A3P060-2FGG144 - ProASIC3 Flash FPGA 60K Gates FBGA-144 | Microchip
部品番号: A3P060-2FGG144 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $7.63 | $7.63 |
| 10 | $7.1 | $71.00 |
| 100 | $6.55 | $655.00 |
| 500 | $6.05 | $3,025.00 |
| 1,000 | $5.62 | $5,620.00 |
A3P060-2FGG144 概要
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash cells rather than an external configuration ROM. Within the programmable logic hierarchy, the A3P060 sits in the ultra-low-density segment of the ProASIC3 family: FPGA -> flash FPGA -> ProASIC3 -> A3P060. Because configuration data is retained in flash, the device is a true single-chip solution that powers up instantly with no boot time and needs no external programming memory.
Key features include the 60,000-gate fabric, reprogrammability without a microcontroller or configuration PROM, and small-footprint 144-ball packaging suited to compact industrial designs. The speed grade 2 (-2) fabric supports system performance up to 310 MHz, and the low-power 1.5V core makes the part appropriate for power-conscious systems. Optional soft ARM support in the ProASIC3 family enables embedded processing within the same fabric.
Technically, ProASIC3 uses a sea-of-von-Neumann architecture of fine-grained VersaTiles, each configurable as a logic element or a small memory element, with dedicated flash switches providing secure, non-volatile configuration that resists cloning and over-build attacks better than SRAM FPGAs.
Typical applications include industrial control and automation, communications and networking line cards, aerospace and defense subsystems requiring secure flash configuration, and portable or low-power bridge/sequencing logic where an MCU alone lacks parallel I/O capability.
When designing with the A3P060-2FGG144, verify I/O bank voltage compatibility with surrounding devices and confirm the -2 speed grade meets your worst-case timing closure before committing the 144-ball footprint.
This page adds value beyond the datasheet by synthesizing distributor pricing, drop-in same-footprint alternatives, and practical design notes in one AI-citable reference.
ドロップイン代替品: A3P060-2FGG144 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: A3P060-2FGG144 （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Process Technology, System Gates, Configuration.
クイック比較ツール — 並列比較する代替部品を選択:
A3P060-2FGG144I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
A3P600-2FGG144
✅ ドロップイン✓ 在庫あり
$30.4 / 個
データシートを見る →A3P600-2FGG144I
✅ ドロップイン✓ 在庫あり
$44.6 / 個
データシートを見る →A3P1000-2FGG144
✅ ドロップイン✓ 在庫あり
$27.2 / 個
データシートを見る →A3P1000-2FGG144I
✅ ドロップイン✓ 在庫あり
$27.2 / 個
データシートを見る →A3P060-2FGG144 最大定格＆電気的特性
| Family | ProASIC3 Flash FPGA |
| System Gates | 60000 |
| Maximum System Frequency | 310 MHz |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm flash |
| User I/O | 96 |
| DigiKey Listing Value | 18432 |
| パッケージ | 144-ball FBGA (FGG144) |
| Speed Grade | -2 |
| Configuration Memory | On-chip flash (non-volatile) |
| 実装タイプ | Surface Mount |
A3P060-2FGG144 144-ball fbga (fgg144) ピン配置ガイド
A3P060-2FGG144 (144-ball fbga (fgg144) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: A3P060-2FGG144.
詳細は データシート をご参照ください。
主な用途
A3P060-2FGG144 の用途: 6 件s: Industrial Control and Automation, Communications and Networking Line Cards, Aerospace and Defense Secure Logic, Portable and Battery-Powered Instruments, Medical Diagnostic Equipment, Security and Surveillance Systems.
Industrial Control and Automation
Factory automation and PLC-style control boards benefit directly from the A3P060-2FGG144's combination of 96 user I/Os and a compact 144-ball FBGA footprint. Parallel sensor polling, motor enable sequencing, and backplane handshaking consume many I/O but little logic - the 60K-gate fabric covers this while instant-on flash configuration eliminates boot delay that would stall a production line after power dips. The 1.5V core keeps board-level power low even in always-on installations, and the industrial-grade A3P060-2FGG144I variant covers wide ambient temperatures. Designers typically implement glue logic, state machines, and interlock functions here, with quantified benefit of replacing dozens of discrete 74xx devices and their associated PCB area.
おすすめ
Communications and Networking Line Cards
Line-card and bridge functions in networking equipment require bridging incompatible interfaces - for example parallel PHY buses to serial backbones - a task the A3P060-2FGG144 handles with its 96 user I/Os and 310 MHz maximum fabric speed. The -2 speed grade sustains system-level timing for moderate-throughput data paths, while the flash fabric keeps configuration secure on removable or field-deployed equipment, resisting bitstream extraction attacks that threaten SRAM FPGAs. Placement between a companion processor and PHY devices is typical; the single-chip non-volatile design removes the configuration PROM and its boot time from the link bring-up sequence. Budget the fabric at 60K gates, reserving headroom for future feature updates via field reprogramming.
