製品 (32761)

A3P030-2QNG48I - ProASIC3 Flash FPGA 30K Gates | Microchip
A3P030-2QNG48I

A3P030-2QNG48I - ProASIC3 Flash FPGA 30K Gates | Microchip

The Microchip Technology (Microsemi) A3P030-2QNG48I is a flash-based ProASIC3 FPGA offering 30K system gates, 330 logic elements (VersaTiles), and 34 user I/Os in a 48-pin VFQFN exposed-pad (QNG48) package, rated for industrial temperatures of -40C to +85C with speed grade 2. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory rather than an external configuration ROM. Within the programmable logic hierarchy, the A3P030 sits at the low end of the FPGA family tree, below mid-density and high-density FPGAs and far above simple CPLDs, making it a single-chip, low-cost programmable solution for glue logic, control, and interface bridging tasks. Key features include instant-on, live-at-power-up operation because the flash fabric is inherently non-volatile, eliminating the external boot device required by SRAM FPGAs. The 1.5V core with 130nm flash process delivers up to 310 MHz internal system performance, while the small 7x7 mm QFN footprint suits space-constrained boards. Security features protect the design from readback, and full reprogrammability supports in-field updates. The ProASIC3 architecture uses a Sea-of-Tiles fabric of VersaTiles, each configurable as logic, arithmetic, or memory elements, connected through a hierarchical routing structure. Embedded flash and optional soft ARM support extend capability beyond pure glue logic. I/O banks support popular single-ended standards, and the fabric is qualified across industrial temperature ranges. Typical applications include portable and handheld instrument control logic, industrial automation interface bridging, power-on sequencing and system supervision, and replacement of multiple discrete ASSP or CPLD devices in cost-sensitive designs where a single-chip flash FPGA reduces total cost of ownership. Design consideration: plan 1.5V core supply sequencing and adequate QFN thermal/electrical grounding through the exposed pad, and verify I/O bank voltage assignment in Libero SoC before board layout. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, with pricing referenced as of 2026-08-31.

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A3P030-2QNG68 - ProASIC3 FPGA 30K Gates 68-QFN | Microchip
A3P030-2QNG68

A3P030-2QNG68 - ProASIC3 FPGA 30K Gates 68-QFN | Microchip

The Microchip (Microsemi/Actel) A3P030-2QNG68 is a ProASIC3 flash-based FPGA with 30K system gates, 310 MHz system performance, 49 user I/O, and 1.5V core operation, housed in a 68-pin VFQFN exposed-pad package. The -2 speed grade and flash programming fabric make it a single-chip, non-volatile solution for low-density logic integration. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash cells rather than an external configuration device. Within the programmable logic hierarchy, the ProASIC3 family sits under Microchip's low-density, non-volatile FPGA portfolio, positioning it above CPLDs in gate capacity while avoiding the configuration PROM required by SRAM FPGAs. Key features include 30,000 system gates (330 logic elements per distributor listings), 310 MHz maximum system performance in the -2 speed grade, single 1.5V core supply, and instant-on operation because configuration data resides in on-chip flash. The 68-VFQFN exposed-pad package (7x7 mm class) provides a small footprint with thermal dissipation through the pad, and 49 user I/O support both 3.3V and lower-voltage I/O banks for mixed-voltage board designs. Technologically, ProASIC3 uses a 130nm flash process with fine-grained VersTile logic architecture. Because the fabric is live at power-up, designs requiring immediate control-plane or glue-logic function do not need a host microcontroller to load bitstreams, improving system reliability and boot behavior versus SRAM-based FPGAs. Reprogrammability in-system supports field updates without changing hardware. Typical applications include industrial control and automation glue logic, portable and space-constrained consumer designs, power sequencing and reset management, bridge and interface conversion, and secure single-chip designs where bitstream external storage is undesirable. Design considerations: the 1.5V core rail must be sequenced and decoupled per the manufacturer datasheet, and the exposed pad must be soldered to a grounded thermal land for reliable operation. Verify I/O bank voltage assignments before layout because QFN pinout is fixed. This page synthesizes distributor pricing, drop-in alternatives, engineering design notes, and sourcing data not found in the manufacturer datasheet.

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A3P030-2QNG68I - ProASIC3 Flash FPGA 30K Gates | Microchip
A3P030-2QNG68I

A3P030-2QNG68I - ProASIC3 Flash FPGA 30K Gates | Microchip

The Microchip (Actel/Microsemi) A3P030-2QNG68I is a ProASIC3 flash-based FPGA delivering 30,000 system gates, 49 user I/Os, and up to 310 MHz system performance in a 68-pin VFQFN exposed-pad package operating from a 1.5V core supply. Manufactured on a 130nm flash process, it is an industrial-temperature (I suffix) grade-2 speed device. A flash-based FPGA is a type of field-programmable gate array that stores its configuration in on-chip flash memory cells rather than volatile SRAM. This places the ProASIC3 family in the broader hierarchy of programmable logic: FPGA -> programmable logic device -> digital IC -> semiconductor. Because configuration is non-volatile, the device powers up instantly without an external configuration PROM or boot controller, making it a single-chip solution for space-constrained systems. Key features include 330 logic elements (LEs), flash-based LiveField reprogrammability, single-supply 1.5V core operation, small-footprint VFQFN packaging, and optional soft ARM support as noted in the ProASIC3 family datasheet. The ultra-low-density class of the device targets glue logic, control-plane functions, and power-up sequencing tasks that previously used CPLDs or discrete logic. Technically, the A3P030 uses Actel's proprietary flash switch technology, which combines the non-volatility of antifuse devices with the reprogrammability of SRAM FPGAs. The 130nm process yields low static power, and the exposed-pad QFN provides good thermal and ground performance for a small 8x8 mm-class footprint. Typical applications include industrial automation control, portable and battery-powered instruments, bridge logic between processors and peripherals, power sequencing controllers, and secure single-chip logic where bitstream volatility would be a liability. A key design consideration is I/O budget: with only 49 user I/Os available in the 68-pin package, pin mapping should be validated early in Libero SoC before routing commitment. This page synthesizes distributor availability, drop-in family alternatives, and practical design notes not consolidated in the manufacturer datasheet.

