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M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip
M1AFS1500-2FG676I

M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip

The Microchip (Microsemi) M1AFS1500-2FG676I is a flash-based, mixed-signal FPGA from the Fusion family, delivering approximately 1.5 million system gates on a 130nm CMOS process with a 1.5V core supply, housed in a 676-ball Fine-Pitch Ball Grid Array (FBGA-676) package qualified for industrial temperature environments. The speed grade 2 designation and the I suffix (industrial temperature) make this device targeted at ruggedized embedded systems rather than cost-driven consumer designs. A flash-based FPGA (Field-Programmable Gate Array) is a reconfigurable logic device that stores its configuration in non-volatile on-chip flash memory rather than an external configuration PROM. Unlike SRAM-based FPGAs, flash FPGAs are instant-on at power-up, do not require a boot device, and are inherently more resistant to configuration upset from radiation or single-event effects. Within the programmable-logic hierarchy, the Fusion family sits under Microsemi's (now Microchip Technology's) nonvolatile FPGA portfolio, alongside the ProASIC3 and Igloo families. The defining differentiator of the Fusion family is integration of mixed-signal functionality: analog peripherals such as an on-chip ADC, clock conditioning circuits (CCC), and power-on-reset/reset supervision are integrated onto the same die as the digital fabric, allowing the device to replace a discrete microcontroller-plus-supervisory-logic cluster in power-management and monitoring applications. Fabric routing is supported by embedded flash-basedVersaTiles, and the device supports single-chip operation with no external configuration flash. Architecturally, the 130nm CMOS flash process yields low static power and high configuration retention. The fabric is organized around the VersaTile, a three-input configurable logic block usable as logic or as RAM/registered logic, and embedded SRAM blocks provide on-chip buffering. Jotrin Electronics lists the device as FPGA Fusion Family, 1.5M gates, 130nm technology, 1.5V, 676-pin FBGA, supplied in trays. Typical applications include industrial power-supply supervision and sequencing, smart-energy and utility metering, motor-control interface logic, aerospace and defense subsystems requiring instant-on secure operation, and medical instrumentation where a single mixed-signal device replaces MCU plus discrete analog supervisory circuitry. A key design consideration is compliance: distributor data indicates this M1-prefixed (leaded) variant is RoHS non-compliant and contains lead, so it should be specified only for exemptions or legacy builds; the RoHS-compliant FGG equivalent is recommended for new designs. This page synthesizes distributor pricing, stock availability, drop-in alternatives from the Site MPN list, and practical design notes not found in the manufacturer datasheet.

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M1AFS1500-2FGG256 - 1.5M Gate Fusion FPGA with Cortex-M1 | Microchip
M1AFS1500-2FGG256

M1AFS1500-2FGG256 - 1.5M Gate Fusion FPGA with Cortex-M1 | Microchip

The Microchip Technology M1AFS1500-2FGG256 is a Fusion mixed-signal FPGA SoC combining 1.5 million system gates (38,400 logic cells), an embedded ARM Cortex-M1 processor core running up to 350 MHz, and 119 user I/Os in a 256-ball FBGA (FGG256 / S-PBGA-B256) package operating from a 1.5 V core supply. A mixed-signal FPGA is a programmable logic device that integrates traditional digital programmable fabric with analog circuitry, memory, and processing blocks on a single monolithic die. Within the semiconductor hierarchy, it sits above a pure FPGA and below a full system-on-chip, functioning as a configurable embedded processing and signal-conditioning platform for power management and instrumentation systems. Key features include flash-based programmable logic (no configuration PROM required, instant-on at power-up), large embedded flash memory blocks with 276,480 bits reported for this configuration, comprehensive on-chip clock generation and management circuitry, and configurable analog blocks that reduce external component count. The -2 speed grade and 350 MHz maximum clock frequency support demanding control-loop and datapath applications. Architecturally, the M1AFS1500 is fabricated in CMOS process technology (130nm-class per distributor data) and integrates the ARM Cortex-M1 soft-compatible embedded processor, flash memory fabric, analog conditioning peripherals, and clock management in a monolithic device. The Fusion fabric from Microsemi (now Microchip) was designed specifically for mixed-signal board-level integration, replacing discrete analog monitoring circuits, PLDs, and microcontrollers. Typical applications include system power supply supervision and control, smart battery management, industrial instrumentation front ends, fan and thermal board management, and embedded control systems that benefit from the integrated ARM Cortex-M1 CPU. The monolithic analog-plus-logic integration makes it a strong fit where board space and BOM consolidation matter. A key design consideration: the 1.5 V core supply requires a stable, well-decoupled rail, and the 256-ball BGA demands controlled-impedance multilayer PCB layout; verify JTAG programming access early in the layout. This page synthesizes distributor pricing context, drop-in alternatives, pinout guidance, and practical design notes not found together in the manufacturer datasheet.

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M1AFS1500-2FGG484 - 1.5M Gate Fusion FPGA, 484-BGA | Microchip
M1AFS1500-2FGG484

M1AFS1500-2FGG484 - 1.5M Gate Fusion FPGA, 484-BGA | Microchip

The Microchip Technology M1AFS1500-2FGG484 is a mixed-signal flash-based FPGA from the Fusion family, delivering 1.5 million system gates, 38,400 logic cells, and 223 user I/Os in a 484-ball FBGA package. It operates from a 1.5V core supply at up to 350 MHz maximum clock frequency and integrates 276,480 bits of flash memory, configurable analog blocks, and clock management circuitry in a single monolithic 130nm CMOS device. A field-programmable gate array (FPGA) is a semiconductor device containing programmable logic blocks and interconnects that designers configure after manufacturing. Within the programmable logic hierarchy, the M1AFS1500 belongs to the Fusion family of mixed-signal FPGAs, positioned above flash-based ProASIC3-class devices by adding analog peripherals (ADC, analog quad), large flash memory blocks, and comprehensive on-chip clock generation - effectively combining digital programmable logic, analog measurement, and system configuration storage in one chip. Key features include flash-based configuration (instant-on, non-volatile, SEU-resistant), an embedded ARM Cortex-M1 soft processor option, 4,608-bit dual-port SRAM/FIFO blocks, and integrated CCC/PLL clock conditioning circuits. The -2 speed grade provides higher timing performance than -1 and -0 grades. The 484-ball FBGA with 1.00 mm ball pitch supports high-I/O-count designs in space-constrained boards. Architecturally, VersaTiles form the logic fabric, each configurable as combinational logic, sequential logic, or memory. The analog quad with ADC enables power-supply and temperature monitoring without external sensors. Flash memory blocks can store firmware for the Cortex-M1 soft core, enabling single-chip embedded systems. Typical applications include industrial automation and motor control, medical instrumentation, avionics and defense systems requiring non-volatile secure configuration, and test/measurement equipment where mixed-signal integration reduces BOM count. A key design consideration: power the 1.5V core rail in proper sequence with I/O banks, and plan flash programming access (JTAG/SPI) early in the PCB layout. This page synthesizes distributor pricing, pin-compatible drop-in alternatives across speed and temperature grades, and practical design notes not found in the manufacturer datasheet. Pricing as of 2026-09-02.

