designers needing AEC-Q100 qualification should select the 5CSXFC4C6U23A7N variant (same silicon, automotive qualification). The SoC approach reduces ECU size compared with discrete MCU+FPGA boards.
おすすめ
Medical Imaging and Diagnostic Equipment
The 5CSXFC4C6U23I7LN serves in ultrasound, endoscopy, and patient monitoring systems where parallel signal processing and a managed application processor are both required. The FPGA fabric handles beamforming in ultrasound probes and video preprocessing in endoscopy at deterministic frame rates, while the dual ARM Cortex-A9 at 925 MHz runs the Linux-based UI stack, network protocol (DICOM), and user interaction. The industrial -40C to +100C temperature range supports use in operating-room and field-deployed carts. SoC integration simplifies IEC 62304 software certification by reducing inter-processor interface code.
おすすめ
Military and Aerospace Signal Processing
The 5CSXFC4C6U23I7LN's combination of HPS, FPGA fabric, and integrated transceivers supports ruggedized defense electronics including electronic warfare subsystems, radar pre-processors, and secure communications. The dual ARM Cortex-A9 executes trusted operating systems (VxWorks, INTEGRITY) and crypto stacks, while the FPGA fabric performs high-throughput digital signal processing. The industrial -40C to +100C temperature range supports many ground-mobile and avionics applications; for full MIL-spec temperature range, the device is qualified for extended screening. SoC consolidation reduces SWaP-C in size-constrained platforms.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 5CSXFC4C6U23I7LN — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 5CSXFC4C6U23C8N | 5CSXFC4C6U23C7N | 5CSXFC4C6U23C6N | 5CSXFC4C6U23A7N | 5CSXFC2C6U23I7N | 5CSXFC2C6U23I7LN |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 672-ball UBGA (23x23 mm) | 672-ball UBGA (23x23 mm) - same | 672-ball UBGA (23x23 mm) - same | 672-ball UBGA (23x23 mm) - same | 672-ball UBGA (23x23 mm) - same | 672-ball UBGA (23x23 mm) - same | 672-ball UBGA (23x23 mm) - same |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 40,000 | 25,000 (-37.5%) | 25,000 (-37.5%) |
| Processor Cores | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Max HPS Clock | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz |
| Speed Grade | I7 (industrial) | C8 (commercial) | C7 (commercial) | C6 (commercial) | A7 (automotive) | I7 (industrial) | I7 (industrial) |
| Operating Temperature | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +125C | -40C to +100C | -40C to +100C |
| Lead-Free / RoHS | Yes / Compliant | Yes / Compliant | Yes / Compliant | Yes / Compliant | Yes / Compliant | Yes / Compliant | Yes / Compliant |
| Approx. Unit Price (qty 1) | $462.00 | ~$385 | ~$390 | ~$400 | ~$520 | ~$330 | ~$340 |
主な差別化要因
- Industrial temperature range with high-speed transceivers （vs 5CSEBA6U23I7N)
- 40K logic elements vs lower-density same-family option （vs 5CSXFC2C6U23I7N)
- Drop-in industrial speed grade availability （vs 5CSXFC4C6U23C8N)
設計ノート
The 672-ball UBGA package has a 0.8 mm ball pitch. PCB design requires HDI microvia stack-up with at least 4-6 layers. Use 1 oz copper on outer layers for signal and power. Fanout from BGA must escape through inner microvia layers; allow 2-3 mm breakout channel between BGA and adjacent components. Matched-length routing is required for DDR3/LPDDR2 interfaces between HPS and external SDRAM. Refer to Altera's Cyclone V SX Device Family Pin Connection Guidelines for ball-map-specific length matching tolerances.
The 5CSXFC4C6U23I7LN requires multiple voltage rails: 0.95V VCC for core, 1.5V/1.8V DDR supply for HPS DRAM interface, 2.5V/3.3V for FPGA I/O banks, and 1.1V for transceiver PMA. Use Altera's recommended power sequencing (VCC_CORE before VCCIO) to avoid latch-up. Decoupling: place 0.1uF X7R ceramic bypass within 100 mil of each VCC pin, plus bulk 47uF/100uF polymer caps near the device. Use the Altera PowerPlay Early Power Estimator to size the regulator current budget before PCB layout.
The 672-UBGA U23 package has a theta_JA of approximately 12-15 C/W with proper PCB thermal via array under the exposed pad. Use a 6x6 grid of thermal vias (0.3 mm drill, 0.5 mm pad) under the package thermal pad, connecting to internal ground planes. At full HPS utilization (925 MHz, both cores active) and 80% FPGA utilization, total power can reach 5-7W; a thermal copper pour of at least 4 square inches on top/bottom layers is recommended. Use the Altera thermal estimator to verify junction temperature stays below 100C for industrial-grade operation.
Do not confuse the SX (with transceivers) variant with the SE (no transceivers) variant - they share ballmaps but the transceiver balls on SE are no-connects. When migrating from 5CSEBA6 to 5CSXFC4, ensure your PCB design includes the transceiver power rails (VCCR, VCCT, VCCA) and AC-coupling capacitors on serial links. Also verify that your configuration scheme (EPCQ or JTAG) is compatible with the SX variant - some legacy configuration bitstreams need re-generation after speed-grade changes.
コンプライアンス情報
RoHS and lead-free compliance confirmed by Altera/Intel product page and distributor listings. The I7N part is industrial-grade (-40C to +100C) but NOT AEC-Q100 qualified; for AEC-Q100 automotive qualification, select the A7 speed grade variant 5CSXFC4C6U23A7N. Halogen-free status not explicitly stated in the verified data.
