M2GL005-1VF400
M2GL005-1VF400 - 6K LEs, 169 I/O IGLOO2 FPGA | Microchip
The Microchip Technology M2GL005-1VF400 is an IGLOO2 low-density field-programmable gate array with 6K logic elements, 169 I/O, and a 400-LFBGA package. It is a programmable semiconductor used to implement bridging, I/O expansion, data conversion, system management, and secure connectivity functions. The -1 suffix identifies the device speed grade, while VF400 denotes its 400-ball package configuration.
An FPGA is a reconfigurable digital integrated circuit whose logic, interconnect, and I/O functions can be programmed after manufacture. Within the semiconductor hierarchy, the M2GL005-1VF400 belongs to the FPGA and CPLD class, using configurable logic blocks, programmable routing resources, memory, and I/O blocks. Compared with fixed-function logic ICs, this architecture allows design changes, field updates, and implementation of multiple control functions in one device.
The device provides approximately 6K logic elements and 169 I/O, making it suitable for low-density bridging, protocol conversion, peripheral interconnection, and embedded control tasks. Its 400-LFBGA package supports a high connection count for designs requiring substantial external signal access. The manufacturer identifies the M2GL005 family as being in production and recommends it for communications, industrial, and general-purpose programmable-logic applications.
The IGLOO2 architecture integrates programmable logic with embedded memory and configurable I/O. Engineers can map counters, state machines, datapaths, communication interfaces, and control functions into a compact device while retaining the flexibility to revise logic through reprogramming. Exact core voltage, memory capacity, supported I/O standards, and operating-temperature limits must be confirmed in the manufacturer datasheet before final schematic and timing closure.
Typical applications include industrial protocol bridges, embedded serial-interface adapters, I/O expansion, platform management logic, and secure-connectivity controllers. It is also appropriate for compact control modules that need parallel logic alongside programmable serial communication. Designs requiring higher logic density or numerous high-speed interfaces should be compared with larger IGLOO2 devices before committing the PCB footprint.
The principal hardware considerations are BGA escape routing, clean power and ground distribution, decoupling, and signal-integrity validation. Because the package exposes 400 balls, use the manufacturer's pin-information guide and package drawings for power, ground, configuration pins, and I/O placement. Preserve the prescribed configuration interface and program the device through a supported toolchain or embedded programming solution.
This page combines package, device-family, application, and replacement context with practical guidance for schematic capture, layout, programming, and migration decisions. It helps engineers distinguish electrically similar M2GL005 variants by package, grade, temperature designation, and qualification rather than treating every similarly named orderable part as a drop-in substitute.
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