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M1AFS1500-2FGG484I - 1.5M Gate Fusion FPGA, 223 I/O | Microchip
M1AFS1500-2FGG484I

M1AFS1500-2FGG484I - 1.5M Gate Fusion FPGA, 223 I/O | Microchip

The Microchip Technology M1AFS1500-2FGG484I is a Fusion mixed-signal FPGA with 1.5 million system gates, an embedded ARM Cortex-M1 processor, 223 user I/Os, and 276480 bits of flash-based configuration memory, housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA/FGG484) package with industrial temperature rating (-40C to +100C junction). A field-programmable gate array (FPGA) is a semiconductor device containing a matrix of configurable logic blocks (CLBs) and programmable interconnects that designers configure in the field, sitting at the top of the programmable logic hierarchy that spans SPLDs, CPLDs, and FPGAs. The Fusion family extends this concept to mixed-signal system-on-chip integration by monolithically combining flash-based programmable fabric with configurable analog blocks, clock management, and a hard ARM processor core. Key features of the M1AFS1500 variant include the ARM Cortex-M1 soft-capable processor support, flash-based LivePro reprogrammability, comprehensive clock generation and management circuitry (CCM), and large flash memory blocks integrated on-die. Speed grade 2 denotes a fabric that is 25% faster than the standard speed grade, supporting higher system clock frequencies in timing-critical designs. The device is fabricated in a 130nm flash-based CMOS process operating from a 1.5V core supply. Unlike SRAM FPGAs from Xilinx or Altera (Intel), the Fusion fabric is inherently non-volatile and secure: configuration data resides in on-chip flash, eliminating the need for an external boot flash and reducing configuration-time glitch and cloning risks. Deterministic 1.5V core operation simplifies power-tree design compared with multi-rail SRAM FPGAs. Typical applications include industrial automation and motor control (leveraging the mixed-signal analog peripherals), aerospace and defense systems requiring secure non-volatile configuration, test and measurement instrumentation, and embedded control systems where a hard ARM core plus programmable logic in one package replaces a two-chip MCU-plus-FPGA solution. Design consideration: budget power carefully - the 484-ball package supports substantial logic utilization, so perform thermal estimation with Microchip Libero SoC power tools and provide adequate PCB copper area under the BGA for heat spreading. This page synthesizes distributor pricing, drop-in same-package alternatives, FAQs, and practical design notes not consolidated in the manufacturer datasheet.

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M1AFS1500-2FGG676 - 1.5M Gate Fusion FPGA | Microchip
M1AFS1500-2FGG676

M1AFS1500-2FGG676 - 1.5M Gate Fusion FPGA | Microchip

The Microchip Technology M1AFS1500-2FGG676 is a Fusion mixed-signal FPGA from the M1AFS1500 series, integrating configurable analog, large flash memory blocks, comprehensive clock generation and management circuitry, and high-performance flash-based programmable logic in a monolithic device. It offers 1,500,000 equivalent gates, 38,400 logic cells, and operates at a maximum clock frequency of 350 MHz, housed in a 676-ball Plastic Ball Grid Array (PBGA) package with a 1.00 mm terminal pitch. A Field-Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs are part of the programmable logic family, which sits above application-specific integrated circuits (ASICs) in flexibility but below them in performance and power efficiency for high-volume production. The Fusion family uniquely combines FPGA fabric with analog blocks, flash memory, and clock management, making it a system-on-chip (SoC) solution for mixed-signal applications. Key features include 1.5M system gates, 38,400 logic elements, 252 user I/Os, and an operating supply voltage of 1.5 V. The device supports a maximum clock frequency of 350 MHz and is built on 130 nm CMOS technology. The Fusion architecture integrates a 12-bit ADC, analog comparators, and large flash memory blocks, enabling true mixed-signal design in a single device. The 676-ball FBGA package provides excellent thermal and electrical performance for high-density designs. Technically, the M1AFS1500-2FGG676 uses a flash-based FPGA fabric, which is non-volatile and secure, retaining configuration even without power. This eliminates the need for external configuration memory and provides instant-on operation. The integrated analog block includes a 12-bit successive approximation register (SAR) ADC with sample rates up to 600 kSPS, along with analog comparators and a voltage reference. The device also features up to 1 Mbit of flash memory for data storage and boot code. Typical applications include industrial control, medical devices, automotive electronics, and aerospace systems where mixed-signal processing, reliability, and security are critical. The Fusion FPGA's ability to handle both analog and digital functions reduces board space and BOM cost, making it ideal for compact, high-reliability designs. When designing with this device, ensure proper power supply decoupling on the 1.5 V core and I/O banks. The flash-based fabric requires no external configuration device, simplifying the design, but careful attention to analog block routing and grounding is essential to maintain ADC accuracy. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the M1AFS1500-2FGG676.

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M1AFS1500-2FGG676I - Fusion FPGA 1.5M Gates | Microchip
M1AFS1500-2FGG676I

M1AFS1500-2FGG676I - Fusion FPGA 1.5M Gates | Microchip

The Microchip Technology M1AFS1500-2FGG676I is a Fusion mixed-signal FPGA from the Fusion family, integrating configurable analog, large flash memory blocks, comprehensive clock generation and management circuitry, and high-performance flash-based programmable logic in a monolithic device. It features 1.5 million system gates, 38,400 logic cells, and operates at a maximum clock frequency of 350 MHz, housed in a 676-ball FBGA package with 1.00 mm terminal pitch. A Fusion FPGA is a field-programmable gate array that combines programmable logic with analog and memory resources on a single chip. This integration allows designers to replace multiple discrete components with one device, reducing board space and improving system reliability. The Fusion family is part of the broader FPGA category, which sits within the programmable logic device hierarchy, ultimately falling under embedded processing and integrated circuits. Key features include 1.5M gates, 38,400 logic cells, 252 user I/Os, 276,480 total RAM bits, and a supply voltage range of 1.425V to 1.575V. The device is flash-based, providing instant-on capability and secure IP protection with 128-bit flash lock and AES decryption. It operates over an industrial temperature range of -40°C to +100°C, making it suitable for harsh environments. The Fusion architecture integrates a 12-bit ADC, analog comparators, and a real-time counter, enabling mixed-signal system design without external components. The flash-based configuration is non-volatile, so the FPGA is ready immediately upon power-up, eliminating the need for external boot memory. This reduces system cost and complexity while enhancing security. Typical applications include motor control, power management, industrial automation, and medical devices where analog monitoring and digital control are required. The device's ability to handle both analog and digital functions makes it ideal for smart power supplies, battery management systems, and sensor interfaces. When designing with this FPGA, consider the 1.5V core supply and the need for proper decoupling. The flash-based architecture allows for secure remote updates, but ensure the AES key is managed appropriately. The 676-ball FBGA package requires careful PCB layout for thermal and signal integrity. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the M1AFS1500-2FGG676I.

