M1AFS1500-FGG676I - 1.5M Gate Fusion FPGA 676FBGA | Microchip
部品番号: M1AFS1500-FGG676I ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $128.5 | $128.50 |
| 10 | $118.2 | $1,182.00 |
| 100 | $104.6 | $10,460.00 |
| 500 | $96.4 | $48,200.00 |
| 1,000 | $89.9 | $89,900.00 |
M1AFS1500-FGG676I 概要
A Fusion FPGA is a field-programmable gate array that integrates programmable logic fabric with mixed-signal peripherals on a single die. Within the programmable logic hierarchy (FPGA -> programmable logic device -> semiconductor), the Fusion family is distinctive because it embeds analog blocks - configurable ADC inputs, voltage/temperature monitoring, and RTC - alongside flash-based fabric that retains configuration without external boot flash, simplifying power management and system monitoring designs.
Key features of the M1AFS1500-FGG676I include 1.5M system gates on 130nm flash technology, 252 user I/O pins, a 1.5V core voltage rail, industrial temperature rating (-40C to +100C as indicated by the 'I' suffix), and the 676-ball FBGA footprint. The fabric supports common FPGA functions including state machines, bus bridging, glue logic consolidation, and control-plane processing.
Technically, the flash-based fabric gives Fusion devices inherent single-chip configurability: no external configuration PROM is required, configuration data survives power cycles, and the device is inherently more secure against bitstream interception than SRAM FPGAs. The integrated analog peripherals offload external supervisory components such as supervisor ICs and temperature sensors, reducing BOM count in power-monitoring and industrial control designs.
Typical applications include industrial automation controllers, power-supply supervisory and sequencing systems, portable instrumentation, military/aerospace control electronics, and bridge logic in mixed-signal subsystems - anywhere single-chip programmable logic plus analog monitoring shortens design cycles.
A key design consideration: plan the 676-FBGA layout carefully - ball-collapse BGA packages require controlled-impedance stackups, via-in-pad or dog-bone fanout strategies, and X-ray inspection capability at assembly.
This page synthesizes distributor pricing, same-family drop-in speed-grade and package alternatives, and practical design notes not found in the manufacturer datasheet. Pricing as of 2026-09-02.
ドロップイン代替品: M1AFS1500-FGG676I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: M1AFS1500-FGG676I （同一形状・フットプリント） — 相違点: Package, Family, System Gates, Core Supply Voltage, RoHS Status.
クイック比較ツール — 並列比較する代替部品を選択:
M1AFS1500-FG676I
✅ ドロップイン✓ 在庫あり
$425.73 / 個
データシートを見る →M1AFS1500-1FGG676I
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →M1AFS1500-2FGG676I
✅ ドロップイン✓ 在庫あり
$59.6 / 個
データシートを見る →AFS1500-FGG676I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
M1AFS1500-FGG676I 最大定格＆電気的特性
| Family | Fusion (Mixed-Signal FPGA) |
| System Gates | 1500000 |
| Technology | 130 nm Flash-based |
| User I/O | 252 |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) |
| パッケージ | 676-ball FBGA (27 x 27 mm) |
| 動作温度 | -40C to +100C (Industrial) |
| Configuration | Flash-based, single-chip, live-at-power-up |
| Max Frequency | 1098.9 MHz (system-level per distributor listing) |
| 実装タイプ | Surface Mount |
| Data Stream Support | 8, 16, and 32 bit |
| Analog Peripherals | Integrated mixed-signal (ADC, voltage/temperature monitoring) |
| RoHS ステータス | Compliant |
| Speed Grade | Standard (no dash speed suffix) |
M1AFS1500-FGG676I 676-ball fbga (27 x 27 mm) ピン配置ガイド
M1AFS1500-FGG676I (676-ball fbga (27 x 27 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: M1AFS1500-FGG676I.
詳細は データシート をご参照ください。
主な用途
M1AFS1500-FGG676I の用途: 6 件s: Industrial Automation Control, Power Supply Supervision and Sequencing, Military and Aerospace Control Electronics, Portable and Handheld Instrumentation, Bridge Logic and System Integration, Networking and Communication Line Cards.
Industrial Automation Control
The M1AFS1500-FGG676I suits industrial automation controllers that need both programmable logic and system supervision. Its 1.5M-gate flash fabric implements state machines, motor-control sequencing, and fieldbus glue logic, while the integrated analog block (ADC, voltage and temperature monitoring) replaces discrete supervisor ICs, cutting BOM count and board area. Because configuration is stored in on-chip flash, the controller is live at power-up with no external boot device - important in factory equipment that must resume deterministically after power dips. The industrial -40C to +100C rating covers unconditioned cabinet environments. Designers should budget I/O for the 252-user-I/O limit when interfacing multiple sensors and actuators.
おすすめ
Power Supply Supervision and Sequencing
The Fusion family was explicitly designed for intelligent power management, and the M1AFS1500-FGG676I exemplifies this: its embedded analog peripherals monitor multiple supply rails through the on-chip ADC with programmable thresholds, implement programmable power-up/down sequencing in the flash fabric, and log voltage/temperature excitation events. The 1.5V core (1.425-1.575V) and 676-ball FBGA with 252 I/Os support dense multi-rail backplane designs. Compared with a discrete supervisor plus separate FPGA, the single-chip approach reduces quiescent overhead and eliminates configuration boot delay, so rails can be supervised from the first milliseconds of startup. Threshold accuracy and ADC range should be verified against the family datasheet for each rail being monitored.
