PIC16F1847-E/ML
PIC16F1847-E/ML - 8-bit MCU, 14KB Flash, 32MHz, 28-QFN | Microchip
The Microchip Technology PIC16F1847-E/ML is an 8-bit PIC16 microcontroller built on the nanoWatt XLP (eXtreme Low Power) technology platform, featuring 14KB of Flash program memory, 1KB of RAM, and 32MHz maximum CPU speed in a 28-pin QFN (6x6 mm) package. The 'E' suffix denotes the Extended operating temperature grade (-40C to +125C), and the 'ML' suffix denotes the surface-mount QFN package. The PIC16F1847 family integrates mTouch capacitive touch sensing, an Enhanced Mid-range 16-bit instruction set, and on-chip peripherals tailored for sensor, human-interface, and battery-powered applications.
An 8-bit microcontroller (MCU) is a single-chip computer based on an 8-bit data path that integrates a CPU, program memory (Flash), data memory (RAM), EEPROM, and a configurable set of peripherals such as timers, ADC, comparators, and communication interfaces. Within the broader semiconductor hierarchy, MCUs belong to microcontrollers -> microcomputers -> digital ICs. The PIC16F1847 is part of the PIC16 family, which sits between the smaller PIC12/PIC14 and the larger PIC18/PIC24/dsPIC families, optimized for cost-sensitive embedded control with low power consumption.
Key features include 14KB linear-addressable Flash (8K x 14 words), 1KB RAM, 256 bytes EEPROM, 16-level hardware stack, 32MHz internal oscillator, 12-bit ADC with computation (ADC2), 5-bit DAC, enhanced PWM with complementary outputs, multiple communication interfaces (UART, SPI, I2C), and 15 capacitive touch channels. XLP technology delivers sleep currents down to approximately 30 nA, enabling multi-year battery life in IoT and remote-sensor designs.
Architecturally, the PIC16F1847 uses a 14-bit instruction word RISC engine with 49 instructions and a single-cycle hardware multiplier. Its Core Independent Peripherals (CIPs) - such as the CLC, NCO, and PWM with auto-shutdown - let designers offload complex timing tasks from the CPU, lowering active-mode current and freeing MIPS for application logic.
Typical applications include consumer-electronics touch interfaces, battery-powered IoT sensor nodes, automotive body and interior modules (within rated temperature range), industrial control panels, and small home appliances. The extended temperature grade supports harsh-environment deployments, while the QFN package's compact 6x6 mm footprint suits space-constrained designs.
When designing with this part, observe the absolute-maximum VDD of 5.5V and ensure decoupling (100 nF + 1 uF minimum) is placed within 3 mm of the VDD/VDDCORE pins. The QFN exposed pad must be soldered to a sufficiently large copper pour for both thermal dissipation and electrical ground reference.
This page synthesizes distributor pricing, qualified drop-in alternatives, and practical design notes not found in the manufacturer datasheet - a complete engineering reference for component selection.
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