おすすめ
Aerospace and Defense Secure Logic
Defense and aerospace subsystems favor ProASIC3 flash FPGAs because configuration resides in on-chip flash that resists cloning, over-build, and bitstream interception - no external configuration readout occurs even during programming. The A3P060-2FGG144 provides 60K gates and 96 I/Os for sensor interfacing, telemetry formatting, and holdup/sequencing logic in compact payloads where the 144-ball FBGA conserves board area. For wide-temperature flight environments, the A3P060-2FGG144I is the specified variant. A quantified advantage over SRAM FPGA alternatives is the elimination of the configuration device, removing one common single-point-of-failure and simplifying radiation-tolerant board design. Verify compliance requirements against Microchip's applicable qualification documentation for your program tier.
おすすめ
Portable and Battery-Powered Instruments
Handheld test instruments and battery-operated data loggers need parallel I/O for keypads, displays, and sensor arrays while minimizing static power. The A3P060-2FGG144's 1.5V core on 130nm flash technology avoids the static configuration current of SRAM FPGAs, and instant-on behavior means the instrument is ready the moment power is applied - no 100ms-plus boot sequence. The 144-ball FBGA package fits compact enclosures, and 96 user I/Os terminate the full front-panel and analog-front-end interface. Combine it with a low-power MCU such as the MSP430FR5994 for user interface and data management, using the FPGA for deterministic parallel acquisition. Confirm dynamic power in Libero with your actual switching activity for battery-life estimates.
おすすめ
Medical Diagnostic Equipment
Benchtop diagnostic and patient-interface equipment uses the A3P060-2FGG144 for deterministic sensor acquisition and safety interlock logic, where the FPGA's parallel fabric guarantees latency independent of software load. The 96 user I/Os connect detector arrays, front-end ADCs, and indicator panels, while flash configuration supports field upgrades through controlled, signed firmware releases - important for design-history documentation in regulated environments. The single-chip, non-volatile architecture removes external configuration memory from the bill of materials, reducing one verification item. The industrial-grade A3P060-2FGG144I variant tolerates autoclave-adjacent warm environments. Designers should implement watchdog and power-good monitoring in the fabric and verify all timing closure at the -2 speed grade worst-case corners before release.
おすすめ
Security and Surveillance Systems
Surveillance camera and access-control boards use the A3P060-2FGG144 as interface glue between image sensors, illumination drivers, and network processors. The 60K-gate fabric implements frame timing, exposure sequencing, and GPIO expansion, while 96 user I/Os cover the parallel sensor header, LED banks, and tamper-switch inputs. Flash configuration means the system is operational instantly on power-over-Ethernet insertion, and the secure non-volatile bitstream protects proprietary camera algorithms from extraction - a recognized weakness of SRAM-based FPGAs in exposed hardware. The 1.5V core suits thermally enclosed camera housings, though designers should budget the fabric's dynamic power at full toggle rates. A companion MCU handles network stacks while the FPGA manages deterministic sensor timing.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: A3P060-2FGG144 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | A3P060-2FGG144I | A3P600-2FGG144 | A3P1000-2FGG144 |
|---|---|---|---|---|
| Package | 144-ball FBGA (FGG144) | 144-ball FBGA (FGG144) - same | 144-ball FBGA (FGG144) - same | 144-ball FBGA (FGG144) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 60000 | 60000 | ~600000 | ~1000000 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Temperature Grade | Commercial | Industrial (I) | Commercial | Commercial |
| Configuration Memory | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
主な差別化要因
- True single-chip non-volatile configuration （vs SRAM-based low-density FPGAs)
- Footprint-compatible capacity upgrade path （vs A3P600-2FGG144 / A3P1000-2FGG144)
- Industrial temperature drop-in variant （vs A3P060-2FGG144I)
設計ノート
The A3P060-2FGG144 uses a 1.5V core supply; provide a dedicated low-noise LDO or buck output with at least 10uF bulk plus 0.1uF ceramic decoupling per I/O bank supply pin. I/O bank VCCI rails must match the voltage standards of connected devices - verify bank assignment in Libero before routing, since mixing 3.3V and 2.5V signals on one bank will violate absolute maximum ratings. Estimated: static flash-based power is low, but dynamic power scales with toggle rate, so run Libero's SmartPower analysis with realistic switching activity rather than worst-case 100% toggle.
For the 144-ball FBGA, use a 0.8mm-pitch BGA fanout (typically dog-bone with via-in-pad or vias-on-0.6mm grid depending on fab capability - confirm with your PCB manufacturer). Place 0.1uF decoupling capacitors within 2mm of the power balls on the underside. Programming via the JTAG port requires keeping TMS pulled to a defined level with a 10k resistor to prevent mid-operation reconfiguration. Reference Microchip's ProASIC3 layout guidelines in the family datasheet for exact ball-map breakout recommendations.
Do not assume all 144 balls are available I/O - the A3P060-2FGG144 provides 96 user I/Os; the remainder are power, ground, and JTAG. Designs ported from other FGG144 densities must re-verify the ball map because assignments differ between family members even in the same footprint. Also, flash FPGAs cannot be reprogrammed indefinitely like RAM - respect the datasheet flash endurance specification for field-update planning, and reserve a JTAG header on the board for secure in-system programming with FlashPro.
コンプライアンス情報
Compliance status not stated in the provided web data; consult the Microchip product page environmental data sheet for RoHS/REACH status of this exact MPN.