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A3P030-2VQG100I - ProASIC3 FPGA, 30K Gates | Microchip
A3P030-2VQG100I

A3P030-2VQG100I - ProASIC3 FPGA, 30K Gates | Microchip

The Microchip Technology A3P030-2VQG100I is a low-density flash-based FPGA from the ProASIC3 family, offering 30,000 system gates, 330 logic elements, and 77 user I/Os in a 100-pin VQFP package. It operates from a 1.5V core supply and supports system performance up to 310 MHz, making it a single-chip, reprogrammable solution for cost-sensitive applications. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement arbitrary digital logic functions. Unlike fixed-function ASICs, FPGAs contain programmable logic blocks and interconnects that can be reconfigured to implement complex digital systems. The ProASIC3 family uses flash-based configuration, which retains the design even when power is removed, providing instant-on capability and inherent security against reverse engineering. Key features of the A3P030-2VQG100I include 30K system gates, 330 logic elements, 77 user I/Os, and a 1.5V core voltage. The device supports up to 310 MHz system performance and is offered in a 100-pin VQFP package with 0.5mm pitch. It is lead-free and RoHS compliant, with an operating temperature range of -40°C to +85°C, making it suitable for industrial environments. The ProASIC3 architecture is based on a flash-based switch fabric that provides non-volatile, low-power operation. Unlike SRAM-based FPGAs, it does not require an external configuration device, reducing system cost and board space. The device also includes advanced features such as clock conditioning, PLLs, and support for multiple I/O standards, enabling flexible system integration. Typical applications include industrial control, automotive electronics, communications infrastructure, and consumer electronics. The low density and small footprint make it ideal for glue logic, bus interfacing, and control applications where a full-sized FPGA would be overkill. The 77 I/Os provide ample connectivity for peripheral interfaces. When designing with this device, ensure proper decoupling of the 1.5V core supply and follow the recommended power-up sequencing. The flash-based configuration eliminates the need for external boot memory, simplifying the design and reducing BOM cost. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P030-2VQG100I.

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A3P030-QNG48I - 30K Gate ProASIC3 FPGA | Microchip
A3P030-QNG48I

A3P030-QNG48I - 30K Gate ProASIC3 FPGA | Microchip

The Microchip A3P030-QNG48I is a low-density, flash-based FPGA from the ProASIC3 family, offering 30,000 system gates and 34 user I/Os in a 48-pin QFN package. It operates over the industrial temperature range of -40°C to +100°C and supports core voltages of 1.5V, making it suitable for a wide range of embedded applications. An FPGA (Field-Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. Unlike fixed-function ASICs, FPGAs offer reprogrammability, allowing designers to iterate on designs without costly mask changes. The ProASIC3 family is known for its flash-based configuration, which provides instant-on capability, low power consumption, and high security against reverse engineering. Key features of the A3P030-QNG48I include 30,000 system gates, 34 user I/Os, and support for multiple I/O standards including LVCMOS, LVTTL, and PCI. It also features 1 kbit of FlashROM for non-volatile storage, an on-chip PLL for clock management, and a JTAG interface for programming and boundary-scan testing. The device is RoHS compliant and lead-free, meeting modern environmental standards. Technically, the ProASIC3 architecture uses a flash-based switch matrix that retains configuration data even when power is removed, eliminating the need for external configuration memory. This results in a single-chip solution with instant-on operation and enhanced security. The device also includes an internal charge pump to support programming, and its low power consumption makes it ideal for battery-powered applications. Typical applications include industrial control systems, automotive electronics, consumer devices, and communication interfaces. The A3P030-QNG48I is particularly suited for glue logic, bus interfacing, and custom peripheral expansion in space-constrained designs. When designing with this FPGA, ensure proper decoupling of the core and I/O power supplies, and follow the recommended programming and configuration guidelines in the datasheet. The device supports in-system programming via JTAG, simplifying firmware updates in the field. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3P030-QNG48I.

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A3P060-1FG144T - ProASIC3 FPGA, 60K Gates | Microchip
A3P060-1FG144T

A3P060-1FG144T - ProASIC3 FPGA, 60K Gates | Microchip

The Microchip Technology A3P060-1FG144T is a flash-based FPGA from the ProASIC3 family, offering 60,000 system gates, 272 MHz maximum internal frequency, and 1.5 V core voltage, housed in a 144-pin FBGA package. It is designed for automotive applications, supporting junction temperatures up to 135°C and providing a single-chip, reprogrammable solution with low total cost of ownership. An FPGA (Field-Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. Unlike ASICs, FPGAs are reprogrammable, allowing design changes without costly mask revisions. The ProASIC3 family uses flash-based configuration, which retains the program even when power is removed, offering instant-on operation and enhanced security compared to SRAM-based FPGAs. Key features include 60K system gates, 272 MHz system performance, 1.5 V core voltage support for 1.5-V-only systems, low-impedance flash switches, and segmented hierarchical routing. The device also features high-performance, low-skew global networks, and is available in automotive grade with PPAP documentation. Its flash-based architecture provides inherent security against reverse engineering and supports live updates. The A3P060-1FG144T is built on 130 nm flash technology, offering a balance of low power consumption and high performance. The 144-pin FBGA package provides a compact footprint suitable for space-constrained automotive electronics. The device supports multiple I/O standards and includes programmable I/O with various drive strengths and slew rates. Typical applications include automotive body electronics, motor control, infotainment systems, and industrial automation. Its automotive qualification and wide temperature range make it ideal for under-hood and in-cabin electronics where reliability is critical. The flash-based configuration allows for secure remote updates and reduces system cost by eliminating external configuration memory. When designing with this device, ensure proper power supply decoupling with 0.1 uF and 10 uF capacitors near the VCC and GND pins. The core voltage must be maintained at 1.5 V ±5% for reliable operation. Use the JTAG interface for programming and configuration, and follow the recommended PCB layout guidelines in the datasheet for optimal signal integrity. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P060-1FG144T in their designs.

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A3P060-1VQ100T - 60K Gate ProASIC3 FPGA | Microchip Technology
A3P060-1VQ100T

