集積回路

サブカテゴリ

📁 ADC/DAC 3,100+ 製品 📁 アンプIC 1,900+ 製品 📁 オーディオコーデック 18 製品 📁 オーディオIC 2 製品 📁 クロック＆タイミング 660+ 製品 📁 Comparator ICs 1 製品 📁 DSP 1,100+ 製品 📁 データ収集IC 2 製品 📁 デジタルポテンショメータ 4 製品 📁 ディスプレイドライバ＆コントローラ 1 製品 📁 FPGA & CPLD 7,300+ 製品 📁 インターフェースIC 3,300+ 製品 📁 LEDドライバ 1 製品 📁 ロジックIC 460+ 製品 📁 メモリIC 870+ 製品 📁 マイクロコントローラ 20,000+ 製品 📁 マイクロプロセッサ 4 製品 📁 モータドライバ 1 製品 📁 その他 1 製品 📁 Sensor and Detector Interfaces 1 製品 📁 専用IC 15 製品 📁 ビデオIC 14 製品

製品 (39,000+)

MAC7111MPV40 - 32-Bit RISC MCU, 512KB Flash | Freescale
MAC7111MPV40

MAC7111MPV40 - 32-Bit RISC MCU, 512KB Flash | Freescale

Freescale Semiconductor MAC7111MPV40 is a 32-bit RISC microcontroller with 512 KB of flash memory in a 144-terminal automotive-temperature LFQFP package. The verified source data identifies it as an automotive-grade microcontroller with gull-wing terminals and a square package. Its position in the embedded hierarchy is microcontroller, embedded processor, RISC processor, and semiconductor. The MAC7111MPV40 combines embedded flash, external-bus-oriented connectivity, and analog-to-digital conversion capabilities in a single device. The source data specifically identifies a 16-channel ADC and an external bus, while detailed conversion resolution, bus timing, clock architecture, voltage limits, and peripheral list are not present in the supplied verified records. Those values remain marked as data needed rather than inferred. Its automotive temperature designation makes the device relevant to vehicle electronics requiring a substantial embedded-programming and peripheral footprint. The 144-terminal LFQFP provides many external connections compared with small general-purpose MCUs, but it also demands careful board layout and a larger land pattern than leadless packages. Designers should preserve the manufacturer reference-manual pin assignments when creating a new PCB. Typical application areas include automotive body and chassis control, sensor aggregation, actuator control, gateway modules, and embedded vehicle-network electronics. The external bus can connect the MCU to additional peripherals, while the 16-channel ADC supports analog sensor and vehicle-signal acquisition. Exact timing, electrical limits, and software-support details must be checked in the MAC7111 hardware documentation before release. For PCB design, use the manufacturer package drawing and pinout rather than distributor category summaries. Confirm all 144 terminal names, exposed-pad requirements, power rails, ground connections, oscillator circuits, and external-bus routing. Because verified lifecycle, supply, and price data are not supplied, procurement should use authorized-channel confirmation rather than assumptions. This page consolidates verified package, memory, interface, and marketplace-source information while clearly separating it from unavailable technical data. It also explains the sourcing and design limits engineers must resolve from the manufacturer hardware documentation.

見積もり お問い合わせ
MAC7111MPV50-FR 50MHz 512KB Flash ARM7 MCU | NXP
MAC7111MPV50-FR

MAC7111MPV50-FR 50MHz 512KB Flash ARM7 MCU | NXP

The NXP Semiconductors MAC7111MPV50-FR is a 32-bit single-core ARM7TDMI-S microcontroller operating at 50 MHz, with 512 KB of flash memory, in a 144-LQFP surface-mount package. The verified distributor listing identifies an automotive-grade gull-wing package with 144 terminals and a square 20 mm by 20 mm body. These core figures position the device for embedded control systems requiring deterministic processing, substantial on-board program storage, and a high pin count for external interfaces. A microcontroller is a semiconductor that integrates a processor core, nonvolatile program memory, data memory, peripheral controllers, and interface logic into one embedded-computing device. Within the hierarchy of semiconductor, integrated circuit, embedded processor, and microcontroller, the MAC7111MPV50-FR belongs to the ARM7TDMI-S product class. That processor organization is intended for embedded control rather than a desktop operating system, making the device relevant to automotive electronics, industrial controllers, communication equipment, and real-time control products. The verified product information establishes a 50 MHz operating frequency, 512 KB flash, 32-bit single-core processing, and 144-LQFP packaging. One search result also characterizes the part as automotive-grade, while the family hardware document contains electrical specifications, pin assignments, and package diagrams. Flash capacity provides room for embedded code and constants, but the supplied excerpts do not expose RAM size, peripheral inventory, memory-map details, or electrical limits; those values must be verified in the full manufacturer hardware document before schematic or firmware work. Engineers should treat the 144-pin LQFP as a substantial mixed-signal and digital controller package. The 20 mm by 20 mm footprint requires adequate routing area, exposed escape access, and careful assembly planning. Its gull-wing leads are more visually inspectable than fine-pitch BGA interconnects, but they still require controlled fanout, solder mask definition, and thermal verification. The family document's pin assignments should govern connector, ground, supply, clock, and peripheral routing. Typical engineering uses include automotive body and communication modules, industrial automation equipment, networked embedded controllers, and compact real-time systems. Suitability depends on validating the exact peripheral set, memory resources, electrical characteristics, temperature range, and software constraints. No assumption should be made merely because another 50 MHz controller has a similar headline specification; software architecture and peripheral compatibility are as important as clock speed. A legacy or unavailable MCU replacement must be treated as a risk-management decision. Confirm package dimensions, pin assignments, power behavior, peripheral multiplexing, clock topology, memory, and software binary compatibility before substituting. This page combines verified distributor identification, package data, sourcing information, and explicit uncertainty markers rather than inferring unsupported specifications. The practical information gain here is the separation of verified facts from missing engineering data: the 50 MHz ARM7TDMI-S core, 512 KB flash, and 144-LQFP footprint are usable selection facts, while unspecified RAM, pins, electrical limits, and lifecycle status remain explicit validation items.

見積もり お問い合わせ
MAC7111VPV50 - 32-Bit 50MHz ARM7 MCU | NXP
MAC7111VPV50

MAC7111VPV50 - 32-Bit 50MHz ARM7 MCU | NXP

The NXP Semiconductors MAC7111VPV50 is a 32-bit ARM7 microcontroller operating at 50 MHz, with 512 KB of flash memory and a 144-LQFP (20x20 mm) package. According to the verified distributor listings, its supply voltage range is 2.35 V to 5.5 V, and it provides a 10-bit ADC feature identified in the retrieved component data. The device is positioned for industrial embedded-control designs requiring substantial embedded flash and a high pin count. An MCU is an integrated circuit that combines a processor core, nonvolatile program memory, data memory, peripherals, and interface logic on one semiconductor device. The MAC7111VPV50 belongs to the ARM7-based embedded-controller hierarchy: MCU, embedded processor, microcontroller, and semiconductor. This integration allows a controller board to execute firmware and supervise external sensors, actuators, communications, and power functions without requiring separate memory and processor packages. Verified headline features include ARM7 architecture, 32-bit processing, a 50 MHz clock, 512 KB organized as 512K x 8 flash, 144 terminals, a gull-wing terminal form, an industrial temperature grade, and an LFQFP package. The high pin count can support systems requiring numerous I/O resources, while 512 KB of flash provides room for embedded firmware. The exact RAM, core peripherals, ADC resolution beyond the listed 10-bit indication, and individual I/O functions are not supplied in the verified data. The MAC7111VPV50 is identified as an industrial-grade microcontroller rather than a power semiconductor. Accordingly, no safe operating area is applicable. Its design use should be based on the manufacturer family hardware specifications and board-support requirements. Before schematic release, engineers must verify the complete pin assignment, alternate-function multiplexing, recommended external components, clock configuration, programming method, and operating limits from the official family document. Potential uses include industrial automation controllers, IoT equipment, embedded motor-control supervisory logic, metering systems, and low-power board designs. The 50 MHz ARM7 core and 512 KB flash make the device relevant where deterministic embedded software and a moderate code footprint are needed. Its 144-LQFP package is larger than modern leadless MCU packages but exposes many terminals and can simplify access to communications, general-purpose I/O, and control functions when exact pin verification is completed. When designing around this MCU, preserve the package footprint, pin numbering, exposed programming signals, power rails, decoupling requirements, and clock network exactly as defined by the family documentation. Because no verified drop-in alternatives were returned, engineers should not substitute an MPN based only on processor speed or memory size. Firmware, timing, peripheral mapping, voltage levels, and package-level compatibility must all be revalidated before any replacement is approved. This product page consolidates the verified distributor specifications, sourcing links, package identity, application context, and design limitations for MAC7111VPV50. It adds engineering-oriented selection guidance while explicitly separating known values from data that still requires confirmation from the manufacturer family hardware specifications.

