MC9SDG128ECPVR2-FR
MC9SDG128ECPVR2-FR - 16-Bit 50MHz 128KB MCU | NXP
The NXP Semiconductors MC9SDG128ECPVR2-FR is a 16-bit HCS12X microcontroller with a 50 MHz core, 128 KB of flash memory, and a 112-LQFP 20 mm × 20 mm package. It combines an embedded automotive-oriented control architecture with connectivity identified in verified comparisons as CANbus, EBI/EMI, SPI, and I²C. The -FR orderable variant is associated with the -FR ordering information supplied by the distributor record, while the broader MC9SDG128ECPVR2 family is associated with Freescale Semiconductor, now part of NXP Semiconductors.
A microcontroller is a programmable semiconductor that integrates a processor core, memory, and peripherals on one device. The MC9SDG128ECPVR2-FR belongs to the HCS12X family and is positioned above general-purpose logic and basic 8-bit microcontrollers for applications requiring more processing performance, embedded flash, and dedicated serial interfaces. Its 16-bit word architecture and 50 MHz maximum speed make it suitable for automotive control modules, body electronics, actuator controllers, and industrial embedded systems where deterministic control and multiple peripheral functions are important.
Verified data confirms 128 KB of flash memory, a 16-bit CPU, 50 MHz operation, and a 112-LQFP package. Comparison data also identifies HCS12X connectivity including CANbus, EBI/EMI, SPI, and I²C. Electrical limits, SRAM capacity, ADC resolution, timer details, supply voltage, current consumption, temperature range, watchdog behavior, and package dimensions beyond the stated 20 mm × 20 mm package were not supplied in the verified dataset and must be confirmed from the manufacturer datasheet before design release.
The 112-LQFP package provides a high pin count relative to smaller MCU packages, supporting a broader mix of digital and analog functions while remaining a surface-mount solution. Its 20 mm × 20 mm footprint is considerably larger than compact QFN devices, so PCB designers should preserve the exact pin map, exposed thermal requirements, and recommended land pattern. The large package can simplify routing in designs with many external sensors and actuators, but it increases board area and requires careful decoupling and thermal planning.
Typical uses include automotive body-control modules, CAN-connected sensor nodes, actuator interfaces, instrument-cluster electronics, industrial automation controllers, and communication gateways. The verified 50 MHz rating and HCS12X platform provide useful performance for protocol handling and real-time control, while 128 KB flash supports embedded application code. Design engineers should verify peripheral availability, pin multiplexing, clocking, memory map, electrical limits, and toolchain support in the datasheet before selecting it for a new platform.
This page consolidates verified distributor specifications, package information, sourcing links, and design-oriented guidance. It does not infer undocumented electrical values, pin names, lifecycle claims, or a guaranteed replacement. For production procurement, confirm authorized distribution, stock status, firmware and software-tool compatibility, and lifecycle status with the manufacturer or an authorized distributor.
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