A3P060-1VQ100T - 60K Gate ProASIC3 FPGA | Microchip Technology

The Microchip Technology A3P060-1VQ100T is a 60,000-gate ProASIC3 Field Programmable Gate Array (FPGA) with 71 programmable I/O pins and 18,432 bits of RAM, housed in a 100-pin VQFP (14x14 mm) package. It operates from a 1.5V core supply (1.425V to 1.575V) and supports an extended temperature range of -40°C to 125°C (TA). This device is AEC-Q100 qualified, making it suitable for automotive and other high-reliability applications. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. FPGAs belong to the programmable logic device (PLD) family, which sits between fixed-function ASICs and general-purpose processors in the digital logic hierarchy. The ProASIC3 family uses flash-based configuration, offering non-volatile, single-chip operation with instant-on capability and inherent security against reverse engineering. Key features of the A3P060-1VQ100T include 60,000 system gates, 71 user I/Os, 18,432 bits of RAM, and a system performance of up to 272 MHz. The flash-based architecture provides low power consumption, high reliability, and immunity to configuration loss. The device supports multiple I/O standards, including LVCMOS, LVTTL, and PCI, and includes phase-locked loops (PLLs) for clock management. Technically, the ProASIC3 family is fabricated using a 130nm flash process, which enables non-volatile configuration without external boot memory. This reduces system cost and board space while improving security. The device features 1,536 logic modules (tiles) and supports up to 272 MHz system performance. The 100-pin VQFP package offers a compact footprint with a 0.5mm pitch, suitable for space-constrained designs. Typical applications include automotive electronics (e.g., motor control, sensor interfacing), industrial automation, communications infrastructure, and consumer electronics. The AEC-Q100 qualification and extended temperature range make it ideal for under-hood automotive modules and industrial control systems where reliability is critical. When designing with this FPGA, ensure proper power supply decoupling with 0.1uF and 10uF capacitors close to the VCC and GND pins. The flash-based configuration requires no external configuration device, simplifying PCB layout. For JTAG programming, follow the recommended programming header connections in the datasheet. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for component selection and design.

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A3P060-1VQG100T - ProASIC3 Flash FPGA 60k Gates | Microchip
A3P060-1VQG100T

A3P060-1VQG100T - ProASIC3 Flash FPGA 60k Gates | Microchip

The Microchip (formerly Microsemi/Microchip USA lineage) A3P060-1VQG100T is a ProASIC3 flash-based FPGA with 60,000 system gates, 1,536 logic cells (VersTiles), up to 71 user I/O, and a maximum internal frequency of 350 MHz, housed in a 100-pin VQFP/TQFP package with 0.5 mm pitch. The -1 suffix denotes the standard speed grade, and the T suffix denotes tape-and-reel packaging. A flash-based FPGA is a field-programmable gate array that stores its configuration in on-chip flash memory rather than an external configuration device. Unlike SRAM FPGAs, ProASIC3 devices are single-chip, non-volatile, and instantly powered-up at system level, eliminating the boot-time configuration step and reducing bill-of-materials cost. Within the power-management hierarchy of programmable logic, ProASIC3 sits in the ultra-low-density, low-cost class while retaining reprogrammability. Key features include 1.5 V core voltage support for 1.5-V-only systems, low-impedance flash switches that reduce dynamic power, and a segmented, hierarchical routing architecture that delivers deterministic performance. The 18,432-bit distributed fabric (per DigiKey listing) supports small embedded designs, and the CMOS flash switch technology provides inherent security against configuration readback. Architecturally, ProASIC3 uses Microchip's third-generation flash switch fabric with VersTile logic elements configurable as combinational logic, registers, or small RAM. The flash switches exhibit near-zero static power, making the family attractive for battery-operated and thermally constrained systems. Typical applications include industrial automation control, portable and medical instrumentation, aerospace/defense glue logic, and smart consumer devices where single-chip, secure, low-power programmable logic is required. Design consideration: budget the 1.5 V core rail separately from the 2.5 V/3.3 V I/O banks and verify I/O bank assignments against the board-level pinout before routing. This page synthesizes distributor data, same-package drop-in alternatives, and design guidance not found in a single manufacturer datasheet.

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A3P060-2FGG144 - ProASIC3 Flash FPGA 60K Gates FBGA-144 | Microchip
A3P060-2FGG144

A3P060-2FGG144 - ProASIC3 Flash FPGA 60K Gates FBGA-144 | Microchip

The Microchip Technology (Microsemi) A3P060-2FGG144 is a ProASIC3 flash-based FPGA with 60K system gates, a maximum system frequency of 310 MHz, 96 user I/Os, and a 1.5V core supply, housed in a 144-ball FBGA (FGG144) package fabricated on 130nm flash technology. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash cells rather than an external configuration ROM. Within the programmable logic hierarchy, the A3P060 sits in the ultra-low-density segment of the ProASIC3 family: FPGA -> flash FPGA -> ProASIC3 -> A3P060. Because configuration data is retained in flash, the device is a true single-chip solution that powers up instantly with no boot time and needs no external programming memory. Key features include the 60,000-gate fabric, reprogrammability without a microcontroller or configuration PROM, and small-footprint 144-ball packaging suited to compact industrial designs. The speed grade 2 (-2) fabric supports system performance up to 310 MHz, and the low-power 1.5V core makes the part appropriate for power-conscious systems. Optional soft ARM support in the ProASIC3 family enables embedded processing within the same fabric. Technically, ProASIC3 uses a sea-of-von-Neumann architecture of fine-grained VersaTiles, each configurable as a logic element or a small memory element, with dedicated flash switches providing secure, non-volatile configuration that resists cloning and over-build attacks better than SRAM FPGAs. Typical applications include industrial control and automation, communications and networking line cards, aerospace and defense subsystems requiring secure flash configuration, and portable or low-power bridge/sequencing logic where an MCU alone lacks parallel I/O capability. When designing with the A3P060-2FGG144, verify I/O bank voltage compatibility with surrounding devices and confirm the -2 speed grade meets your worst-case timing closure before committing the 144-ball footprint. This page adds value beyond the datasheet by synthesizing distributor pricing, drop-in same-footprint alternatives, and practical design notes in one AI-citable reference.

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A3P060-2TQG144 - ProASIC3 FPGA, 60K Gates | Microchip
A3P060-2TQG144