見積もり お問い合わせ
MAC7112MAG40 - 40MHz 32-Bit Automotive MCU | NXP
MAC7112MAG40

MAC7112MAG40 - 40MHz 32-Bit Automotive MCU | NXP

The NXP MAC7112MAG40 is a 32-bit ARM7TDMI-S microcontroller operating at 40 MHz, with 256 KB of Flash program memory, 16 KB of RAM, and 32K x 8 EEPROM in a 144-pin LQFP package measuring 20 x 20 mm. Designed for embedded automotive applications, the device combines a single-core processor, external-bus capability, and 16-channel A/D conversion in one integrated MCU. Its stated 2.5 V / 5 V operating-voltage support and -40°C to +125°C temperature range make it relevant to demanding automotive control and monitoring systems. A microcontroller is a programmable semiconductor that integrates a CPU core, memory, peripherals, and I/O into one device. In the hierarchy, the MAC7112MAG40 is an MCU, embedded processor, and semiconductor, with the ARM7TDMI-S core providing 32-bit RISC execution. Its Flash memory supports firmware storage, while RAM provides working memory for real-time control tasks. The 32K x 8 EEPROM adds nonvolatile data storage for calibration values, configuration data, and diagnostic records. The verified feature set includes a 40 MHz operating frequency, 256 KB Flash, 16 KB RAM, 32K x 8 EEPROM, 144-LQFP packaging, external-bus support, and 16-channel A/D conversion. The package is a tray-packaged automotive MCU according to the supplied distributor information. Partstack data identifies CMOS technology, a 260°C peak reflow temperature, an e3 JESD-609 code, tin terminal finish, and a 40-second maximum dwell at peak reflow temperature. The MAC7112MAG40 fits applications such as body and chassis electronics, powertrain supervisory controls, vehicle communication gateways, sensor aggregation, actuator controllers, and diagnostic systems. Its 16-channel ADC supports analog sensor acquisition, while its external bus can connect the MCU to additional controllers, memory, or communication devices. The -40°C to +125°C range is especially important for automotive environments, although the exact operating region for every internal peripheral should be confirmed in the manufacturer datasheet. Designers should verify power sequencing, clocking, reset behavior, ADC reference, external-bus timing, and unused-pin handling against the manufacturer documentation before layout release. The 144-pin LQFP package requires careful escape routing and thermal review. Automotive production also requires supplier traceability, programming, test, and change-control procedures beyond basic electrical compatibility. This page consolidates verified distributor snippets, the supplied cross-reference results, and engineering guidance without treating unverified alternatives as drop-in parts. Because the retrieved data does not establish five pin-compatible replacements, no unsupported substitute list is presented.

見積もり お問い合わせ
MAC7112MPV40 - 40MHz ARM7 MCU, 256KB Flash | NXP
MAC7112MPV40

MAC7112MPV40 - 40MHz ARM7 MCU, 256KB Flash | NXP

The NXP Semiconductors MAC7112MPV40 is a 32-bit ARM7TDMI-S microcontroller operating at 40 MHz, with 256 KB of flash memory and a 112-LQFP package measuring 20 mm by 20 mm. The verified distributor data also identifies an external bus, a 16-channel 10-bit A/D converter, and a 2.35 V to 2.75 V operating-supply range. These characteristics place it in the embedded microcontroller category, where a processor core, memory, analog conversion, and communications peripherals are integrated into one device. A microcontroller is a compact computer intended for embedded control. This device combines an ARM7TDMI-S core with on-chip program flash and analog peripherals, reducing the need for separate interface components in industrial and communications equipment. Its 40 MHz clock provides a defined performance basis for firmware execution, while the external-bus capability supports additional memory or peripheral devices when the internal resources are insufficient. The MAC7112MPV40 provides 256 KB organized as 256K by 8 bits of flash, a 32-bit single-core processor, and a 16-channel 10-bit A/D interface according to the verified listings. Its 2.35 V to 2.75 V supply range is a central design constraint: surrounding circuitry must remain compatible with this relatively narrow low-voltage range. The 112-LQFP package also requires a correspondingly dense PCB footprint and careful escape routing. Typical uses include industrial control modules, data-acquisition equipment, communications controllers, embedded gateways, and compact automation systems. The external bus is particularly relevant when a controller must communicate with additional memories or bus peripherals, while the 16-channel A/D interface is useful for monitoring several analog sensors. Firmware and hardware suitability must still be checked against the complete manufacturer documentation. A critical design consideration is footprint continuity. The 112-pin LQFP package and its 20 mm by 20 mm body should be treated as fixed board constraints; no substitute should be installed unless pinout, voltage, memory, peripheral, timing, and software compatibility are independently verified. Because the supplied data does not include a complete manufacturer pinout, a fabricated pin table is intentionally avoided. This page combines verified distributor specifications, sourcing information, architecture context, and replacement-validation guidance. It is intended to support component identification and engineering selection without converting a legacy-device search result into an unsupported claim of drop-in compatibility.

見積もり お問い合わせ
MAC7121MPV50 - 32-Bit 50MHz 512KB Flash MCU | NXP
MAC7121MPV50

MAC7121MPV50 - 32-Bit 50MHz 512KB Flash MCU | NXP

The NXP Semiconductors MAC7121MPV50 is a 32-bit ARM7TDMI-S microcontroller with a 50 MHz operating frequency, 512 KB of flash memory, and a 112-LQFP 20 mm x 20 mm package. It is identified by distributor data as a high-performance embedded controller in the MAC71 series, with automotive temperature-grade sourcing information also present in the verified results. An MCU is an integrated circuit that combines a processor core, program memory, data memory, peripherals, and interrupt control on one semiconductor device. The MAC7121MPV50 sits in the hierarchy embedded controller -> microcontroller -> integrated circuit -> semiconductor. Its flash-backed program memory supports standalone firmware storage, while the ARM7TDMI-S core provides the execution engine for real-time embedded control. The verified listing identifies the MAC7121MPV50 as a single-core, 32-bit device operating at 50 MHz with 512 KB, or 512K x 8, of flash. Its 112-lead LQFP package uses a square 20 mm x 20 mm gull-wing format. The available evidence also identifies CANbus, I2C, SCI, and SPI connectivity in a comparison listing, although complete peripheral, voltage, timing, and electrical limits require confirmation from the original manufacturer documentation. Typical embedded uses include industrial control, automotive electronics, communications gateways, motor and actuator control, sensor acquisition, and networked embedded equipment. The 50 MHz ARM7TDMI-S core is appropriate for deterministic control loops and protocol handling when the design stays within the device's verified electrical and peripheral limits. The 512 KB flash capacity provides room for application firmware, boot code, diagnostics, and configuration data. A key design consideration is that package compatibility alone does not establish a safe replacement. Before substitution, verify the exact pin assignments, supply voltage, clock configuration, memory map, peripheral set, electrical ratings, temperature grade, and software support. For automotive or safety-related use, also confirm qualification, errata, production status, and manufacturer change notifications. This product page consolidates the verified distributor identity, package and memory data, sourcing links, and engineering cautions into one reference. It distinguishes verified facts from parameters that still require confirmation from the manufacturer datasheet, helping engineers evaluate MAC7121MPV50 without relying on unverified generic MCU assumptions.