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M1AFS1500-FG256 - 1.5M Gate Mixed-Signal FPGA, 119 I/O | Microchip
M1AFS1500-FG256

M1AFS1500-FG256 - 1.5M Gate Mixed-Signal FPGA, 119 I/O | Microchip

The Microchip Technology (Microsemi) M1AFS1500-FG256 is a Fusion family mixed-signal FPGA integrating 1.5 million system gates, 119 user I/Os, and 276480 bits of flash-based resources in a 256-ball LBGA (FBGA) package, operating from a 1.5V core supply across 0C to +70C. A mixed-signal FPGA is a field-programmable gate array that combines flash-based programmable logic fabric with configurable analog blocks, memory, and clock management circuitry on a single monolithic die. Within the programmable logic hierarchy (FPGA -> programmable SoC -> programmable logic semiconductor), the Fusion family is unusual in integrating analog peripherals such as ADCs, voltage and current monitors, RTC, and large flash memory blocks alongside the fabric. Key features of the M1AFS1500 variant include the largest fabric of the standard Fusion lineup, an embedded ARM Cortex-M1 soft processor option, flash-based configuration (no external boot device required), and comprehensive on-chip clock generation and management. The 130nm flash technology gives instant-on, non-volatile operation valued in power-sensitive and security-conscious systems. The architecture mitigates ASIC migration at higher volumes, making Fusion a cost-effective ASIC replacement for consumer, networking and communications, computing, and avionics markets, according to the manufacturer datasheet. Typical applications include industrial control with analog monitoring, embedded processing with the Cortex-M1, power-supply supervision, and secure system control. Design consideration: confirm the FG256 pin map against the 334-page Fusion family datasheet, since only devices sharing the same package are pin compatible (with the PQ208 exception for AFS250/AFS600). This page synthesizes distributor pricing, drop-in same-package alternatives, and design notes not found in the manufacturer datasheet. Pricing references are as of 2026-09-02.

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M1AFS1500-FG256I - Fusion Mixed-Signal FPGA, 1.5M Gates | Microchip
M1AFS1500-FG256I

M1AFS1500-FG256I - Fusion Mixed-Signal FPGA, 1.5M Gates | Microchip

The Microchip Technology (Microsemi) M1AFS1500-FG256I is a Fusion family mixed-signal FPGA offering 1.5 million system gates, 119 user I/O, and 276480 bits of flash memory in a 256-ball LBGA (FG256) package rated for the industrial temperature range. It integrates flash-based programmable logic, configurable analog blocks, ARM Cortex-M1 soft processor support, and clock management circuitry in a monolithic 130-nm, 7-layer metal CMOS die. A mixed-signal FPGA is a field-programmable gate array that combines digital programmable fabric with analog peripherals such as ADCs, comparators, and voltage monitors on a single chip. Within the power-management hierarchy, such devices replace a discrete FPGA plus external analog-monitoring ICs, MCU, and configuration flash, reducing BOM count and board area while enabling true single-chip system solutions. Key features include nonvolatile flash programming that retains configuration when power is removed, Live at Power-Up (LAPU) operation so the device is functional within microseconds of power application, 350 MHz system performance, and 128-bit flash-based security locking with industry-standard AES decryption for protecting IP and configuration data. The flash fabric also eliminates the external configuration PROM required by SRAM FPGAs. The Fusion architecture embeds large flash memory blocks alongside VersNet analog routing and configurable analog modules, allowing power-supply supervision, fan monitoring, and temperature sensing to be implemented in the same die as the digital control logic. Fabric operates from a 1.5V core supply typical of 130nm flash-based FPGA technology. Typical applications include system power sequencing and supervision, board-level health monitoring, industrial automation control, and embedded processing nodes using the ARM Cortex-M1 soft core. The single-chip integration of analog monitoring plus digital control makes it a strong fit for intelligent power management in servers and telecom shelves. When designing with this device, remember that flash FPGAs are inherently secure and instant-on, but analog block ranges and I/O banking rules in the Fusion datasheet must be validated against your system voltages before layout lock. This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design guidance not found in the manufacturer datasheet.

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M1AFS1500-FG256K - 1.5M-Gate Fusion Mixed-Signal FPGA | Microchip
M1AFS1500-FG256K

M1AFS1500-FG256K - 1.5M-Gate Fusion Mixed-Signal FPGA | Microchip

The Microchip (Microsemi/Actel) M1AFS1500-FG256K is a Fusion family mixed-signal FPGA with 1.5 million system gates, 119 user I/O, and an embedded ARM Cortex-M1 hard processor core, housed in a 256-ball LBGA (FG256) package and rated for military-extended temperature operation (K suffix). A mixed-signal FPGA is a field-programmable gate array that combines digital programmable fabric with configurable analog blocks, flash memory, and clock management circuitry on a single monolithic die. Within the power-management hierarchy of system design, such devices can replace discrete MCU-plus-analog-FPGA two-chip solutions, consolidating voltage monitoring, fan control, and digital sequencing logic into one programmable device. Key features include flash-based programmable logic (276480 flash cells per DigiKey data), the ARM Cortex-M1 embedded processor running soft/hard IP workloads, integrated configurable analog peripherals, and comprehensive on-chip clock generation and management. The FG256 256-LBGA package exposes 119 user I/O, and the K temperature grade supports -55C to +100C junction operation per distributor data, targeting defense and industrial platforms. The Fusion architecture is built on 130nm flash technology operating from a nominal 1.5V core supply (1.425V to 1.575V range per distributor listings). Because configuration data is stored in on-chip flash, the device is live-at-power-up, requires no external configuration PROM, and offers inherent resistance to configuration tampering compared with SRAM FPGAs. The M1 prefix denotes Fusion devices pre-integrated with the ARM Cortex-M1 processor, allowing C-code firmware and Verilog/VHDL logic to coexist in one die. Typical applications include system power sequencing and board management, industrial automation control, military and avionics subsystems requiring extended temperature grades, and embedded control systems that benefit from combining an ARM processor with analog monitoring and programmable logic. Designers should plan power rails around the 1.5V core and appropriate I/O bank voltages, and verify I/O bank assignment early since the FG256 package provides 119 I/O distributed across banks. This page synthesizes distributor pricing, drop-in same-family alternatives, package data, and practical design notes not found in a single manufacturer source.