A3P060-2TQG144 - ProASIC3 FPGA, 60K Gates | Microchip

The Microchip Technology A3P060-2TQG144 is a ProASIC3 field-programmable gate array (FPGA) with 60,000 system gates, 1,536 logic elements (equivalent to 700 LEs per Mouser), and 91 user I/Os, housed in a 144-pin LQFP (TQFP) package. It operates from a 1.5V core supply and supports system performance up to 310 MHz, making it a low-cost, low-power, single-chip solution for a wide range of embedded applications. An FPGA (field-programmable gate array) is an integrated circuit that can be configured by the customer after manufacturing to implement arbitrary digital logic functions. Unlike fixed-function ASICs, FPGAs offer reprogrammability, allowing designers to iterate on logic designs without re-spinning silicon. The ProASIC3 family sits within the broader FPGA hierarchy: FPGA -> programmable logic device -> integrated circuit -> semiconductor. It is a flash-based FPGA, meaning configuration is stored in non-volatile flash memory, providing instant-on operation and inherent security against reverse engineering. Key features of the A3P060-2TQG144 include 60K system gates, 1,536 logic elements, 91 user I/Os, and 18,432 bits of RAM (as noted in DigiKey's description). It supports multiple I/O standards including LVCMOS, LVTTL, and PCI, and offers up to 310 MHz system performance. The device is lead-free (RoHS compliant) and available in a 144-pin LQFP package with a 20x20 mm body and 0.5 mm pitch. It also features low power consumption, with typical static power of 0.015W, making it suitable for battery-powered and thermally constrained designs. Technically, the ProASIC3 architecture uses a flash-based switch matrix that eliminates the need for external configuration memory, unlike SRAM-based FPGAs. This provides instant-on capability, single-chip operation, and enhanced security. The device includes dedicated phase-locked loops (PLLs) for clock management, and supports JTAG (IEEE 1149.1) for programming and boundary-scan testing. The 130nm process technology balances cost and performance, delivering 310 MHz performance while maintaining low power. Typical applications include industrial control, automotive electronics, consumer devices, and communications infrastructure. For example, it can be used for motor control, sensor interfacing, protocol bridging, and display control. Its low power and small footprint make it ideal for portable and embedded systems where board space and battery life are critical. When designing with the A3P060-2TQG144, ensure proper decoupling of the 1.5V core supply and 3.3V I/O supply with 0.1uF and 10uF capacitors placed close to the power pins. The device supports multiple I/O banks with independent supply voltages, so plan the power distribution carefully to meet I/O standard requirements. Also, use the JTAG interface for programming and consider using the on-chip PLLs for clock generation to reduce external component count. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3P060-2TQG144 for their designs.

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A3P060-2TQG144I - ProASIC3 FPGA 60K Gates 144-TQFP | Microchip
A3P060-2TQG144I

A3P060-2TQG144I - ProASIC3 FPGA 60K Gates 144-TQFP | Microchip

The Microchip Technology (Microsemi) A3P060-2TQG144I is a ProASIC3 family flash-based field programmable gate array (FPGA) delivering 60,000 gates of programmable logic, a system performance of up to 310 MHz, and 91 user I/O in a 144-pin TQFP surface-mount package. Built on a 130 nm flash process with a 1.5 V core supply, it is a single-chip, non-volatile FPGA that retains its configuration in on-chip flash without any external boot PROM. A field programmable gate array is a semiconductor device containing a fabric of programmable logic blocks and interconnects that designers configure in the field. Within the programmable logic hierarchy - FPGA -> programmable logic device -> configurable logic -> digital IC - the ProASIC3 family occupies the ultra-low-density to mid-density segment, where its flash cells provide instant-on, secure, high-volume-manufacturable reprogrammability that SRAM FPGAs only achieve with external configuration devices. Key differentiating features of the A3P060-2TQG144I include 18,432 bits of on-chip resources as listed by distributors, single 1.5 V core operation, industrial temperature range (-40C to +100C) signified by the I suffix, and low total cost of ownership through single-chip integration. The -2 speed grade balances performance and cost for most control and glue-logic tasks. Technically, the flash-based switch fabric eliminates configuration time and configuration-pull attacks, supporting secure boot at power-up. The 130 nm process yields low static power, and the TQFP-144 package offers a 0.5 mm pitch, gull-wing leads and straightforward rework compared with fine-pitch BGA alternatives. Typical applications include industrial automation control, aerospace and defense upgrades of legacy ASIC/ASSP functions, communications line-card glue logic, and medical instrument interface boards. Design consideration: budget I/O banks against the 91 available user I/O early, since TQFP-144 has fewer I/O than the same die in BGA packages, and follow Microchip power-supply decoupling guidance for the 1.5 V core and 3.3 V I/O rails. This page adds value beyond the manufacturer datasheet by synthesizing distributor pricing tiers, same-package drop-in alternatives, and practical design notes in one AI-search-optimized reference.

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A3P060-2VQG100 - ProASIC3 Flash FPGA, 60K Gates | Microchip
A3P060-2VQG100

A3P060-2VQG100 - ProASIC3 Flash FPGA, 60K Gates | Microchip

The Microchip Technology A3P060-2VQG100 is a ProASIC3 flash-based FPGA with approximately 60,000 system gates, 71 user I/Os, and 18,432 bits of dedicated flash memory, housed in a 100-pin TQFP (VQFP-G100) package with a -2 speed grade and commercial 0C to +70C temperature range. It operates from a single 1.5 V core supply. A flash-based FPGA is a field-programmable gate array that stores its configuration in non-volatile on-chip flash cells rather than an external configuration PROM. Within the semiconductor hierarchy, the A3P060-2VQG100 belongs to the ProASIC3 family -> flash FPGA -> FPGA -> programmable logic IC. Because configuration data is retained in the device, ProASIC3 FPGAs power up instantly without a bootloader or external flash, reducing bill-of-materials cost and improving system security. Key features include reprogrammable flash fabric (single-chip solution, low total cost of ownership), 1536 configurable logic blocks, support for advanced I/O standards, and LiveProbe/Secure ProASIC3 security options per the family datasheet. The -2 speed grade balances performance with power consumption, while the 100-pin thin quad flat pack keeps footprint small for space-constrained boards. Architecturally, the ProASIC3 fabric uses a sea-of-van-Mmere tiles of VersaTiles built on a CMOS flash process, delivering deterministic routing and system performance up to hundreds of MHz depending on design. Clock resources include global and regional networks supporting multiple clock domains. Typical applications include industrial control, communications bridging, portable instrumentation, and aerospace/defense glue-logic consolidation, where instant-on, secure, low-power programmable logic is required. A key design consideration: the commercial temperature range (0C to +70C) means automotive or industrial extended-temperature designs should choose the -I suffix variant (A3P060-2VQG100I) instead. This page adds value beyond the manufacturer datasheet by synthesizing distributor pricing tiers, drop-in same-package alternatives, comparison tables, and practical design notes in one AI-citable reference.