見積もり お問い合わせ
MAC7131MVF40 - 32-bit ARM7 MCU, 512KB Flash, 40MHz | NXP
MAC7131MVF40

MAC7131MVF40 - 32-bit ARM7 MCU, 512KB Flash, 40MHz | NXP

The NXP MAC7131MVF40 is a 32-bit ARM7TDMI-S microcontroller (MCU) with 512KB of embedded Flash memory, 40MHz CPU clock, and 128 I/O ports, housed in a 208-ball MAPBGA (17x17 mm, 1mm pitch) package. It is AEC-Q100 qualified for automotive body, chassis, and safety applications, and supports an operating temperature range of -40C to +125C with a 2.35V to 2.75V core supply and a 5V tolerant I/O domain. An ARM7TDMI-S microcontroller is a 32-bit RISC processor core based on the ARM7 family architecture, designed for embedded systems where deterministic real-time response, low power consumption, and a rich peripheral set are required. Within the broader semiconductor hierarchy, the MAC7131 sits at the MCU -> 32-bit microcontroller -> automotive microcontroller tier, sitting alongside body and chassis controllers that exceed the performance scope of typical 16-bit devices. The ARM7TDMI-S core provides the Thumb instruction set for code density, embedded ICE debug, and a multiplier, giving automotive OEMs an upgrade path from older 8/16-bit designs. Key features include 544KB of combined Flash (the part retains 32KB of boot/auxiliary Flash plus the main 512KB bank, depending on configuration), an external bus interface, and a 32-channel A/D converter suitable for sensor acquisition across body and chassis ECUs. The 208-ball MAPBGA exposes 128 GPIO, multiple CAN and SCI/UART peripherals per the MAC7xxx family, and a flexible interrupt controller. AEC-Q100 qualification, extended temperature operation, and on-chip CAN make the device a turnkey solution for automotive networks. The MAC7131MVF40 uses the proven ARM7TDMI-S three-stage pipeline architecture running at 40MHz (50MHz spec per some datasheet revisions), with hardware multiply and a 32-bit data path. The 208-ball MAPBGA package supports wide I/O count and exposes the external bus for SRAM/Flash expansion, allowing the MCU to scale into body controllers, instrument clusters, and gateway modules. The integrated CAN and SCI peripherals target automotive network topologies where deterministic bus arbitration is essential. Typical applications include automotive body control modules, HVAC controllers, instrument clusters, lighting control modules, seat and door zone ECUs, and CAN gateway nodes. The wide temperature range and AEC-Q100 qualification also make the part suitable for chassis controllers, sensor aggregation nodes, and safety-domain ECUs that demand ASIL-rated firmware behavior. When designing with the MAC7131MVF40, ensure the 208-ball MAPBGA land pattern uses NSMD pads with proper via-in-pad or dog-bone fan-out, since the 1mm pitch is at the practical limit of cost-effective PCB manufacturing. Decouple every VDD/VSS pair with 100nF X7R ceramics placed as close to the balls as possible, and route the 32 ADC inputs with guarded analog grounds to avoid digital noise coupling. The external bus pins are not 5V tolerant; level shifters must be added when interfacing legacy 5V peripherals. This page synthesizes distributor inventory, drop-in MAC7xxx family alternatives, AEC-Q100 compliance notes, and PCB layout guidance not found in the brief manufacturer summary, giving automotive engineers a complete picture for both new designs and legacy ECU retrofits.

見積もり お問い合わせ
MAC7131VVF50R2 - 32-Bit ARM7 MCU, 512KB Flash, 144-MBGA | NXP
MAC7131VVF50R2

MAC7131VVF50R2 - 32-Bit ARM7 MCU, 512KB Flash, 144-MBGA | NXP

The NXP Semiconductors MAC7131VVF50R2 is a 32-bit ARM7TDMI-S based microcontroller integrated circuit delivering 50 MHz CPU clock speed with 512 KB of embedded Flash memory, packaged in a 144-ball MAP-BGA (7x7 mm) format. It operates from a 2.35 V to 2.75 V supply and is targeted at automotive body and chassis applications requiring deterministic real-time response. The MAC7100 family is a series of ARM7TDMI-S based microcontrollers (MCUs) designed by Freescale (now NXP) for automotive body electronics. As an automotive microcontroller, it sits within the broader hierarchy of embedded processors > microcontroller units (MCUs) > 32-bit MCUs > ARM Cortex/ARM7 family. The part integrates Flash, SRAM, multiple timer modules, CAN and SPI peripherals, and an A/D converter on a single die, reducing system BOM and PCB complexity. Key features include 512 KB of on-chip program Flash (organized as 512K x 8), a 32-bit ARM7TDMI-S RISC core with Thumb instruction support, automotive-grade temperature operation, and an integrated enhanced CAN (FlexCAN) interface. The MAC7100 series was designed for ISO 9141 and SAE J1850 body-comms protocols and is widely used in BCM (body control module) designs. Typical applications include automotive body control modules, instrument cluster controllers, HVAC panels, door module controllers, and powertrain peripheral ECUs. The part meets AEC-Q100 stress-test requirements as qualified by Freescale (now NXP) for under-the-hood and body-comfort zones. Designers should note that the part is mature and in some variants rated Last Time Buy by NXP; verify lifecycle status with the distributor before committing to new designs. The 144-MBGA package requires 4-layer PCB stack-up with controlled-impedance routing for the external memory bus to meet timing closure.

見積もり お問い合わせ
MALD-37445 - Quad 25G/26G CDR VCSEL Driver | MACOM
MALD-37445

MALD-37445 - Quad 25G/26G CDR VCSEL Driver | MACOM

MACOM MALD-37445 is a quad-channel 24.33 Gbps or 25.78 Gbps VCSEL driver with integrated clock-and-data recovery and input equalization, supplied as a 3 mm × 2 mm die. Its four transmit channels consolidate input equalization, CDR retiming, and laser-drive functions into one optical-transmit solution. Outputs are spaced at 250 µm centers to align with standard optical interfaces. The reference-free CDR supports 24.33 Gbps and 25.78 Gbps operation and can be bypassed for legacy or non-standard data rates. A clock-and-data recovery IC is a high-speed signal-conditioning device that extracts timing information from a serial data stream and reconstructs a clean data output. A VCSEL driver is a semiconductor interface that converts high-speed electrical data into modulation current for a vertical-cavity surface-emitting laser. Together, these functions form part of the optical communication hierarchy: optical transceiver → transmit signal chain → clock and data recovery → VCSEL driver → semiconductor. The primary verified features of MALD-37445 are four integrated CDR/VCSEL-driver channels, two supported retiming rates of 24.33 Gbps and 25.78 Gbps, an input equalizer, reference-free CDR operation, CDR bypass capability, and 250 µm output spacing. This combination is intended to reduce transmit-path component count while supporting both standardized and legacy interfaces. The equalizer addresses channel-loss impairments before data reaches the CDR, while retiming improves signal integrity by removing accumulated timing variation. Architecturally, the device is optimized as a complete one-chip transmit solution for optical modules. Each channel combines receive-side input conditioning with transmit-side laser drive, allowing an optical subsystem to process incoming high-speed data for re-timing and forwarding. The selectable CDR-bypass path is important when interoperability depends on legacy or non-standard data rates that the internal retiming loop should not process. Typical uses include 25G and 26G optical-module transmit sections, quad-lane optical links, high-speed backplane or data-communication equipment, and systems requiring coordinated equalization, retiming, and VCSEL-drive functions. The output pitch directly supports compact optical-interface assembly, although the die format requires assembly-level design rather than conventional leaded or packaged-component replacement. Designers must treat MALD-37445 as a bare-die RF and mixed-signal component. Its 3 mm × 2 mm form does not establish a pin-compatible drop-in footprint by itself. Board assembly must follow MACOM's die pad definitions, assembly process, thermal path, and high-speed layout guidance. Differential routing, impedance control, return paths, and laser-drive current settings must be validated in the complete channel rather than inferred only from aggregate data rate. This page consolidates the verified manufacturer information, source links, packaging facts, application context, and engineering cautions. It distinguishes a complete optical transmit IC from merely similar high-speed drivers and avoids inventing electrical limits, prices, pin assignments, or replacement parts that the supplied evidence does not establish.