おすすめ
Military and Aerospace Control Electronics
Flash-based Fusion FPGAs are widely used in defense and aerospace control electronics because the configuration data is non-volatile and resistant to bitstream interception - there is no external configuration read at power-up to capture. The M1AFS1500-FGG676I provides 1.5M gates of reprogrammable fabric for interface bridging, telemetry formatting, and actuator control, with the -40C to +100C industrial range and Microchip's long-lifecycle policy supporting multi-year programs. The 252 user I/Os support 8/16/32-bit data streams to mixed-voltage peripherals. For radiation-sensitive orbits, pair with Microchip RTAX-series rad-hard devices (e.g., RTAX2000S) rather than relying on commercial Fusion, which is not radiation qualified.
おすすめ
Portable and Handheld Instrumentation
Battery-operated instruments benefit from the M1AFS1500-FGG676I's single-chip architecture: the flash fabric eliminates the external configuration flash's standby and inrush power, and the integrated voltage/temperature monitoring supports battery health display without a separate fuel-gauge IC. The 1.5M-gate capacity handles display interface bridging, sensor aggregation, and control state machines, while 252 user I/Os cover keypads, LCDs, and mixed-voltage sensor buses. The 676-ball 27x27 mm FBGA suits instruments with room for a mid-size BGA; for truly compact handhelds, the 484-ball M1AFS1500-FGG484I variant reduces footprint at the cost of I/O count. Verify ADC input range against battery voltage for direct monitoring.
おすすめ
Bridge Logic and System Integration
The M1AFS1500-FGG676I is a natural fit for consolidating bridge logic - memory controllers, bus format conversion, and legacy-interface emulation - into one reprogrammable device. The flash fabric supports 8, 16, and 32-bit data streams per distributor documentation, enabling wide parallel buses to legacy peripherals alongside serial interfaces. Because the design is reprogrammable in-system via JTAG with FlashPro, interface changes late in a program can be absorbed without respinning the PCB. The 252 user I/Os of the 676-ball package provide ample pin budget for wide parallel buses; designers should check I/O bank voltage compatibility in Libero SoC before mixing 3.3V legacy buses with 1.8V memory interfaces on adjacent banks.
おすすめ
Networking and Communication Line Cards
In networking line cards and communication backplanes, the M1AFS1500-FGG676I performs control-plane functions - PHY management, LED sequencing, hot-swap control, and board health monitoring - while the integrated analog block watches rail voltages and die temperature across the card. The 1.5M-gate flash fabric implements I2C/SPI masters for managing multiple transceivers, and 252 user I/Os connect status and control signals across the backplane. Flash configuration means the card is manageable immediately at hot-swap insertion, with no configuration download delay. Industrial temperature rating tolerances telecom cabinet environments; for high-availability systems, implement redundant FPGA images in the on-chip flash via Libero SoC design partitioning.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: M1AFS1500-FGG676I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | M1AFS1500-FG676I | M1AFS1500-1FGG676I | M1AFS1500-2FGG676I | M1AFS1500-FGG484I |
|---|---|---|---|---|---|
| Package | 676-FBGA (27x27 mm) | 676-FBGA - same footprint | 676-FBGA - same footprint | 676-FBGA - same footprint | 484-FBGA - different |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 |
| Core Voltage | 1.5 V (1.425-1.575 V) | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | Standard | Standard | -1 (slower) | -2 (faster) | Standard |
| Temperature Range | -40C to +100C (Industrial) | Industrial (I suffix) | Industrial (I suffix) | Industrial (I suffix) | Industrial (I suffix) |
| Configuration | On-chip flash (single chip) | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
主な差別化要因
- Full 252 user I/O count in highest-I/O Fusion package （vs M1AFS1500-FGG484I)
- Standard speed grade balances cost and timing （vs M1AFS1500-1FGG676I)
- Industrial temperature rating （vs M1AFS1500-FG676 (commercial))
設計ノート
The 676-ball FBGA (1.0 mm pitch, 27x27 mm) requires controlled BGA fanout: use via-in-pad with filled and capped vias where layer count allows, otherwise dog-bone fanout with 0.15 mm trace/0.15 mm space on the outer layer. Plan at least 6-8 signal layers to escape 252 used balls. Specify X-ray inspection at assembly since ball joints are not optically inspectable. Follow the Fusion PCB layout guidelines in the Microchip hardware user guide for decoupling placement.
Supply the 1.5V core rail within 1.425-1.575V (per distributor spec) and add bulk plus high-frequency decoupling (e.g., multiple 100 nF ceramics plus 47 uF bulk per bank). Estimated: at full toggle rates on 252 I/Os, core plus I/O current can reach the ampere range - size the buck converter and copper pours for the measured power figure from Libero SoC's SmartPower analysis rather than worst-case datasheet numbers.
The 'I' suffix means industrial -40C to +100C; do not substitute a commercial-temp variant (no 'I') in industrial programs even if the footprint matches. Also confirm speed-grade timing in Libero SoC: the -1 and -2 grades share the same die but differ in static timing margins. When migrating from AFS1500-FGG676I legacy numbering, verify date-code and compliance certificates with the distributor.
コンプライアンス情報
RoHS compliant and lead-free per distributor listings for Microsemi/Microchip Fusion devices. REACH and halogen-free status should be confirmed via Microchip's product compliance documentation for the specific date code.