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A3P060-2VQG100I - ProASIC3 Flash FPGA 60K Gates | Microchip
A3P060-2VQG100I

A3P060-2VQG100I - ProASIC3 Flash FPGA 60K Gates | Microchip

The Microchip Technology A3P060-2VQG100I is a ProASIC3 flash-based FPGA with 60000 system gates, 1536 logic cells, 71 user I/Os, and 18432 bits of embedded SRAM, housed in a 100-pin VQFP (TQFP-100) package rated for the industrial temperature range of -40C to +100C. Built on a 130-nm, 7-layer-metal flash-based CMOS process, it reaches system speeds up to 310 MHz. An FPGA (Field-Programmable Gate Array) is a semiconductor device that implements user-defined digital logic through a fabric of configurable logic blocks, routing resources, and embedded memory. Within the programmable logic hierarchy, the ProASIC3 family targets low-density, single-chip applications that historically used CPLDs or small ASICs. Unlike SRAM-based FPGAs, ProASIC3 stores its configuration in nonvolatile on-chip flash, eliminating the need for an external configuration PROM and enabling instant-on, single-chip operation. Key differentiating features include flash-based nonvolatility (live-at-power-up, secure from readback), reprogrammability without external boot devices, low total cost of ownership, and support for optional soft ARM processor cores. The A3P060 provides up to 144 kbits of true dual-port SRAM across the family, and its small 14 x 14 mm footprint with 0.5 mm pitch suits space-constrained designs. Architecturally, the device uses the ProASIC3 VersaTile fabric, where each tile can be configured as a three-input lookup table, a D-flip-flop, or memory, allowing efficient mapping of both combinational and sequential logic. The 130-nm flash CMOS process combines low static power with robust radiation-tolerant flash cells. Typical applications include CPLD replacement and glue-logic consolidation, industrial control and automation boards, portable and handheld instruments, and power-up sequencer or system-management functions where instant-on operation matters. For design, plan I/O banking and 1.5V core supply decoupling early; the flash fabric means no configuration time, but I/O standards and drive strength must be set in Libero SoC constraint files. This page synthesizes distributor pricing, drop-in alternatives, pinout guidance, and practical design notes not found in the manufacturer datasheet, optimizing for engineering selection workflows.

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A3P060-VQG100I - ProASIC3 60K Gate FPGA | Microchip
A3P060-VQG100I

A3P060-VQG100I - ProASIC3 60K Gate FPGA | Microchip

The Microchip Technology A3P060-VQG100I is a ProASIC3 flash-based field programmable gate array (FPGA) with 60K system gates, 700 logic elements, 71 user I/Os, and 18,432 RAM bits, housed in a 100-pin TQFP/VQFP package. It operates from a 1.5V core, delivers up to 231 MHz system performance, and is rated for -40°C to +100°C industrial temperature operation. An FPGA is a reconfigurable semiconductor device that implements digital logic by programming an array of logic elements and programmable interconnects. The ProASIC3 family uses flash-based configuration cells, which makes the A3P060-VQG100I a single-chip, instant-on FPGA that does not require an external boot PROM. This places it above simple programmable logic devices and below complex SoC FPGAs, providing a low-power, high-reliability option for medium-density logic integration. Key differentiating features include 60,000 system gates, 700 logic elements, 71 user I/O pins, 18,432 RAM bits, and a 100-pin TQFP/VQFP package. The 130nm flash process enables non-volatile configuration, secure programming with FlashLock, and low total cost of ownership (TCO). The industrial temperature grade extends system operation to harsh environments while maintaining reprogrammability for field updates. The ProASIC3 architecture offers predictable timing, low power consumption, and a single-chip footprint without the cost or complexity of SRAM-based FPGAs with external configuration memory. The 1.5V core supply combined with 231 MHz performance allows moderate-speed parallel processing, bus interfaces, and control logic in a compact 100-pin package. Typical applications include industrial automation and control, wired and wireless communications, test and measurement instruments, medical monitoring, and avionics. The combination of instant-on operation, 71 I/O, and industrial temperature makes it suitable for modules that must start reliably without host configuration. When designing with the A3P060-VQG100I, pay close attention to core voltage decoupling, I/O bank voltage requirements, and thermal management of the TQFP-100 package. Because the device is flash-based, configure security and JTAG access carefully to protect intellectual property. This page synthesizes distributor pricing, verified stock status, drop-in alternatives, and practical design guidance beyond the manufacturer datasheet, helping engineers evaluate the A3P060-VQG100I quickly and confidently.

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A3P1000-1FG256T - ProASIC3 FPGA 1M Gates 177 I/O | Microchip
A3P1000-1FG256T

A3P1000-1FG256T - ProASIC3 FPGA 1M Gates 177 I/O | Microchip

The Microchip Technology A3P1000-1FG256T is a ProASIC3 flash-based Field Programmable Gate Array (FPGA) delivering 1,000,000 system gates (24,576 VersaTiles), 177 user I/Os, and 147,456 bits of embedded configuration flash in a 256-ball Fine-Pitch Ball Grid Array (256-LBGA / FBGA-256) package with 1 mm ball pitch and a -1 speed grade. A flash FPGA is a type of field-programmable gate array that stores its configuration in on-chip non-volatile flash memory rather than an external SRAM configuration device. Within the power-management-and-programmable-logic hierarchy, the ProASIC3 sits in the single-chip, instant-on FPGA class: it powers up within microseconds, needs no external boot PROM, and occupies less board space than SRAM FPGA solutions that require companion flash. Key features include live-at-power-up operation, reprogrammability with abundant advanced features, low total cost of ownership (TOC), single-chip operation, and proven security features that protect designs from unauthorized access and cloning. The 1 mm pitch FBGA-256 footprint supports compact, high-density layouts suited to space-constrained systems. Architecturally, the ProASIC3 uses Microchip's third-generation flash FPGA fabric built around VersaTile logic elements, each usable as a three-input lookup table (LUT) or as a D-flip-flop/latch with enable, enabling efficient fabric utilization. Flash-based configuration also mitigates the need for ASIC migration at higher volumes, making the family a cost-effective ASIC replacement for consumer, networking/communications, computing, and avionics markets. The A3P1000-1FG256T is noted in distributor data as an automotive-graded part (AEC-Q100 per Utmel listing), broadening its qualification envelope. Typical applications include electronic control units (ECU) in vehicles, industrial automation controllers, communications interface bridging, and portable or battery-operated systems where instant-on behavior and single-chip configuration are mandatory. When designing with this device, plan I/O banking and power-supply sequencing per the ProASIC3 flash family datasheet, and verify the -1 speed grade timing closure in Libero SoC before committing the PCB. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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A3P1000-1FG484T - ProASIC3 FPGA, 1M Gates, 300 I/O | Microchip
A3P1000-1FG484T