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M1AFS1500-FG484 - Fusion FPGA 1.5M Gates 484-BGA | Microchip
M1AFS1500-FG484

M1AFS1500-FG484 - Fusion FPGA 1.5M Gates 484-BGA | Microchip

The Microchip Technology (Microsemi) M1AFS1500-FG484 is a Fusion mixed-signal FPGA integrating 1.5 million equivalent gates, 38,400 logic cells, and 223 user I/Os in a 484-ball FBGA package operating from a 1.5V core supply on a 130nm flash-based process. A mixed-signal FPGA is a field-programmable gate array that combines digital programmable logic fabric with on-chip analog peripherals, flash configuration memory, and clock management circuitry in a single monolithic die. Within the semiconductor hierarchy, it sits above standard digital FPGAs and below full custom ASICs, occupying the system-on-chip programmable logic segment of the power and processing ecosystem. Key features of the M1AFS1500-FG484 include flash-based configuration that is instant-on at power-up, eliminating the need for an external configuration PROM; 128-bit flash-based security lock with industry-leading AES decryption to protect programmed IP; and integrated configurable analog blocks alongside large flash memory blocks, which distinguishes Fusion from purely digital FPGA families. The architecture uses a flash-based programmable fabric that mitigates the need for ASIC migration at higher volumes, making the Fusion family a cost-effective ASIC replacement. According to the manufacturer datasheet, Fusion devices begin working as soon as system power is applied within normal operating specifications, a significant advantage over SRAM FPGAs that require boot time and are vulnerable to configuration readback attacks. Typical applications span consumer electronics, networking and communications equipment, computing platforms, avionics, and industrial systems that benefit from mixed-signal integration, secure flash configuration, and high I/O count in a ball-grid-array footprint. When designing with this device, plan power distribution for the 1.5V core and appropriate I/O bank voltages, and verify BGA escape routing density for the 484-ball footprint early in layout. This page synthesizes distributor pricing from multiple sources, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.

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M1AFS1500-FG484K - 1.5M Gate Fusion FPGA 484-BGA | Microchip
M1AFS1500-FG484K

M1AFS1500-FG484K - 1.5M Gate Fusion FPGA 484-BGA | Microchip

The Microchip Technology (formerly Microsemi) M1AFS1500-FG484K is a Fusion mixed-signal FPGA integrating 1.5 million system gates, 223 user I/Os, and an embedded ARM Cortex-M1 hard processor core in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package. Fabricated on a 130nm process at a 1.5V core voltage, it combines programmable logic with on-chip flash memory-based configuration and analog peripherals on a single die. A Fusion FPGA is a field-programmable gate array that adds mixed-signal functionality - such as on-chip analog-to-digital conversion, voltage/temperature monitoring, and flash-based configuration memory - to standard programmable fabric. Within the power management hierarchy, the M1AFS1500 sits above smaller Fusion devices like the M1AFS600 and M1AFS250, serving as a single-chip system controller that can replace discrete supervisor ICs, ADCs, and an MCU plus FPGA two-chip solution. Key features include the ARM Cortex-M1 soft/hard-capable processor interface for embedded control, 276480 flash-based configuration cells per DigiKey listing data, 223 user I/Os for board-level connectivity, and security features inherent to flash-based FPGA technology that resist bitstream cloning versus SRAM FPGAs. The flash fabric eliminates the need for an external configuration PROM, reducing BOM cost and boot time. Technically, the device operates from a 1.5V core supply with 130nm process geometry and supports the Actel/Microsemi Libero SoC design flow. The K suffix in the part number denotes the commercial temperature grade option within the FG484 package family; I-suffix variants extend to industrial temperature ranges. Typical applications include industrial power supply and system monitoring, smart grid metering, medical instrumentation, military/aerospace system controllers, and embedded control systems that benefit from single-chip analog monitoring plus logic integration. Design consideration: verify the exact temperature grade and speed grade suffix ordering, as the K/I/G suffix combinations change commercial vs industrial rating and lead-free status - confirm against the manufacturer ordering information before BOM release. This page synthesizes distributor pricing, drop-in family alternatives, and practical design guidance not consolidated in the manufacturer datasheet.

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M1AFS1500-FG676 - 1.5M Gate Fusion FPGA, 252 I/O | Microchip
M1AFS1500-FG676

M1AFS1500-FG676 - 1.5M Gate Fusion FPGA, 252 I/O | Microchip

The Microchip Technology M1AFS1500-FG676 (originally Microsemi Fusion) is a mixed-signal flash-based FPGA with 1.5 million equivalent gates, 38,400 logic cells, and 252 user I/O, housed in a 676-ball FBGA package operating from a 1.5V core supply. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of programmable logic blocks and interconnects that designers configure in the field, sitting within the broader hierarchy of programmable logic devices (PLDs -> CPLDs -> FPGAs -> system-on-chip programmable SoCs). The Fusion family is distinctive because it integrates configurable analog blocks, large flash memory, comprehensive clock generation and management circuitry, and flash-based programmable logic in a single monolithic die, reducing bill-of-materials count versus discrete FPGA-plus-analog solutions. Key features include flash-based configuration (no external boot PROM required and instant-on operation as soon as system power is within specification), 130nm flash CMOS process technology, a maximum clock frequency of 350 MHz (referenced by distributors as 1098.9 MHz toggle-class performance), AES decryption with a 128-bit flash-based lock for secure IP protection, and a commercial operating range of 0C to +70C with SMD/SMT mounting. The Fusion architecture mitigates the need for ASIC migration at higher volumes, making it a cost-effective ASIC replacement across consumer, networking and communications, computing, and avionics markets. Technically, the M1AFS1500 combines lookup-table-based logic fabric with hardened mixed-signal peripherals: analog conditioning, PWM generators, and voltage/temperature monitoring that traditionally required external supervisory components. The 676-ball FBGA (FG676) footprint provides high I/O density for wide bus interfaces while remaining reworkable with standard BGA reflow equipment. Typical applications include industrial control with integrated analog monitoring, power-supply supervision and sequencing, secure communications and networking line cards, embedded computing interfaces, and avionics subsystems that benefit from instant-on, secure flash configuration. When designing with this device, respect the nominal 1.5V core supply (1.425V to 1.575V range), plan power sequencing per the manufacturer datasheet, and route high-speed I/O with controlled impedance on the outer BGA balls. This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet.