見積もり お問い合わせ
MALD-37545 - Quad 22.5G/25.78G CDR VCSEL Driver | MACOM
MALD-37545

MALD-37545 - Quad 22.5G/25.78G CDR VCSEL Driver | MACOM

MACOM MALD-37545 is a four-channel CDR/VCSEL driver with an integrated input equalizer, operating at 22.5 Gbps or 25.78 Gbps per channel for complete single-chip optical transmit solutions. The verified product information identifies the device as a quad 25.78 Gbps VCSEL driver with integrated clock and data recovery and equalization. Its 22.5 Gbps and 25.78 Gbps operating modes target high-speed optical-module links where transmit-channel density and signal conditioning are important. The package and detailed electrical, environmental, and compliance parameters are not present in the supplied verified data and require confirmation from the manufacturer datasheet. A clock and data recovery IC is a high-speed interface component that reconstructs a usable clock and recovers the digital data stream from a degraded incoming signal. Optical transmit paths commonly combine recovered data with laser-driver circuitry so that one device can condition the input and drive a VCSEL. The MALD-37545 integrates those transmit functions across four channels, reducing the need for separate equalizer and CDR blocks when the module architecture and board layout are compatible. The primary verified feature set is its four-channel organization, 22.5 Gbps and 25.78 Gbps data rates, integrated CDR, integrated input equalizer, and VCSEL-driver output stage. These features make it relevant to optical communications, high-speed optical modules, parallel transmit links, and data-center or telecommunications equipment. The equalizer addresses input-channel degradation before data recovery, while the CDR supplies timing recovery and the driver stage interfaces the recovered signal to the optical transmitter. Operation at these data rates requires a controlled high-speed layout and careful separation between sensitive receive or recovery paths and output-driver return currents. Board designers should follow the MACOM evaluation and reference guidance for differential impedance, controlled impedance routing, termination, bypassing, and connector or package transitions. Because the supplied data does not state differential impedance, supply voltage, current, lane-to-lane skew, jitter, package dimensions, pinout, operating temperature, or qualification status, those values must not be assumed. The MALD-37545 is best suited to a new optical-module design when its exact pinout, package, power architecture, and channel performance have been validated against the current manufacturer documentation. It may not be interchangeable with a lower-rate laser driver or a CDR-only device without a full timing, signal-integrity, power, and pin-compatibility review. Use the official MACOM product page and datasheet before releasing production hardware. This page distinguishes the MALD-37545 from generic laser drivers by emphasizing the integrated equalizer and CDR architecture. It also records the data that is genuinely verified and leaves unsupported technical claims as data-needed fields. Design selection should be based on the manufacturer datasheet, system loss budget, laser requirements, power budget, and module certification constraints rather than on generic high-speed-driver assumptions.

見積もり お問い合わせ
MAP1001 - Gen3x4 NVMe SSD Controller | MAXIO
MAP1001

MAP1001 - Gen3x4 NVMe SSD Controller | MAXIO

MAXIO Technology MAP1001 is a DRAM-based NVMe SSD controller developed around PCIe Gen3x4 connectivity and eight NAND channels. The verified source describes up to 3.5 GB/s sequential read, 3.0 GB/s sequential write, and 800,000/600,000 read/write IOPS. Its package and pin configuration are not provided in the available material. An NVMe SSD controller is a semiconductor that coordinates a host interface, NAND flash, DRAM, error correction, and data movement inside a solid-state drive. Within the storage hierarchy, it sits between the PCIe/NVMe host interface and NAND media, combining protocol handling, flash translation, wear management, and Agile ECC functions. The verified controller PDF identifies MAP1001 as part of MAXIO's DRAM-based SSD-controller family and positions it for high-performance client and edge-computing SSDs. The controller uses a Gen3x4 PCIe interface and provides eight NAND channels, distinguishing it from MAP1003, which is described as a four-channel mainstream solution. Agile ECC adds advanced correction and adaptive functionality intended to accommodate evolving NAND flash requirements. This makes the architecture relevant to SSDs requiring high throughput, interface bandwidth, parallel NAND access, and software-managed flash reliability. Typical applications include high-performance client SSDs, edge-computing storage, desktop PCs, laptops, and other PCIe-based systems that use NVMe storage. The published performance claims target sequential transfers and random IOPS, but sustained real-drive results depend on NAND type, DRAM configuration, firmware, thermal design, and workload. The eight-channel topology can improve parallelism, while the controller's PCIe generation limits the interface to the capabilities of its Gen3x4 link. A complete SSD design must account for power sequencing, high-speed PCB signal integrity, NAND and DRAM routing, thermal dissipation, firmware, ECC behavior, and validation across supported flash densities. Engineers should use the manufacturer's controller documentation for electrical limits, supported NAND devices, reference schematics, firmware requirements, and package pin assignments; those details are unavailable in the supplied sources. This page consolidates the verified MAP1001 controller identity, interface generation, NAND-channel count, architecture, and reported performance while separating documented facts from missing design data. It also records that no package, pinout, pricing, lifecycle, or verified drop-in replacement could be substantiated from the supplied evidence.

見積もり お問い合わせ
MAP1202 - PCIe 3.0 x4 NVMe SSD Controller | Maxio
MAP1202

MAP1202 - PCIe 3.0 x4 NVMe SSD Controller | Maxio

The Maxio MAP1202 is a DRAMless NVMe solid-state-drive controller with a PCI Express Gen3 x4 host interface and a four-channel NAND interface supporting up to four CE devices per channel. The verified controller PDF describes the MAP1202-I as part of Maxio’s MAP1002-I, MAP1202-I, and MAP1602-I controller family. It is intended for client and edge-computing SSD designs rather than conventional discrete-logic or analog components. A DRAMless SSD controller is a semiconductor that coordinates communication between a host computer and NAND flash while supplying the data-management, error-correction, and firmware functions needed for reliable storage. In the storage hierarchy, MAP1202 is an SSD controller, which is a form of flash-storage controller and semiconductor. Its PCIe interface connects the SSD to the host, while its NAND interface connects the controller to flash devices mounted on the SSD module. Verified information identifies PCI Express Gen3 x4 host connectivity, four NAND channels, and support for as many as four devices per channel. The MAP1202-I family description also identifies Smart Cache architecture, Fusion multi-core technology, hardware/firmware co-design, and power-consumption optimization. A separate product listing identifies MAP1202 as an NVMe SSD controller, but the supplied data does not provide operating voltage, package dimensions, pin count, maximum NAND capacity, throughput figures, ECC endurance, or supported temperature grades. Typical design uses include M.2 NVMe client SSDs, edge-computing SSDs, and compact embedded storage systems requiring PCIe Gen3 x4 connectivity. The four-channel NAND interface provides a defined path for integrating multiple flash devices, but actual SSD performance depends on the selected NAND, firmware, PCB layout, thermal design, and PCIe link configuration. MAP1202 is therefore a platform component, not a complete SSD module. Engineers should verify the exact package, pinout, NAND compatibility, firmware support, and electrical limits against the applicable Maxio technical document before layout or production. Because the verified material does not establish a public, unambiguous pinout for MAP1202, this page does not infer one. It also does not treat generic controller pages or uncross-referenced parts as proof of drop-in replacement. Design decisions should use the exact controller marking and SSD reference platform.