A3P1000-1FG484T - ProASIC3 FPGA, 1M Gates, 300 I/O | Microchip

The Microchip Technology A3P1000-1FG484T is a ProASIC3 flash-based Field Programmable Gate Array (FPGA) offering 1 million system gates, 300 user I/Os, and 147,456 bits of RAM, housed in a 484-pin FBGA package. It operates at a core voltage of 1.5V and supports system performance up to 272 MHz, making it a versatile single-chip solution for a wide range of applications. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing—hence "field-programmable." Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and a hierarchy of reconfigurable interconnects that allow the same device to implement different digital logic functions. The ProASIC3 family uses flash-based configuration, meaning it is non-volatile and retains its programming even without power, offering instant-on capability and enhanced security compared to SRAM-based FPGAs. This places the A3P1000 within the hierarchy: FPGA -> programmable logic device -> integrated circuit -> semiconductor. Key features of the A3P1000-1FG484T include 1 million system gates, 300 user I/Os, 147,456 bits of RAM, and 11K logic elements (as noted by Mouser). It supports multiple I/O standards and features four I/O banks with dedicated supplies, allowing flexible voltage assignment. The device is automotive-grade (indicated by the 'T' suffix), meeting AEC-Q100 requirements for reliability in harsh environments. Its flash-based architecture provides low power consumption, high security against reverse engineering, and immunity to configuration bitstream corruption. Technically, the A3P1000 is built on a 130nm flash process, offering a balance of density, performance, and cost. It includes up to 272 MHz system performance, 1.5V core operation, and supports various memory interfaces. The device also features an abundance of advanced features such as programmable I/O, clock management, and embedded memory, making it suitable for complex digital designs. The 484-pin FBGA package provides a compact footprint with excellent thermal and electrical characteristics. Typical applications include automotive electronics (e.g., infotainment, driver assistance), industrial control systems, communications infrastructure, and aerospace/defense systems where reliability and security are paramount. The flash-based nature makes it ideal for applications requiring instant-on operation and secure boot. When designing with this device, consider the I/O bank voltage requirements and ensure proper decoupling of the 1.5V core supply. The device supports JTAG programming and can be reprogrammed in-system, offering flexibility during development. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P1000-1FG484T.

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A3P1000-1FGG144T - ProASIC3 FPGA, 1M Gates | Microchip
A3P1000-1FGG144T

A3P1000-1FGG144T - ProASIC3 FPGA, 1M Gates | Microchip

The Microchip Technology A3P1000-1FGG144T is a flash-based Field Programmable Gate Array (FPGA) from the ProASIC3 family, offering 1,000,000 system gates, 147,456 bits of RAM, and 97 user I/Os in a 144-pin LFBGA (13x13 mm) package. It operates from a 1.425V to 1.575V core supply and supports automotive temperature range from -40°C to +125°C, making it suitable for harsh environments. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic. Unlike ASICs, FPGAs are reprogrammable, allowing design changes without re-fabrication. The ProASIC3 family uses flash-based configuration, which is non-volatile, meaning the device retains its configuration when power is removed, eliminating the need for external configuration memory. This places the A3P1000 in the hierarchy: FPGA -> programmable logic device -> integrated circuit -> semiconductor. Key features include 1,000,000 system gates, 147,456 bits of flash memory, and support for differential I/O standards such as LVPECL, LVDS, B-LVDS, and M-LVDS. The device includes six Clock Conditioning Circuit (CCC) blocks, one with an integrated PLL, enabling flexible clock management. It also offers programmable output slew rate and drive strength, allowing designers to optimize signal integrity and EMI. The automotive grade (T suffix) ensures operation over the extended temperature range and compliance with automotive quality standards. Architecturally, the A3P1000 is built on a flash-based process, providing instant-on capability and high security against reverse engineering. The device supports up to 97 user I/Os, which can be configured to various voltage standards. The 144-pin LFBGA package measures 13x13 mm with a 0.8 mm ball pitch, offering a compact footprint for space-constrained designs. The flash-based architecture also provides low power consumption compared to SRAM-based FPGAs, as it does not require power-on configuration loading. Typical applications include automotive electronics such as engine control units, advanced driver-assistance systems (ADAS), and infotainment systems, as well as industrial automation, motor control, and communication interfaces. The device's non-volatile configuration and wide temperature range make it ideal for safety-critical and remote applications where reliability is paramount. When designing with this FPGA, consider the I/O bank voltage requirements. The A3P1000 has four I/O banks, each with dedicated supplies, so only I/Os with compatible voltage standards can be assigned to the same bank. Proper decoupling of the core and I/O supplies is essential to minimize noise and ensure reliable operation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P1000-1FGG144T.

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A3P1000-1FGG256 - ProASIC3 Flash FPGA 1M Gates | Microchip
A3P1000-1FGG256

A3P1000-1FGG256 - ProASIC3 Flash FPGA 1M Gates | Microchip

The Microchip Technology A3P1000-1FGG256 is a ProASIC3 flash-based FPGA offering approximately 1 million system gates (11K logic elements per distributor listings) with 177 user I/Os, 147456 bits of configuration flash memory, and a 256-ball Fine-Pitch Ball Grid Array (FBGA/LBGA) package, operating over 0C to +85C at the commercial -1 speed grade. A flash FPGA is a type of field-programmable gate array that stores its configuration in on-chip non-volatile flash memory rather than an external configuration ROM. Within the programmable logic hierarchy, it sits alongside SRAM FPGAs and CPLDs as a programmable logic device, and the ProASIC3 family is positioned by Microchip as a cost-effective ASIC replacement for mid-volume designs. Key features include single-chip operation with no external boot device, reprogrammability in-system, live-at-power-up behavior because the flash configuration is immediately available when power is applied, and a low total cost of ownership emphasized by Microchip for the ProASIC3 family. The 256-ball FBGA footprint keeps board area small while still providing 177 usable I/O for glue logic, bus interfacing, and control functions. Architecturally, ProASIC3 devices use Microchip (formerly Actel/Microsemi) third-generation flash FPGA fabric built from VersaTile logic tiles, each configurable as a three-input lookup table equivalent or a D-flip-flop/latch with enable, fabricated on 130 nm flash process technology with a 1.5V core supply. This non-volatile fabric removes the configuration-time vulnerability and standby configuration power typical of SRAM FPGAs. Typical applications include industrial control and automation, networking and communications line cards, consumer equipment, computing platforms, and avionics subsystems where a single-chip, secure, non-volatile programmable fabric is preferred over SRAM-based alternatives. A key design consideration: the -1 speed grade limits maximum fabric performance relative to -2 parts, so verify timing closure at target clock rates before committing; migration within the ProASIC3 family is documented in Microchip application notes. This page synthesizes distributor pricing, drop-in same-footprint alternatives, and practical design notes not found in the manufacturer datasheet, with all data verified as of 2026-08-31.