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M1AFS1500-FG676I - 1.5M Gate Fusion FPGA 676-FBGA | Microchip
M1AFS1500-FG676I

M1AFS1500-FG676I - 1.5M Gate Fusion FPGA 676-FBGA | Microchip

The Microchip (Microsemi) M1AFS1500-FG676I is a Fusion mixed-signal FPGA from the AFS1500 family featuring 1.5 million system gates, 252 user I/O, and 1.5V core operation on a 130nm flash-based process, housed in a 676-ball Fine-Pitch Ball Grid Array (FBGA) industrial-temperature package. A field-programmable gate array (FPGA) is a semiconductor device containing a matrix of configurable logic blocks (CLBs) interconnected by programmable fabric, allowing designers to implement custom digital circuits after manufacturing. Within the programmable logic hierarchy, the Fusion family sits in Microchip's (formerly Microsemi/Actel) flash-based FPGA portfolio, occupying the mixed-signal niche between pure digital ProASIC3 devices and radiation-tolerant RTAX space parts. Key differentiating features of the Fusion family include configurable analog blocks (ADC, monitors) integrated on the same die, large flash memory blocks, comprehensive clock generation and management circuitry (PLL/CCC), and high-performance flash-based programmable logic in a monolithic device. The flash-based fabric is inherently non-volatile and secure: no configuration PROM is required at power-up, and bitstream readback is prevented by design, which matters for defense and industrial designs where IP protection is mandatory. Technically, the device is fabricated on a 130nm flash process with a 1.5V core supply, and family documentation cites an internal performance figure of 1098.9 MHz. Because configuration cells are flash rather than SRAM, the device achieves very low static power and high resistance to single-event configuration upsets compared with SRAM FPGAs, and the M1 prefix denotes the Fusion mixed-signal variant with analog subsystem access. Typical applications include industrial automation and motor control where on-die analog monitoring replaces external ADCs, embedded systems requiring secure non-volatile configuration, power-supply supervision and board-management controllers, and aerospace/defense ground equipment using the industrial-temperature I-grade device. Design consideration: the 676-FBGA package demands controlled-impedance PCB stackup and precise ball-map fan-out; verify power-rail sequencing of the 1.5V core versus I/O banks in your layout before tape-out. This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet, with pricing as of 2026-09-02.

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M1AFS1500-FGG256 - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip
M1AFS1500-FGG256

M1AFS1500-FGG256 - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip

The Microchip Technology M1AFS1500-FGG256 is a Fusion mixed-signal FPGA with 1.5 million system gates, 38,400 logic cells, and 119 user I/Os, housed in a 256-ball LBGA (S-PBGA-B256) package with a 1.00 mm ball pitch. The M1 prefix denotes a Fusion FPGA integrating an ARM Cortex-M1 hard processor core, combining flash-based programmable logic with embedded processing in a monolithic device. A field-programmable gate array (FPGA) is a semiconductor device containing a matrix of configurable logic blocks (CLBs) interconnected by programmable routing, allowing designers to implement custom digital circuits after manufacturing. FPGAs sit above standard logic ICs and below application-specific ASICs in the semiconductor hierarchy, and the Fusion family extends the concept further by adding configurable analog blocks, large flash memory, and clock management circuitry on the same die. Key features of the M1AFS1500-FGG256 include flash-based configuration (live at power-up, no external boot PROM required), an embedded ARM Cortex-M1 processor running up to 350 MHz, 276,480 bits of flash memory, and 119 available I/Os for system interfacing. The integrated clock generation and management circuitry reduces external component count compared to SRAM FPGAs that need separate configuration memory and clock devices. Architecturally, the device is built in CMOS process technology and integrates programmable analog peripherals, system flash, and flash-based fabric in one monolithic chip, giving single-chip mixed-signal capability for control, monitoring, and data-conversion tasks. The ARM Cortex-M1 soft-to-hard migration path allows code written for soft-core implementations to run on this hardened core with higher performance. Typical applications include industrial automation and motor control, embedded system controllers, power monitoring and smart grid equipment, aerospace and defense systems, and medical instrumentation where mixed-signal integration and single-chip reliability matter. For design, verify the 256-ball footprint land pattern and reflow profile against the Microchip LBGA recommendations, and confirm supply sequencing per the Fusion datasheet power-up requirements. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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M1AFS1500-FGG256I - Fusion FPGA, 1.5M Gates | Microchip
M1AFS1500-FGG256I

M1AFS1500-FGG256I - Fusion FPGA, 1.5M Gates | Microchip

The Microchip M1AFS1500-FGG256I is a Fusion mixed-signal Field Programmable Gate Array (FPGA) with 1.5 million system gates, 276,480 bits of RAM, and 119 user I/Os, housed in a 256-ball FBGA (17x17 mm) package. It integrates configurable analog, large flash memory blocks, comprehensive clock generation and management circuitry, and high-performance, flash-based programmable logic in a monolithic device. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs sit between ASICs (application-specific ICs) and microprocessors in the design hierarchy: they offer the parallelism and determinism of hardware while retaining the reconfigurability of software. The Fusion family adds mixed-signal capability, making it a system-on-chip (SoC) that combines programmable logic, analog front-end, and non-volatile flash memory. Key features include 1.5M system gates, 119 user I/Os, 276,480 bits of RAM, and an operating voltage of 1.425V to 1.575V. The device operates over the industrial temperature range of -40°C to +100°C (TJ). It is RoHS3 compliant and comes in a tray packaging. The Fusion architecture integrates a 12-bit ADC, analog comparators, and a programmable analog multiplexer, enabling true mixed-signal design in a single device. Technically, the M1AFS1500 is built on a 130nm flash-based process, providing instant-on, non-volatile, and secure configuration. It includes an embedded ARM Cortex-M1 processor option, comprehensive clock generation with PLLs, and up to 1 Mbit of flash memory. The flash-based architecture eliminates the need for external configuration memory, reducing BOM cost and improving security against reverse engineering. Typical applications include motor control, industrial automation, smart grid, medical devices, and aerospace systems where mixed-signal processing, reliability, and security are critical. The integrated analog front-end and flash memory make it ideal for sensor conditioning, data acquisition, and closed-loop control. When designing with this device, ensure adequate decoupling on the 1.5V core supply and follow the recommended power-up sequencing. The flash-based configuration is instant-on, but the analog block requires settling time after power-up. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the M1AFS1500-FGG256I.