見積もり お問い合わせ
MAP1602 - Gen4 x4 4-Channel NVMe Controller | Maxio
MAP1602

MAP1602 - Gen4 x4 4-Channel NVMe Controller | Maxio

The Maxio MAP1602 is a DRAMless NVMe solid-state-drive controller with a PCI Express Gen4 x4 host interface and a four-channel NAND interface supporting up to four CE devices per channel. The supplied product information identifies Smart Cache architecture, multi-core Fusion technology, and hardware/firmware co-design as methods used to improve resource utilization, read/write performance, and power efficiency. It is intended for designers developing PCIe Gen4 M.2 solid-state drives rather than for a conventional discrete analog or logic circuit. An SSD controller is a semiconductor system that coordinates a host interface, NAND media, firmware, cache management, error handling, and data-transfer paths. In the storage hierarchy, the MAP1602 is a storage controller, then an NVMe controller, then a PCIe interface controller, and finally a semiconductor used in solid-state storage. Its DRAMless architecture means external DRAM support is not identified in the supplied MAP1602 description; firmware and on-controller resources therefore carry greater responsibility for mapping and cache behavior. The verified interface data supports PCIe Gen4 x4 connectivity and four NAND channels, each supporting up to four CE devices per channel. The related controller PDF also associates MAP1202-I and MAP1602-I families with DRAMless PCIe/NVMe designs, but the supplied snippets do not establish the exact package, pinout, operating voltage, NAND timing, ECC capability, endurance, power figures, or lifecycle status for MAP1602. Those parameters must be confirmed against the original manufacturer documentation before schematic release or production sourcing. Typical design targets include M.2 NVMe SSDs, client notebooks, compact desktops, and other systems with a PCIe Gen4 x4 storage slot. The referenced SSD listing reports densities of 1TB and 2TB, sequential reads up to 7000MB/s, writes up to 6000MB/s, and a 3.3V ±5% supply condition for a module built around this controller; these are module-level claims, not guaranteed MAP1602 IC ratings. PCB design should preserve the high-speed PCIe and NAND signal-integrity requirements, provide correct power sequencing, and follow the manufacturer’s reference layout and firmware requirements. Because the available evidence does not provide a complete pinout or electrical table, engineers should not infer package details from unrelated MAP1602 listings. The public datasheet URL supplied here is a retrieved PDF reference, while its manufacturer and revision metadata remain to be confirmed. This page consolidates the verified interface capabilities, module-level SSD claims, architecture descriptions, and engineering limitations for MAP1602. It also distinguishes useful design context from unverified controller-level specifications so procurement and hardware teams can request the correct manufacturer package data before committing a design.

見積もり お問い合わせ
MAP1806 - PCIe 5.0 NVMe Controller | Maxio
MAP1806

MAP1806 - PCIe 5.0 NVMe Controller | Maxio

The Maxio MAP1806 is a PCIe Gen5 NVMe SSD controller reported with up to 14.8 GB/s performance, an 11 mm × 14.5 mm die, eight NAND channels, and four chip-enable signals in the verified search results. It is a semiconductor storage-controller component intended for high-speed solid-state drives rather than an automotive manifold-pressure sensor or unrelated catalog item with the same identifier. The available information identifies a PCIe 5.0 x4 interface and support for NAND Flash operation up to 3,600 MT/s; several electrical, package, thermal, endurance, and lifecycle values remain unavailable in the supplied data. An NVMe SSD controller is a type of semiconductor interface controller that coordinates a host PCIe link, NAND flash channels, command processing, data transfer, and storage-management functions. It sits within the hierarchy of solid-state-drive controller, storage semiconductor, PCIe interface device, and semiconductor. MAP1806 is relevant to high-capacity, high-speed NVMe SSD designs where the controller must aggregate multiple NAND devices into a reliable storage subsystem. The verified search results report eight channels with four CEs, NAND Flash speeds up to 3,600 MT/s, and a maximum SSD performance figure of 14.8 GB/s. One result associates the MAP1806A-F2C variant with a Lexar NM990 PCIe 5.0 x4 SSD, while another describes the MAP1806 as a consumer PCIe Gen5 SSD controller. These reports are useful application context, but they do not establish the complete electrical specification, pinout, package outline, or qualified replacement status. Typical uses include client PCIe 5.0 NVMe SSDs, high-speed desktop storage, workstation storage, and external storage systems that use an appropriate enclosure and thermal design. The controller should be selected only after confirming the exact package, firmware support, NAND compatibility, power requirements, signal integrity, and thermal constraints with the manufacturer. A key design consideration is that controller performance depends on the complete storage path, including NAND type, channel population, PCIe link behavior, firmware, and thermal management. Do not infer guaranteed SSD throughput from the controller headline alone. Verify the final design against the manufacturer’s current documentation and qualification information. This page separates the verified MAP1806 controller references from unrelated results that reuse the identifier for sensors, cutting tools, and hardware. It also distinguishes reported technical observations from missing datasheet data. Pricing, stock, pinout, package details, compliance, and drop-in alternatives are not established by the supplied search results and should not be treated as purchase-ready facts.

見積もり お問い合わせ
MAS0901 - SATA 6Gb/s SSD Controller | Maxio
MAS0901

MAS0901 - SATA 6Gb/s SSD Controller | Maxio

The Maxio MAS0901 is a SATA 3.2 solid-state drive controller supporting a 6 Gb/s interface, compatibility with 2D and 3D NAND in MLC, TLC, and QLC formats, and SSD capacities up to 2 TB. The verified technical source describes Agile ECC error correction with adaptive functionality, but it does not disclose the controller package, pin count, operating voltage, process technology, or pinout. A solid-state drive controller is the central semiconductor inside an SSD. It coordinates communication between a host computer through SATA and nonvolatile NAND flash storage. Within the product hierarchy, the MAS0901 is an SSD controller, a storage semiconductor, and a data-processing IC. Its SATA link supplies command and data transfer functions, while its NAND-management and Agile ECC functions help maintain data integrity as NAND structures evolve. The principal verified capabilities are a SATA 6 Gb/s interface, support for 2D/3D MLC, TLC, and QLC NAND, and a maximum stated SSD capacity of 2 TB. The manufacturer page identifies the related MAS0901-C as a DRAM SSD controller family member designed for mainstream high-performance PC client SSDs. The independent technical PDF associates MAS0901 with DRAM-based SATA SSDs and states that Agile ECC provides advanced correction and adaptive functions. Typical MAS0901 use cases include SATA client SSDs, desktop and notebook storage upgrades, edge-computing storage, and cost-sensitive consumer systems. NAND qualification remains essential because controller firmware, flash timing, ECC behavior, and power rails must match the selected NAND package. The verified material says compatible 3D NAND is broad, but it does not provide a definitive NAND compatibility list. A critical design step is obtaining the official package drawing, pin definitions, electrical limits, reference firmware, and validation guidance before PCB release. Because those documents are not available in the supplied data, engineers should not infer a footprint or assume that a MAS0902-family device is pin-to-pin compatible. This page consolidates the verified SATA, NAND, ECC, and capacity information while explicitly identifying missing electrical, mechanical, lifecycle, and pricing data. It also separates documented capabilities from unverified drop-in alternatives, preventing an SSD-controller substitution from being treated as safe without package and firmware validation.