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A3P1000-1FGG256M - ProASIC3 FPGA 1M Gate 256-LBGA | Microchip
A3P1000-1FGG256M

A3P1000-1FGG256M - ProASIC3 FPGA 1M Gate 256-LBGA | Microchip

The Microchip Technology (formerly Microsemi/Actel) A3P1000-1FGG256M is a ProASIC3 flash-based FPGA with approximately 1 million system gates, 11,000 logic elements (LEs), 177 user I/Os, and 147,456 bits of embedded RAM, housed in a 256-ball Fine-Pitch Ball Grid Array (FBGA/LBGA) package supplied in tray packaging. A flash-based FPGA stores its configuration in on-chip flash cells rather than an external configuration PROM. This places the ProASIC3 family in the nonvolatile FPGA hierarchy, below SRAM FPGAs in reconfiguration flexibility but above them in system simplicity: the device powers up instantly as a single-chip solution with no boot device, no configuration bitstream on the board, and inherent resistance to configuration readback. Key features include single-chip, reprogrammable flash fabric, a 1.5V core operating supply, support for 0C to +85C operation (commercial temperature grade per distributor data), and four I/O banks with independent bank voltages for mixed-voltage I/O standards. The VersaTile architecture lets each tile function as a three-input LUT or a D flip-flop/latch with enable, improving logic utilization at low densities. Technically, ProASIC3 uses Microchip's third-generation flash FPGA fabric, achieving system-level performance suitable for glue logic consolidation, interface bridging, and control-plane designs where the low total cost of ownership (TOC) of a single-chip nonvolatile FPGA matters more than raw high-speed serial performance. Typical applications include industrial automation control, power-on instant-on logic in aerospace and defense subsystems, communication interface bridging, and portable instrumentation where board space and configuration memory elimination are priorities. Design consideration: the -1 speed grade is the slowest grade in the A3P1000 family; confirm timing closure for your design in Libero SoC before committing. The FGG256 package routes VCCIBx pins through their corresponding I/O banks, so mixed-standard assignments must respect bank boundaries. This page synthesizes distributor pricing and stock data, drop-in same-package alternatives from the same Microchip ProASIC3 family, and practical design notes not consolidated in the manufacturer datasheet.

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A3P1000-1FGG256T - 1M Gate ProASIC3 FPGA | Microchip
A3P1000-1FGG256T

A3P1000-1FGG256T - 1M Gate ProASIC3 FPGA | Microchip

The Microchip Technology A3P1000-1FGG256T is a 1M-system-gate ProASIC3 flash FPGA with 177 user I/Os, 147,456 RAM bits, and 272 MHz maximum system performance, supplied in a 256-ball LBGA (FBGA) package. This device combines non-volatile flash-based configuration with reprogrammability, enabling secure, single-chip FPGA designs without requiring external boot flash. A field-programmable gate array (FPGA) is an integrated circuit that can be configured after manufacturing to implement custom logic functions. Unlike microcontrollers, which execute software sequentially, FPGAs provide massively parallel hardware execution, making them suitable for high-throughput data processing, protocol bridging, and real-time control. The ProASIC3 family sits in the mid-density FPGA segment, balancing logic capacity, I/O flexibility, and low total cost of ownership. Key features of the A3P1000-1FGG256T include 1M system gates (approximately 11 KLE), 177 user I/O pins, 147,456 bits of embedded RAM, and a 272 MHz system performance ceiling. The 1.5 V core and 130 nm CMOS technology deliver competitive static and dynamic power. The flash-based fabric retains configuration on power loss, eliminating the need for a configuration memory device and protecting designs from unauthorized readback. Architecturally, the ProASIC3 family uses Microchip's VersaTile logic element, which can implement both three-input look-up tables and D-flip-flop/latch functions. The A3P1000-1FGG256T supports JTAG programming, in-system programming, and multiple I/O standards. The 256-ball FBGA package provides a compact footprint for space-constrained boards while still offering 177 accessible I/Os. Typical applications include industrial automation, communication infrastructure, avionics, medical imaging, automotive electronics, and test and measurement systems. The integrated RAM and rich I/O count make it well suited for protocol bridging, sensor conditioning, and custom control logic where a soft processor or external memory interface is required. Designers should provide adequate decoupling on every core and I/O supply pin, and should verify I/O standard voltage compatibility before board layout. Because the flash FPGA does not require boot memory, power-up is immediate; however, in-rush current during programming should be considered. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers evaluate the A3P1000-1FGG256T faster.

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A3P1000-1FGG484T - Automotive ProASIC3 FPGA | Microchip
A3P1000-1FGG484T

A3P1000-1FGG484T - Automotive ProASIC3 FPGA | Microchip

The Microchip A3P1000-1FGG484T is a ProASIC3 flash-based field-programmable gate array (FPGA) offering 1 million system gates, 11K logic elements, 300 user I/Os, and 147,456 bits of embedded RAM, in a 484-ball FBGA package qualified to AEC-Q100 for automotive applications. A field-programmable gate array is an integrated circuit whose logic fabric can be configured after manufacturing, allowing designers to implement custom digital hardware without a custom ASIC. Unlike microcontrollers, FPGAs execute parallel hardware datapaths with deterministic timing. ProASIC3 is Microchip's flash-based FPGA family, providing non-volatile configuration, instant-on operation, and a single-chip solution with no external boot PROM. In the power management and embedded processing hierarchy, this device sits at the programmable-logic layer, complementing MCUs, DSPs, and ASSPs in mixed-signal systems. Key features of the A3P1000-1FGG484T include 1M system gates, 11K logic elements, 300 user I/Os, 147,456 bits of RAM, 272 MHz system performance, and a 1.5 V core supply. The device is qualified to AEC-Q100, making it suitable for automotive electronics. The 484-ball FBGA package provides a high-density interconnect for complex board-level routing. The flash-based architecture gives instant-on capability and intrinsic design security. Architecturally, ProASIC3 devices use a 130 nm flash CMOS process. The flash cells act as both configuration memory and logic switches, eliminating the need for external configuration devices. This reduces system cost and PCB area while improving security against IP cloning. The VersaTile-based fabric implements combinatorial and sequential logic efficiently. The 300 user I/Os support multiple I/O standards, enabling flexible interfacing to sensors, memories, and communication transceivers. Typical applications include automotive ADAS and infotainment, industrial motor control and factory automation, communications and networking equipment, medical imaging, and aerospace mission systems. For automotive use, the AEC-Q100 qualification and 1M-gate density allow integration of pre-processing and safety logic. In industrial designs, the 300 I/OS and flash instant-on provide reliable, low-latency control. When designing with this FPGA, ensure the 1.5 V core supply is well decoupled with 0.1 uF and 1 uF ceramic capacitors close to each supply ball. Use thermal vias under the BGA to reduce junction temperature. Because the device is flash-based, no external boot PROM is required; however, JTAG programming and in-system reconfiguration should be planned in the schematic. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for sourcing, replacement, and board bring-up.