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M1AFS1500-FGG256K - Fusion FPGA 1.5M Gates | Microchip
M1AFS1500-FGG256K

M1AFS1500-FGG256K - Fusion FPGA 1.5M Gates | Microchip

The Microchip M1AFS1500-FGG256K is a Fusion mixed-signal Field Programmable Gate Array (FPGA) with 1.5 million system gates, 276,480 bits of flash memory, and 119 user I/Os, housed in a 256-ball FBGA (FGG256) package. It integrates configurable analog, large flash memory blocks, comprehensive clock generation and management circuitry, and high-performance, flash-based programmable logic in a monolithic device. The M1 prefix denotes Fusion FPGAs, which combine FPGA fabric with an ARM Cortex-M1 processor option and analog blocks. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs are part of the programmable logic device (PLD) family, which sits above ASICs in flexibility and below microcontrollers in ease of use for complex parallel processing. The Fusion family adds mixed-signal capabilities, making it a system-on-chip (SoC) solution that integrates analog front-end, flash memory, and programmable logic in one device. Key features of the M1AFS1500-FGG256K include 1.5M system gates, 276,480 bits of flash memory, 119 user I/Os, and support for 1.5V core voltage. It operates at a maximum frequency of 1098.9 MHz (internal) and is fabricated in 130nm technology. The device includes configurable analog blocks such as ADCs, DACs, and comparators, along with clock generation and management circuitry. It is available in a 256-ball FBGA package with a tray packaging option. Technically, the Fusion FPGA architecture combines flash-based FPGA fabric with embedded flash memory and analog blocks. The flash-based configuration is non-volatile, meaning the device retains its configuration without external boot memory. The analog blocks include a 12-bit ADC, 8-bit DAC, and comparators, which can be configured via the FPGA fabric. The device supports multiple I/O standards and includes PLLs for clock management. Typical applications include industrial control, automotive, medical, and aerospace systems where mixed-signal processing and reliability are critical. The M1AFS1500-FGG256K is suitable for motor control, power management, sensor interfacing, and data acquisition systems. Its flash-based architecture provides instant-on capability and high security against reverse engineering. When designing with this device, consider the 1.5V core supply and the need for proper decoupling. The FBGA package requires careful PCB layout for thermal and signal integrity. Use the Microchip Libero SoC design suite for configuration and programming. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the M1AFS1500-FGG256K.

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M1AFS1500-FGG484I - Fusion FPGA 1.5M Gates 484-BGA | Microchip
M1AFS1500-FGG484I

M1AFS1500-FGG484I - Fusion FPGA 1.5M Gates 484-BGA | Microchip

The Microchip Technology M1AFS1500-FGG484I is a Fusion mixed-signal FPGA with 1.5 million system gates, 38,400 logic cells, and 223 user I/Os, housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package rated for the industrial temperature range of -40C to +85C. The M1 prefix denotes a Fusion FPGA that integrates an ARM Cortex-M1 soft processor, allowing a complete MCU-plus-FPGA system on one chip. A field programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks, programmable interconnects, and I/O cells that designers configure in the field via hardware description languages such as Verilog or VHDL. Within the programmable logic hierarchy, the Fusion family occupies the mixed-signal FPGA tier, combining flash-based programmable fabric with configurable analog blocks, large flash memory, and clock management circuitry in a monolithic 130nm CMOS device. Key features include flash-based configuration (no external boot flash required, instant-on startup), an embedded ARM Cortex-M1 processor for embedded control, comprehensive on-chip clock generation and management, and configurable analog peripherals such as ADC, comparators, and voltage monitors that reduce external bill-of-material cost. The 1.5V core supply and up to 350 MHz fabric operation support demanding computation and data-path designs. Technically, the device is built on a 130nm flash-based process, which provides inherent design security and immunity to configuration upset compared with SRAM FPGAs. The fabric provides 276,480 bits of user memory alongside hard FIFOs and clock conditioning circuits, and the FGG484 ball-grid package delivers dense, reliable surface-mount interconnect for high-I/O designs. Typical applications include industrial automation controllers, mixed-signal sensor aggregation, portable instrumentation, motor control, and secure embedded systems where the ARM Cortex-M1 handles protocol stacks while the fabric implements custom logic interfaces. When designing with this device, verify power-rail sequencing of the 1.5V core and I/O banks, and confirm that the industrial -40C to +85C rating covers the worst-case junction temperature under your thermal budget. This page synthesizes distributor pricing, drop-in same-package alternatives, design notes, and application guidance not found in the manufacturer datasheet, with pricing as of 2026-09-02.

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M1AFS1500-FGG484K - 1.5M Gate Fusion FPGA, 223 I/O | Microchip
M1AFS1500-FGG484K

M1AFS1500-FGG484K - 1.5M Gate Fusion FPGA, 223 I/O | Microchip

The Microchip Technology M1AFS1500-FGG484K is a Fusion mixed-signal FPGA delivering 1.5 million system gates, 276480 bits of embedded flash-based RAM, and 223 user I/Os in a 484-pin FBGA (23x23 mm) package operating from a 1.425V to 1.575V core supply. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic blocks and programmable interconnects that the designer wires together after manufacturing, unlike fixed-function ASICs. FPGAs sit within the broader hierarchy of programmable logic devices, above CPLDs in density, and are a cornerstone of modern digital system design, prototyping, and application-specific acceleration. The M1AFS1500 belongs to the Fusion family, which is distinctive for integrating configurable analog blocks, large flash memory blocks, comprehensive clock generation and management circuitry (CCC), and flash-based programmable logic on a single monolithic die fabricated in 130nm technology. The M1 prefix denotes Fusion devices with an embedded ARM Cortex-M1 soft processor, enabling single-chip MCU-plus-FPGA designs. Flash-based programming means the configuration is non-volatile, requiring no external configuration PROM and providing instant-on behavior and inherent resistance to configuration bitstream interception compared with SRAM FPGAs. Typical applications include industrial automation and motor control (leveraging the analog blocks and Cortex-M1), instrumentation and test equipment, aerospace and defense systems requiring non-volatile secure FPGAs, and mixed-signal embedded control where discrete ADC, supervisor, and FPGA chips are being consolidated. A key design consideration is supply integrity: the 1.5V core rail must stay within the 1.425V to 1.575V window with proper decoupling, and the 484-ball FBGA requires careful via-in-pad breakout planning for the 223 I/O banks. This page synthesizes verified distributor pricing, drop-in family alternatives from the Fusion portfolio, and engineering selection guidance not found in the manufacturer datasheet.

