MAX1231ACEG+T
MAX1231ACEG+T - 12-Bit 300ksps ADC, 16-Ch, FIFO, QSOP-24 | ADI
The Analog Devices (formerly Maxim Integrated) MAX1231ACEG+T is a low-power, 12-bit, 300 ksps, serial-output, multi-channel successive-approximation analog-to-digital converter (ADC) with an internal 2.5 V reference, an internal ±1 °C accuracy temperature sensor, and a 16-entry first-in/first-out (FIFO) buffer, housed in a 24-pin QSOP package. It accepts 8 or 16 single-ended analog inputs (or 4 or 8 true-differential pairs) through an analog multiplexer and converts them to a 12-bit serial result at up to 300,000 samples per second.
An SAR ADC (Successive Approximation Register Analog-to-Digital Converter) is a type of data converter that uses a binary-search algorithm with an internal DAC and comparator to digitize an analog input in N conversion cycles for N bits of resolution. SAR ADCs offer deterministic latency, no pipeline delay, excellent DC accuracy, and are well-suited for multiplexed multi-channel data acquisition at moderate speeds, sitting in the broader hierarchy: ADC -> data converter -> mixed-signal IC -> semiconductor.
Key features of the MAX1231ACEG+T include 300 ksps throughput, an internal 2.5V reference (4.096V on the B-grade), ±1 °C internal temperature sensor accuracy, a 16-entry FIFO for host offload, SPI/QSPI/MICROWIRE-compatible serial interface, 3 V or 3.3 V single-supply operation, low 1.6 mA (typ) operating current, software-configurable unipolar/bipolar and single-ended/differential input ranges (0 to VREF, ±VREF, 0 to 2×VREF, ±2×VREF), and QSOP-24 footprint. The FIFO allows the part to capture bursts while the host processor is busy with other tasks.
The architecture combines a low-charge-distribution input T/H with a precision SAR core, an internal bandgap-derived reference, and a digital serial engine that supports daisy-chaining of multiple MAX1227/MAX1229/MAX1231 devices on a single SPI bus. The analog inputs can be configured as 8 single-ended channels (A-com version), 16 single-ended channels (B/C versions), or as differential pairs, and the internal temperature sensor die measurement simplifies system thermal monitoring.
Typical applications include industrial process control and data acquisition, system health monitoring with on-die temperature sensing, multichannel instrumentation, battery-powered portable data loggers, factory automation sensor interfaces, and medical patient monitoring front ends. The FIFO and channel-scan modes simplify firmware by offloading periodic scan housekeeping from the host MCU.
When designing with this device, ensure that the analog input signals remain within the absolute maximum ratings (GND - 0.3 V to VDD + 0.3 V), use the recommended 0.1 µF ceramic bypass capacitor on VDD placed within 5 mm of the pin, and configure the serial-interface clock polarity/phase to match the host controller. Unused analog inputs should be tied to a defined mid-supply voltage to minimize crosstalk.
This page synthesizes distributor pricing, pin-compatible same-family Maxim drop-in alternatives, and practical design notes that are not available in the standalone manufacturer datasheet, including FIFO mode configuration guidance and SPI daisy-chain wiring tips.
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