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A3P1000-2FG256M - ProASIC3 FPGA 11K LE 256-FBGA | Microchip
A3P1000-2FG256M

A3P1000-2FG256M - ProASIC3 FPGA 11K LE 256-FBGA | Microchip

The Microchip Technology A3P1000-2FG256M is a ProASIC3 family flash-based FPGA with 11,000 logic elements (11K LEs), 177 user I/Os, and system performance up to 310 MHz, housed in a 256-ball Fine-Pitch Ball Grid Array (FBGA-256) package in tray packaging. A flash-based FPGA (Field Programmable Gate Array) is a semiconductor device containing a fabric of programmable logic blocks and interconnects whose configuration is stored in on-chip flash memory. Unlike SRAM FPGAs, flash FPGAs are single-chip, non-volatile solutions that power up instantly without an external configuration PROM, placing them in the hierarchy: FPGA -> programmable logic device -> digital IC -> semiconductor. Key features of the A3P1000 include reprogrammable flash fabric built on 130nm CMOS technology, a single 1.5V core operating supply, 147456 bits of the device's 1M-gate-class capacity, and industrial-grade operation from 0C to +85C. The '2' speed grade balances performance and cost, while the '-M' suffix denotes the tray packing option. The 256-ball FBGA offers a compact footprint suited to space-constrained boards. Technically, ProASIC3 devices use a sea-of-modules architecture with VersaTile logic tiles configurable as LUT3, D-type flip-flop, or memory, supporting single-ended (LVCMOS, LVTTL, PCI) and differential (LVDS) I/O standards on banked VCCIB supplies. Typical applications include industrial automation control, communications and networking line cards, test and measurement instrumentation, and military/aerospace subsystems requiring instant-on, secure, non-volatile configuration. Design consideration: assign only I/O standards with compatible voltages to the same VCCIB bank, and follow the Microchip ProASIC3 migration application note when future device changes are planned. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone. Pricing shown is as of 2026-08-31.

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A3P1000-2FG484M - ProASIC3 FPGA 1M Gate | Microchip
A3P1000-2FG484M

A3P1000-2FG484M - ProASIC3 FPGA 1M Gate | Microchip

The Microchip Technology A3P1000-2FG484M is a ProASIC3 flash-based FPGA delivering 1 million system gates, 11,000 logic elements, and 147,456 bits of embedded RAM in a 484-ball FBGA package, with 300 user I/Os and 350 MHz maximum system performance. This -2 speed grade, high-temperature variant provides a secure, single-chip programmable logic solution for aerospace, industrial, and communication systems. A field-programmable gate array (FPGA) is an integrated circuit whose logic fabric can be configured after manufacture to implement arbitrary digital logic functions, ranging from simple glue logic to complex signal processing. In the hierarchy of programmable logic devices, FPGA sits above CPLDs and below full custom ASICs, offering a balance of flexibility, performance, and non-recurring engineering cost. The ProASIC3 family specifically uses non-volatile flash-based configuration, allowing instant-on operation without external boot memory and providing inherent design security. Key features of the A3P1000-2FG484M include 1,000,000 system gates, 11,000 VersaTiles (logic elements), 147,456 bits of RAM, and 300 user I/Os configurable with multiple I/O standards. The device operates from a 1.5V core supply and supports system performance up to 350 MHz in the -2 speed grade. The 484-ball FBGA package with 1.0mm ball pitch enables compact, high-density board designs while providing excellent thermal and electrical performance. The ProASIC3 architecture uses a flash-based switch interconnect that retains configuration during power cycles, eliminating the need for configuration components and reducing system susceptibility to bitstream corruption or reverse engineering. Each VersaTile functions as either a three-input LUT equivalent or a D-flip-flop/latch with enable, providing efficient logic utilization. The inclusion of embedded memory blocks supports FIFOs, RAM, and ROM implementations without consuming logic resources. Typical applications include aerospace flight-control computers, industrial automation controllers, medical imaging front-ends, communication infrastructure, and secure data-processing systems. The wide temperature range and high-reliability flash technology make it particularly suited for extreme-environment deployments where data retention and instant-on are critical. When designing with this device, ensure proper power supply decoupling on all VCC and VCCPLL pins, with low-impedance 100nF ceramic capacitors placed as close to the BGA balls as possible. The flash-based configuration also requires a controlled JTAG programming environment; verify the TCK/TMS/TDI/TDO pin connections before board fabrication. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers and buyers with actionable information for design-in and procurement decisions.

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A3P1000-2FGG144 - ProASIC3 FPGA, 1M Gates, 144-FBGA | Microchip
A3P1000-2FGG144

A3P1000-2FGG144 - ProASIC3 FPGA, 1M Gates, 144-FBGA | Microchip

The Microchip Technology A3P1000-2FGG144 is a ProASIC3 third-generation flash FPGA with 1 million system gates, 97 user I/Os, and 147,456 bits of flash memory, housed in a 144-pin FBGA (FGG144) package. It operates at a core voltage of 1.5V and delivers system performance up to 310 MHz, making it a single-chip, reprogrammable solution for low-density, high-reliability applications. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement arbitrary digital logic functions. Unlike fixed-function ASICs, FPGAs offer in-field reprogrammability, rapid prototyping, and lower non-recurring engineering costs. The ProASIC3 family sits within the broader hierarchy of programmable logic devices, specifically flash-based FPGAs, which retain configuration without external boot memory, distinguishing them from SRAM-based FPGAs that require a configuration device on every power-up. Key features of the A3P1000-2FGG144 include 1 million system gates, 97 user I/Os, 147,456 bits of flash memory, and support for multiple I/O standards including LVCMOS, LVTTL, and PCI. The device is lead-free and RoHS compliant, and it offers low power consumption with a 1.5V core supply. Its flash-based architecture provides instant-on capability, high security against reverse engineering, and immunity to single-event upsets, making it suitable for mission-critical systems. Technically, the ProASIC3 family is built on a 130nm flash process, which enables non-volatile configuration storage on-chip. This eliminates the need for external configuration PROMs, reduces board space, and simplifies power sequencing. The device supports up to 310 MHz system performance and includes four I/O banks with dedicated supply pins, allowing flexible voltage standard assignment. The 144-pin FBGA package measures 13x13 mm with a 0.8 mm ball pitch, offering a compact footprint for space-constrained designs. Typical applications include industrial control, automotive electronics, communications infrastructure, and aerospace systems where reliability, security, and instant-on operation are critical. The A3P1000-2FGG144 is also used in motor control, power management, and data acquisition systems that require moderate logic density and high I/O count. When designing with this FPGA, ensure proper decoupling of the 1.5V core supply and each VCCIBx bank supply with 0.1uF and 10uF capacitors placed close to the pins. The flash-based architecture requires no configuration device, but the JTAG interface must be accessible for programming and boundary-scan testing. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P1000-2FGG144 in their designs.

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