PIC24FJ512GB610T-I/PT
PIC24FJ512GB610T-I/PT - 16-bit 512KB Flash USB MCU | Microchip
The Microchip Technology PIC24FJ512GB610T-I/PT is a 16-bit PIC24F microcontroller built on a low-power CMOS architecture, integrating 512 KB of Flash program memory and 32 KB of SRAM in a 100-pin TQFP (12x12 mm) package. The device operates up to 32 MHz delivering 16 MIPS, supports USB On-The-Go (OTG) with embedded PHY, dual-partition Flash for Live Update capability, and operates from a 2.0V to 3.6V supply (3.3V typical).
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory, working RAM, and a rich set of peripherals. The PIC24F family sits in the 16-bit microcontroller hierarchy above 8-bit PIC MCUs and below 32-bit ARM Cortex-M parts, offering an attractive balance of code density, peripheral integration, and deterministic interrupt latency for embedded control. The 'FJ' variant adds Flash with dual-partition Live Update, which permits firmware field upgrades without external memory.
Key features of the PIC24FJ512GB610 include 24-channel 12-bit ADC (with 10-bit mode option), 6 UART, 3 SPI, 3 I2C, 8 DMA channels, 6 PWM, 7 timers, CTMU for capacitive touch, configurable logic cells (CLC), and on-chip 3.3V regulator with deep-sleep current in the microamp range. This combination is tuned for human-interface, USB, and battery-powered applications.
The architecture uses a 16-bit modified Harvard core with hardware multiply/divide, 24-bit instruction word for compact code, and a peripheral bus that allows DMA to service data movement without CPU intervention. Live Update uses two Flash partitions so a new firmware image can be programmed into the inactive partition while the active partition continues running, then the device swaps partitions atomically.
Typical applications include USB peripherals (HID, CDC, mass storage), portable medical/fitness devices, industrial HMI, low-power sensor hubs, and battery-powered data loggers. The wide peripheral set and large RAM suit multi-protocol gateways.
When designing with this part, allocate at least 4 KB of Flash for the USB stack and bootloader, use the internal 3.3V LDO mode to reduce BOM, and respect the 100-pin TQFP thermal pad layout guidelines to keep junction temperature within range at industrial ambient.
This page consolidates distributor pricing, drop-in alternatives (same-brand same-family preferred), pinout, and design notes not found in the manufacturer datasheet.
見積もり
お問い合わせ