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M1AFS1500-FGG676 - 1.5M-Gate Fusion Mixed-Signal FPGA | Microchip
M1AFS1500-FGG676

M1AFS1500-FGG676 - 1.5M-Gate Fusion Mixed-Signal FPGA | Microchip

The Microchip Technology (Microsemi) M1AFS1500-FGG676 is a Fusion family mixed-signal FPGA with 1,500,000 equivalent gates, 38,400 logic cells, 252 user I/Os, and a 1.5V core supply, housed in a 676-ball fine-pitch FBGA (FGG676) package. It integrates flash-based programmable logic, configurable analog blocks, large flash memory, and clock management circuitry in a single monolithic die fabricated on a 130nm CMOS process. A mixed-signal FPGA is a field-programmable gate array that combines digital programmable fabric with analog peripherals such as ADCs, voltage/temperature monitoring, and GPIO with analog capability. In the system hierarchy, the M1AFS1500 sits at the FPGA / programmable logic / system-on-chip level of semiconductor devices, reducing board-level component count by absorbing supervisory, monitoring, and configuration functions that traditionally require separate MCUs and analog ICs. Key features include flash-based configuration (live at power-up, no external configuration PROM required), 128-bit flash lock with industry-standard AES decryption for IP security, a maximum clock frequency of 350 MHz per distributor-documented specifications, and a wide supply range of 1.425V to 1.575V. The Fusion fabric also supports soft ARM Cortex-M1 or MicroBlade processor implementations within the same device. Architecturally, the device uses Microsemi flash-based switch technology rather than SRAM cells, giving it instant-on behavior, inherent immunity to configuration readback attacks, and significantly lower static power than comparable SRAM FPGAs. The 676-ball FGG676 package provides sufficient I/O for high-density designs while remaining suitable for reflow soldering in standard surface-mount assembly. Typical applications include industrial automation and motor drive supervision, power supply monitoring and control, portable instrumentation, aerospace subsystems, and secure embedded control where single-chip integration of analog monitoring and digital logic reduces BOM cost and board area. A key design consideration is thermal and power budgeting: the 676-ball package requires adequate PCB copper area for heat dissipation, and designers should use Microchip Libero SoC design tools for implementation, since Fusion is supported only in that toolchain. This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with all data verified as of 2026-09-02.

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M1AFS1500-FGG676I - 1.5M Gate Fusion FPGA 676FBGA | Microchip
M1AFS1500-FGG676I

M1AFS1500-FGG676I - 1.5M Gate Fusion FPGA 676FBGA | Microchip

The Microchip (Microsemi) M1AFS1500-FGG676I is a Fusion mixed-signal FPGA from the Fusion family, offering 1.5 million system gates built on 130nm flash-based technology, operating from a 1.5V core supply (1.425V to 1.575V) in a 676-ball Fine-Pitch Ball Grid Array (FBGA, 27x27 mm) industrial package with 252 user I/Os. A Fusion FPGA is a field-programmable gate array that integrates programmable logic fabric with mixed-signal peripherals on a single die. Within the programmable logic hierarchy (FPGA -> programmable logic device -> semiconductor), the Fusion family is distinctive because it embeds analog blocks - configurable ADC inputs, voltage/temperature monitoring, and RTC - alongside flash-based fabric that retains configuration without external boot flash, simplifying power management and system monitoring designs. Key features of the M1AFS1500-FGG676I include 1.5M system gates on 130nm flash technology, 252 user I/O pins, a 1.5V core voltage rail, industrial temperature rating (-40C to +100C as indicated by the 'I' suffix), and the 676-ball FBGA footprint. The fabric supports common FPGA functions including state machines, bus bridging, glue logic consolidation, and control-plane processing. Technically, the flash-based fabric gives Fusion devices inherent single-chip configurability: no external configuration PROM is required, configuration data survives power cycles, and the device is inherently more secure against bitstream interception than SRAM FPGAs. The integrated analog peripherals offload external supervisory components such as supervisor ICs and temperature sensors, reducing BOM count in power-monitoring and industrial control designs. Typical applications include industrial automation controllers, power-supply supervisory and sequencing systems, portable instrumentation, military/aerospace control electronics, and bridge logic in mixed-signal subsystems - anywhere single-chip programmable logic plus analog monitoring shortens design cycles. A key design consideration: plan the 676-FBGA layout carefully - ball-collapse BGA packages require controlled-impedance stackups, via-in-pad or dog-bone fanout strategies, and X-ray inspection capability at assembly. This page synthesizes distributor pricing, same-family drop-in speed-grade and package alternatives, and practical design notes not found in the manufacturer datasheet. Pricing as of 2026-09-02.

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M1AFS250-1FG256 - 250K Gate Fusion FPGA, ARM Cortex-M1 | Microchip
M1AFS250-1FG256

M1AFS250-1FG256 - 250K Gate Fusion FPGA, ARM Cortex-M1 | Microchip

The Microchip (Microsemi) M1AFS250-1FG256 is a Fusion family mixed-signal FPGA integrating 250K system gates, an embedded ARM Cortex-M1 soft processor, and 36864 bits of user flash memory in a 256-ball LBGA (FG256) package with 114 user I/Os. Built on 130nm flash-based technology, it operates from a 1.5V core supply and supports system performance up to 1282.05 MHz per FindIC specification summaries. A Fusion FPGA is a field-programmable gate array that combines flash-based programmable logic fabric with configurable analog blocks, large flash memory, and comprehensive clock generation and management circuitry on a single monolithic die. Within the programmable-logic hierarchy, it sits alongside and often replaces standalone FPGA plus MCU plus analog-front-end chipsets, functioning as a complete system-on-chip (SoC) for mixed-signal designs. Key features include flash-based configuration that is instantly live at power-up (no external configuration PROM required), a 128-bit flash-based lock and industry-leading AES decryption for securing programmed IP and configuration data, and integration of analog peripherals for monitoring and control. The ARM Cortex-M1 processor core allows software and firmware development alongside the hardware fabric using standard ARM toolchains. The architecture merges ProASIC3-class flash fabric with analog conditioning blocks, making it well suited to single-chip designs that previously required separate FPGA, microcontroller, voltage/current monitoring, and security circuitry. Because configuration data resides in on-chip flash, the device resists readback attacks and boots deterministically at power application. Typical applications include industrial automation and motor control, aerospace and defense systems requiring secure configuration, power-supply monitoring and management, and embedded control systems consolidating MCU plus FPGA functions. Design consideration: the 1.5V core and 256-ball BGA footprint demand careful power-integrity and PCB layout planning; verify per-ball assignment against the manufacturer datasheet before routing. This page synthesizes distributor pricing, pin-compatible drop-in alternatives within the Fusion family, and practical design notes not found in the manufacturer datasheet.