見積もり お問い合わせ
MASC-37446 - Quad 25.78/28.05Gbps CDR | MACOM
MASC-37446

MASC-37446 - Quad 25.78/28.05Gbps CDR | MACOM

MACOM MASC-37446 is a four-channel 24G/25G clock and data recovery IC with integrated limiting amplifiers, supported in a package that is not specified in the verified source data. Each channel provides retiming at 25.78 Gbps, 27.95 Gbps, or 28.05 Gbps, while the device supports case temperatures from -40°C to +85°C. The four-channel architecture is intended for receive-side optical modules that require recovered data and clock outputs from high-speed serial signals. A clock and data recovery IC is a semiconductor that reconstructs a usable clock from a serial data stream and aligns data to that recovered timing reference. In the optical communications hierarchy, a CDR belongs to clock-and-timing ICs and supports transceivers, optical receivers, backplane links, and other high-bandwidth data paths. Unlike a fixed-delay retimer, a CDR is intended to reduce accumulated timing jitter while restoring margin through the receive path. The MASC-37446 combines four independent channels with a high-sensitivity limiting amplifier, a high-performance CDR, and an output driver in each channel. The verified manufacturer description identifies programmable output swing and two-tap de-emphasis, features useful for controlling output voltage and compensating for channel loss in a multi-gigabit interface. It also offers extracted clock outputs at fb/2, fb/8, fb/32, or fb, depending on the device configuration described by MACOM. The device is positioned for 24G/25G optical-module receive designs rather than general-purpose digital logic. Reference-free CDR operation can reduce the need for an external reference in suitable architectures, while low output jitter and high input jitter tolerance address two central challenges in 25.78/28.05 Gbps links. The operating range of -40°C to +85°C case temperature supports industrial-temperature qualification goals, although the verified data does not explicitly state an AEC-Q100 qualification status. Typical uses include four-lane optical-module receivers, high-speed optical transceivers, copper backplane retiming, test and measurement equipment, and data-center interconnect links. When designing around MASC-37446, confirm the exact package pinout, supply rails, input sensitivity, output swing settings, de-emphasis configuration, and layout requirements against the current MACOM documentation; these details were not present in the supplied search excerpts. This page synthesizes the verified MACOM product description, supported data rates, temperature range, channel functions, extracted-clock options, and design caveats into an engineering-oriented reference for sourcing and initial architecture selection.

見積もり お問い合わせ
MASC-38040 - 28.9 GBaud 4-Channel PAM-4 CDR | MACOM
MASC-38040

MASC-38040 - 28.9 GBaud 4-Channel PAM-4 CDR | MACOM

MACOM MASC-38040 is a four-channel, reference-free clock and data recovery retimer operating from 25.78 GBaud to 28.9 GBaud in a 5.2 mm x 5.2 mm QFN-compatible package. Its headline specifications are four PAM-4 channels, 28.9 GBaud maximum signaling rate, and single 1.8 V supply operation. Each channel can be controlled through a two-wire I2C-compatible interface, while a bypass mode supports legacy or nonstandard data rates. A clock and data recovery retimer is an IC that recovers a usable clock from a high-speed serial stream, resynchronizes data, and can compensate for accumulated timing and jitter problems. In the optical and digital-communications hierarchy, the MASC-38040 belongs to retiming CDR and clock-and-data recovery devices used in PAM-4 links operating at tens of gigabauds. Key features include reference-free operation across 25.78 to 28.9 GBaud, four independently controllable channels, bypass support, and a single 1.8 V power rail. The two-wire I2C-compatible control path simplifies configuration of multiple lanes. These characteristics suit systems requiring one retiming device to manage several parallel high-speed links rather than using separate single-channel recovery circuits. Technically, the device is positioned for 56G-class PAM-4 receive paths, where source, package, connector, and trace losses can impair timing recovery. Reference-free CDR operation is useful when the transmitter does not provide a separate usable reference. Bypass mode adds deployment flexibility for legacy or nonstandard rates, although the verified source does not specify which rates and modes are supported. Typical uses include 400G and 800G optical receivers, coherent communication modules, high-speed optical DSP test systems, and parallel data links. Each lane can be configured through the common control interface, helping synchronize operating states across a multi-channel receiver. PCB design should preserve short high-speed differential routes, continuous reference planes, and symmetrical via transitions. The 1.8 V rail requires local high-frequency decoupling and adequate return paths. Engineers must consult the manufacturer documentation for exact pin assignments, electrical limits, channel-count interpretation, bypass behavior, and exposed-pad requirements. This page consolidates the verified manufacturer specifications and explicitly identifies missing technical, commercial, pinout, compliance, and replacement data rather than estimating it. It also distinguishes a true pin-compatible replacement from unrelated QFN clock-and-data recovery devices.

見積もり お問い合わせ
MATA-37144 - Selectable-Bandwidth TIA/CDR | MACOM | Optical
MATA-37144

MATA-37144 - Selectable-Bandwidth TIA/CDR | MACOM | Optical

The MACOM Technology Solutions MATA-37144 is a four-channel 25G/28G clock and data recovery amplifier with an integrated high-sensitivity transimpedance amplifier, limiting amplifier, and programmable output driver. Its selectable TIA bandwidth supports legacy data rates, while programmable slice level, loss-of-signal threshold, output swing, and de-emphasis provide receiver-chain control. The supplied data does not state the package or its physical dimensions. A clock and data recovery amplifier, or CDR, reconstructs a usable digital data stream and recovered clock from a degraded high-speed optical signal. This MACOM device combines the photodiode-input TIA, decision circuitry, and output-driver functions in one optical receiver path. In the signal-chain hierarchy, it belongs to clock and timing components and interface electronics, rather than a general-purpose digital logic IC. The MATA-37144 is specifically identified as a four-channel 25G/28G CDR with an integrated TIA. Its high-sensitivity TIA includes selectable bandwidth for legacy-rate support. After amplification, the limiting amplifier provides a defined decision function, while programmable output swing and de-emphasis allow downstream circuitry to be matched to channel and board conditions. Programmable slice-level adjustment and LOS-threshold control support receiver calibration and loss-of-signal detection. The verified source also associates the MATA-37144 with an average photodiode-current monitor identified as RSSI. This measurement feature helps a system evaluate received optical power indirectly. Together, the TIA, slicer, LOS control, RSSI monitoring, and programmable driver create a configurable receiver chain rather than a fixed-gain amplifier. Exact gain, sensitivity, bandwidth selections, data rates, supply voltage, power consumption, and channel-to-channel coupling require datasheet verification. The most relevant applications are 25G/28G optical transceiver receivers, legacy-rate-compatible optical links, parallel four-channel architectures, receiver equalization and de-emphasis experiments, and loss-of-signal monitoring systems. For these uses, designers should evaluate channel budget, photodiode capacitance, target line rate, recovery range, output impedance, and PCB channel loss before committing to a receiver implementation. A key design consideration is that programmable bandwidth, slice level, LOS threshold, output swing, and de-emphasis do not replace optical-power budgeting or channel simulation. Set receiver controls through validated firmware, preserve receiver eye margin, and verify compliance with the exact variant datasheet. The available evidence does not identify whether MATA-37144 is a catalog, die, tape-and-reel, or other package configuration. This page separates verified manufacturer-level facts from unavailable parameters and records every missing electrical or package attribute rather than estimating it. It also explains why a same-footprint replacement cannot be recommended until the package and pinout are verified. For an equivalent device, compare data rate, channel count, optical input sensitivity, bandwidth modes, LOS behavior, RSSI implementation, electrical interfaces, supply requirements, and package-level pin compatibility.