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M1AFS250-1FG256I - 250K Gate Fusion FPGA, 114 I/O | Microchip
M1AFS250-1FG256I

M1AFS250-1FG256I - 250K Gate Fusion FPGA, 114 I/O | Microchip

The Microchip Technology M1AFS250-1FG256I is a Fusion mixed-signal FPGA delivering 250,000 system gates, 36,864 D flip-flops, and 114 user I/O in a 256-ball LBGA (FBGA) package measuring 17 mm x 17 mm x 1.2 mm. It operates from a 1.5V core supply (1.425V to 1.575V) across an industrial temperature range of -40C to +85C. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks, programmable interconnects, and I/O cells that the designer configures after manufacturing. Unlike ASICs, FPGAs are reprogrammable in the field, making them the flexible middle tier of the digital hierarchy: gates -> FPGAs -> structured ASICs -> hardwired ASICs. The Fusion family extends this concept by being a mixed-signal FPGA, integrating configurable analog blocks, flash memory, and clock management on a monolithic die. The M1 prefix denotes Fusion devices that embed an ARM Cortex-M1 soft processor, allowing a single chip to host both microcontroller-class firmware and custom hardware acceleration. Flash-based configuration means the device is live at power-up, requires no external configuration PROM, and provides inherent tamper resistance and instant-on behavior prized in secure and aerospace-adjacent designs. Architecturally, Fusion combines flash-based programmable logic fabric, large flash memory blocks, configurable analog peripherals (voltage monitors, temperature sensors, current monitoring through integrated circuitry), and comprehensive on-chip clock generation and management circuitry. The -1 speed grade and industrial temperature rating (suffix I) target extended-temperature industrial and communications equipment. Typical applications include industrial automation controllers, mixed-signal system consolidation, embedded motor control with the Cortex-M1, power-supply supervision, and communications line-card logic. Designers should budget the 1.5V core rail with the 1.425V-to-1.575V tolerance in mind and reserve flash-based configuration for designs that must boot instantly without external boot devices. This page synthesizes distributor pricing tiers, drop-in same-package alternatives across the Fusion family, and practical design notes not consolidated in the manufacturer datasheet.

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M1AFS250-1FGG256 - Fusion FPGA 250K Gates | Microchip
M1AFS250-1FGG256

M1AFS250-1FGG256 - Fusion FPGA 250K Gates | Microchip

The Microchip Technology M1AFS250-1FGG256 is a Fusion mixed-signal Field Programmable Gate Array (FPGA) with 250,000 system gates, 114 user I/Os, and 36,864 bits of flash memory, housed in a 256-ball FBGA (FGG256) package. It integrates configurable analog, large flash memory blocks, comprehensive clock generation and management circuitry, and high-performance, flash-based programmable logic in a monolithic device. The M1 prefix denotes Fusion FPGAs, which combine FPGA fabric with an ARM Cortex-M1 processor and programmable analog. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. FPGAs are part of the programmable logic device family, which sits between fixed-function ASICs and general-purpose processors. They offer reconfigurability, parallel processing, and rapid prototyping capabilities, making them essential in applications ranging from aerospace to industrial automation. The Fusion family specifically adds analog and memory resources, blurring the line between FPGA and SoC. Key features include 250K system gates, 114 user I/Os, 36,864 bits of flash memory, and support for 1.5V core voltage. The device operates at a maximum clock frequency of 350 MHz and contains 6,144 logic cells. It is manufactured using 130nm CMOS technology, providing a balance of performance and power efficiency. The Fusion architecture includes an ARM Cortex-M1 soft processor, programmable analog blocks, and flash memory for non-volatile storage of configuration and data. The M1AFS250-1FGG256 integrates a complete mixed-signal system on a single chip. The flash-based fabric retains configuration without external boot memory, simplifying system design and enhancing security. The programmable analog blocks allow for configurable analog front-ends, while the clock generation and management circuitry supports multiple PLLs and clock conditioning. This integration reduces board space, component count, and system cost compared to discrete solutions. Typical applications include motor control, industrial automation, medical devices, and aerospace systems where reliability and mixed-signal integration are critical. The device's flash-based architecture provides instant-on operation and immunity to configuration bitstream corruption, making it suitable for safety-critical applications. The 256-ball FBGA package offers a compact footprint with 114 I/Os for interfacing with sensors, actuators, and communication buses. When designing with this FPGA, consider the 1.5V core supply and the need for proper decoupling and power sequencing. The flash-based configuration eliminates the need for external configuration devices, but the analog blocks require careful layout to minimize noise. The device supports JTAG programming and in-system reconfiguration, facilitating development and field updates. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the M1AFS250-1FGG256.

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M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip
M1AFS250-1FGG256I

M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip

The Microchip Technology M1AFS250-1FGG256I is a Fusion mixed-signal, flash-based FPGA with 250,000 equivalent system gates, up to 114 user I/O, and a 350 MHz system performance ceiling, housed in a 256-ball LBGA (FBGA, 1.00 mm ball pitch) industrial-grade package rated from -40C to +85C on a 1.5 V core supply. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory rather than an external configuration device. Within the programmable logic hierarchy - FPGA -> programmable logic device -> digital IC -> semiconductor - flash FPGAs occupy the single-chip, instant-on niche, because unlike SRAM FPGAs they retain their program when powered off and are Live at Power-Up (LAPU) without a boot sequence. Key features of the M1AFS250-1FGG256I include the advanced 130-nm, 7-layer-metal flash-based CMOS process, nonvolatile configuration storage, a 128-bit flash-based security lock with industry-leading AES decryption for protecting programmed IP, and single-chip integration that removes the external boot flash required by SRAM FPGA architectures. The M1 prefix denotes Fusion devices with optional ARM support, integrating an ARM Cortex-M1 hard processor alongside configurable analog blocks, large flash memory blocks, and comprehensive clock generation and management circuitry in a monolithic device. Technically, the Fusion fabric combines flash-based look-up-table logic with mixed-signal peripherals such as analog-to-digital conversion channels, comparators, and programmable system clocks, allowing sensing, control, and state-machine logic to reside on one die. As system power is applied and within normal operating specifications, Fusion devices are immediately working - a decisive advantage for industrial control, power supervision, and safety-interlock functions that cannot tolerate configuration latency. Typical applications include industrial automation controllers, motor drive supervision, smart power management, portable instrumentation, and defense/aerospace subsystems where instant-on operation and IP security matter. When designing with this device, verify I/O bank voltage assignments and analog block allocation early in the floorplan, since the 256-FBGA footprint fixes ball assignments across the Fusion family, enabling later speed-grade or density migrations on the same PCB. This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.

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