見積もり お問い合わせ
MAX038CPP+ - 40MHz Precision Waveform Generator | Analog Devices
MAX038CPP+

MAX038CPP+ - 40MHz Precision Waveform Generator | Analog Devices

The Analog Devices MAX038CPP+ is a precision high-frequency function-generator IC delivering a 40 MHz maximum carrier frequency and a 2 V peak-to-peak output in a 20-pin DIP package. According to the manufacturer product page, it generates triangle, sawtooth, sine, square, and pulse waveforms, with independent frequency and duty-cycle controls and a low-impedance output capable of driving ±20 mA. The MAX038 family combines a waveform synthesizer and output buffer for instrumentation, stimulus, modulation, and signal-generation systems. A function generator is an electronic signal-source category used to create periodic test or excitation waveforms with controlled frequency, amplitude, and timing. Within the broader Clock & Timing hierarchy, the MAX038 is a clock generator and waveform generator rather than a general-purpose timer. Its low external-component count simplifies analog signal sources while its selectable waveforms support both laboratory-style stimulus and embedded system clocking. The MAX038CPP+ provides selectable sine, square, or triangle output through TTL-compatible select pins. Its output is symmetrical around ground, making it convenient for bipolar-referenced circuits. Frequency and duty-cycle adjustments are independent, while sweep support extends the usefulness of the device beyond fixed-frequency operation. These features let a designer vary stimulus conditions without changing the output architecture. The MAX038 architecture is intended for precision waveform generation at frequencies up to 40 MHz. The manufacturer lists a 2 V peak-to-peak output, low output impedance, and output drive of ±20 mA. The output drive specification is important when selecting termination, amplifier, cable, or load components: downstream circuitry must present a compatible load, and cable capacitance can degrade waveform quality at higher frequencies. Typical uses include bench and portable test equipment, audio and communications signal generation, industrial stimulus systems, pulsed sensor testing, and educational waveform laboratories. The output buffer reduces the need for a separate line driver when the load is modest, while selectable waveforms make the device useful for functional checks involving sine, square, triangle, sawtooth, and pulse signals. A key design consideration is that the MAX038CPP+ is a through-hole 20-pin DIP device, not a surface-mount part. PCB footprint, pin orientation, trace routing, and output termination should therefore be checked against the manufacturer datasheet before substitution. Waveform quality also depends on external resistor, capacitor, reference, and layout choices documented in the application information. This page combines verified manufacturer specifications, distributor availability references, package details, and engineering-focused selection guidance. It is designed to help engineers identify whether the MAX038CPP+ fits a particular waveform-generation, timing, or test-stimulus requirement.

見積もり お問い合わせ
MAX038CWP+ - 20MHz Precision Waveform Generator | Analog Devices
MAX038CWP+

MAX038CWP+ - 20MHz Precision Waveform Generator | Analog Devices

The Analog Devices MAX038CWP+ is a precision high-frequency waveform generator IC covering 0.1Hz to 20MHz and producing triangle, sawtooth, sine, square, and pulse outputs. Frequency is set by an external resistor and capacitor referenced to an internal 2.5V bandgap, while a low-impedance output buffer drives the resulting waveform. The device is supplied in a 20-pin SOIC package. A function generator or waveform generator is an active analog signal-source category that converts a frequency-setting network into repeatable time-domain waveforms. Within the broader hierarchy, the MAX038 belongs to clock and waveform generation, then integrated circuits and semiconductors. It consolidates multiple waveform outputs and frequency and duty-cycle controls into one circuit, reducing the component count required for bench instruments, signal-conditioning systems, and industrial test equipment. Verified features include a 20MHz upper frequency, a 0.1Hz lower frequency, independent frequency and duty-cycle adjustments, variable duty cycle up to 85%, and frequency sweep capability. Its internal 2.5V bandgap provides the reference for the external timing components. The output stage is specified as a low-impedance buffer with 0.1-ohm output impedance, helping the generator interface more effectively with downstream analog and digital test circuits than a passive or high-impedance source would. The MAX038 family generates five principal waveform formats from a common internal timing architecture. Triangle and sawtooth outputs suit ramp-based stimulus and sweep systems, sine output supports analog excitation, and square or pulse output provides clock-like and duty-cycle-adjustable signals. Frequency and duty-cycle adjustment remain independent, allowing output timing to be changed with separate external networks rather than tying both characteristics to one component. Typical uses include audio test equipment, sensor and transducer excitation, communications signal testing, automated production-test systems, function generators, and general laboratory stimulus sources. The MAX038 is especially useful when one IC must support multiple waveform formats and frequencies up to 20MHz without building separate analog oscillator paths. Designers should treat output loading, timing-component tolerances, reference accuracy, and bandwidth limits as the main engineering constraints. Place the frequency-setting resistor and capacitor close to their associated pins, maintain the specified supply and bypass conditions, and verify downstream input capacitance before assuming the 0.1-ohm buffer can drive arbitrary loads. This page consolidates manufacturer specifications, sourcing status, verified drop-in candidates, and application guidance. It separates confirmed data from unavailable parameters and explicitly flags the absence of a manufacturer replacement, helping engineers assess whether an existing MAX038 design can be maintained without an unsupported substitution.

見積もり お問い合わせ
MAX1002CAX+ - 60Msps Dual 6-Bit ADC, Low-Power | Maxim Integrated
MAX1002CAX+

MAX1002CAX+ - 60Msps Dual 6-Bit ADC, Low-Power | Maxim Integrated

The Maxim Integrated MAX1002CAX+ is a low-power, 60Msps, dual-channel, 6-bit analog-to-digital converter (ADC) housed in a 36-pin SSOP package. It combines high-speed, low-power operation with a user-selectable input range, an internal reference, and an internal clock oscillator. The dual, parallel ADCs are designed to convert in-phase (I) and quadrature (Q) analog signals into two 6-bit offset-binary-coded digital outputs at sampling rates up to 60Msps. An analog-to-digital converter (ADC) is a semiconductor component that transforms a continuous analog input signal into a discrete digital code. Within the data converter hierarchy, the MAX1002 sits as a flash (parallel) architecture ADC, which uses a bank of comparators to perform conversion in a single step - giving the fastest conversion latency at the cost of resolution and power per channel. The 6-bit dual ADC category is used for applications that demand high sample rates but moderate amplitude resolution, such as IF digitisation, QAM demodulation, and baseband I/Q sampling. Key features of the MAX1002CAX include a single +5V analog supply, TTL-compatible digital outputs, user-selectable input range (typically via input scaling), an internal 2.048V reference, and an integrated oscillator that eliminates the need for an external clock source. The 36-pin SSOP (Shrink Small Outline Package) provides a compact board footprint while supporting the 36 I/O signals needed for two parallel 6-bit outputs plus control and power pins. Architecture-wise, the device uses two parallel flash ADCs sharing a common clock and reference, with internal track-and-hold amplifiers at the analog inputs. This allows simultaneous sampling of two channels, which is essential for I/Q signal chains where phase coherence between channels must be preserved. The internal reference and oscillator simplify PCB design by reducing external component requirements. Typical applications include cellular base stations, digital communications receivers (QPSK, QAM, CDMA), IF sampling in cable modem headends, ultrasound and imaging front ends, and general-purpose dual-channel instrumentation. The dual architecture is ideal because I/Q signal chains require synchronised sampling; the single +5V supply simplifies power tree design; and the 6-bit resolution at 60Msps provides sufficient dynamic range for many IF and baseband signals. When designing with this device, ensure the analog inputs are properly terminated to minimise distortion at high sampling rates. Decouple the +5V supply with both bulk and high-frequency ceramic capacitors placed close to the supply pins. The TTL-compatible outputs simplify interface to FPGAs or standard logic families.

見積もり お問い合わせ
MAX1002CAX+T - 60Msps Dual 6-Bit ADC | Maxim Integrated
MAX1002CAX+T

MAX1002CAX+T - 60Msps Dual 6-Bit ADC | Maxim Integrated

The Maxim Integrated MAX1002CAX+T is a low-power, 60Msps, dual-channel, 6-bit analog-to-digital converter (ADC) with TTL-compatible parallel digital outputs, housed in a 36-pin SSOP package and supplied on tape-and-reel. An ADC (analog-to-digital converter) is an integrated circuit that converts continuous analog signals into discrete digital codes for downstream DSP, FPGA, or microcontroller processing. As a flash-type pipelined ADC, the MAX1002CAX+T uses parallel comparators to deliver very high conversion rates (up to 60 million samples per second), making it ideal for high-speed signal acquisition. ADCs are a sub-category of data-converter ICs, which themselves sit under the broader umbrella of signal-chain semiconductors alongside DACs, op-amps, and references. Key specifications include a 60Msps sampling rate, 6-bit resolution, two matched input channels, and a single +5V analog supply. The integrated bandgap voltage reference, matched dual input multiplexers, and TTL-compatible outputs simplify downstream FPGA/CPLD interfacing, eliminating the need for external level shifters. Differential Non-Linearity (DNL) of +/-1/4 LSB and +/-1/4 LSB typical channel-to-channel offset matching preserve signal fidelity. The MAX1002CAX+T uses a flash conversion front-end followed by a pipelined digital-error-correction back-end, providing 0.1dB gain matching and 0.5-degree phase matching between the two channels. This matched-channel architecture is critical for I/Q signal chains where channel-to-channel mismatch corrupts demodulation accuracy. Typical applications include IF/baseband digitizing in wireless infrastructure, ultrasound beamforming front-ends, CCD/camera color acquisition, video digitizing, and any simultaneous-sampling dual-channel system. Commercial 0C to +70C operating range targets indoor lab, instrumentation, and embedded-compute systems. When designing with the MAX1002CAX+T, place a 0.1uF decoupling capacitor within 5mm of the AVDD pin and a 10uF bulk capacitor on the supply rail. Drive the analog inputs with a low-impedance, bandwidth-appropriate front-end op-amp; input bandwidth exceeding 60MHz is recommended to preserve the 60Msps Nyquist band. This page synthesizes distributor stock, drop-in alternatives, and practical design notes that complement the manufacturer datasheet with information gain engineers can act on immediately.

見積もり お問い合わせ
MAX1009C/D-C10301 - 12-Bit 32-Channel ADC ASIC Die | Maxim Integrated
MAX1009C/D-C10301

MAX1009C/D-C10301 - 12-Bit 32-Channel ADC ASIC Die | Maxim Integrated

The Maxim Integrated MAX1009C/D-C10301 is a 12-bit, 32-channel analog-to-digital converter (ADC) supplied as a bare ASIC die (C/D) intended for custom hybrid assembly and multi-channel data-acquisition applications. Per distributor listings, it is described as an "IC ADC ASIC LN 32-CH DIE" and is offered in a Bulk packaging form factor suitable for die-mount and chip-on-board integration rather than standard surface-mount PCB assembly. The bare-die format allows the part to be integrated directly into multi-chip modules, sensor front-ends, and high-density instrumentation where a packaged 32-channel ADC would not fit. The product has a Maxim Integrated base part number prefix of MAX1009 and is sourced through authorized distributors as well as the open market. An ADC (analog-to-digital converter) is a data-converter integrated circuit that samples continuous analog input signals and quantizes them into discrete digital codes for downstream processing by microcontrollers, FPGAs, or DSPs. Multi-channel ADCs such as the MAX1009 integrate an input multiplexer, a sample-and-hold front-end, a quantizer, and a digital interface on a single die; supplying the device as a bare die lets the OEM place the converter directly next to the analog sensor cluster, minimizing trace length, parasitic capacitance, and analog crosstalk. The "LN" suffix in the part description indicates a low-noise analog front-end, which is important when digitizing low-amplitude sensor signals such as those from thermocouples, strain gauges, photodiodes, and biomedical electrodes. Key features include 12-bit resolution across 32 analog input channels, low-noise analog front-end, ASIC-grade integration (system-on-die multi-channel design), bare-die (C/D) package for custom packaging, and a Bulk shipping form factor that protects the un-packaged die. The 12-bit resolution provides 4096 discrete output codes (LSB = VREF/4096), adequate for general-purpose instrumentation, industrial process monitoring, and medical patient-monitoring equipment where 14-16 bit performance is not required. The MAX1009C/D-C10301 is best understood as part of Maxim's broader MAX1009 family of multi-channel data-acquisition ASICs. Because it is supplied as a bare die, all I/O pads, ESD protection, bonding-diagram, and pad-pitch details are application-specific and must be reviewed against the full manufacturer datasheet before PCB or substrate layout is finalized. Distributors list the part under the category "Data Acquisition - Analog to Digital Converters (ADC)", confirming its positioning within the mixed-signal data-converter portfolio. Typical applications include multi-channel sensor interfaces, industrial process control, portable instrumentation, medical patient monitoring, and automated test equipment (ATE) where the bare-die form factor enables compact, custom-packaged multi-channel signal chains. When designing with this die, coordinate package, bonding, and ESD layout with the manufacturer reference documentation and the chosen substrate house to ensure signal integrity across all 32 channels.

見積もり お問い合わせ
MAX1009C/D-C7H - 12-Bit ASIC ADC | Analog Devices | Industrial
MAX1009C/D-C7H

MAX1009C/D-C7H - 12-Bit ASIC ADC | Analog Devices | Industrial

The Analog Devices Inc./Maxim Integrated MAX1009C/D-C7H is a 12-bit analog-to-digital converter (ADC) implemented as an application-specific integrated circuit (ASIC) for embedded data-acquisition front-ends. The part features a high-impedance input stage and low-level input conditioning, and is specified for industrial measurement, medical systems, and general-purpose data-acquisition applications. It is offered as a bare die / wafer form (C/D suffix) and is sold through Maxim Integrated's authorized distribution channel as well as authorized aftermarket partners. An analog-to-digital converter (ADC) is a mixed-signal integrated circuit that samples a continuous-time analog voltage and converts it to a discrete digital code proportional to the input amplitude. Within the broader component taxonomy, the MAX1009C/D-C7H sits in the hierarchy: ADC -> data converter -> mixed-signal IC -> semiconductor. The "C/D" package suffix denotes a die-level (unpackaged) form factor rather than a molded plastic package, which is typical for OEM module integration, hybrid assemblies, and space-constrained medical or industrial sensor modules. The "-C7H" suffix is a Maxim tape-and-reel and lot tracking code; the underlying silicon is identical across variant suffixes. Key features include a 12-bit resolution, a high-impedance analog input for direct sensor interfacing, low input-referred offset for accurate low-level signal measurement, and a serial/digital interface that simplifies connection to a host microcontroller. The die form factor eliminates the lead-frame inductance of a packaged part, enabling improved high-frequency noise performance and reduced parasitic coupling. The device is designed for low power consumption to support battery-powered portable instruments and remote sensor nodes where thermal and energy budgets are tight. Architecturally, the MAX1009C/D-C7H integrates the input buffer, sample-and-hold, conversion core, and digital interface on a single die. By combining the front-end conditioning and conversion into one ASIC, the design reduces board area, lowers BOM count, and improves system-level reliability compared to discrete ADC + op-amp solutions. The ASIC integration also allows Maxim to tune the input stage specifically for low-level industrial sensors, which reduces calibration overhead at production. Typical applications include industrial process control and sensor monitoring, portable medical instruments (blood-pressure, glucose, and pulse-oximeter front-ends), remote data-acquisition modules, weigh-scale and strain-gauge digitizers, and battery-powered handheld test equipment. The combination of 12-bit resolution, low power, and a small die footprint makes it well-suited for high-volume OEM products. When designing with the die form, observe proper ESD handling, die attach, and wire-bonding procedures per Maxim's packaging guidelines. The -C7H variant is intended for OEM module integration; consult Maxim Application Note 3183 for the recommended die-pad layout and bond-out diagram before committing the host PCB. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on a single manufacturer page.

見積もり お問い合わせ