ATSAMA5D2C-XULT vs ATSAM4CP16C-EK 比較
詳細な並列比較: ATSAMA5D2C-XULT メーカー: Microchip Technology および ATSAM4CP16C-EK メーカー: Microchip Technology。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
Microchip Technology
ATSAMA5D2C-XULT - SAMA5D2 Xplained Ultra ARM Cortex-A5 MPU Evaluation Kit | Microchip
ATSAMA5D2C-XULT ObsoleteMicrochip Technology
ATSAM4CP16C-EK - SAM4CP Dual Cortex-M4 Eval Board | Microchip
ATSAM4CP16C-EK Obsolete仕様比較
| パラメータ | ATSAMA5D2C-XULT | ATSAM4CP16C-EK |
|---|---|---|
| ブランド | Microchip Technology | Microchip Technology |
| カテゴリ | Development Boards | Development Boards |
| ライフサイクル状態 | Obsolete | Obsolete |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $184.50 | $0.00 |
| Product Type | Embedded MPU Evaluation Board | MCU 32-Bit Evaluation Board |
| Series | AT91SAMA5 / SAMA5D2 Xplained Ultra | SAM4CP |
| Core Processor | ARM Cortex-A5 (SAMA5D2) | — |
| Core Architecture | 32-bit MPU | — |
| Maximum CPU Frequency | 500 MHz | — |
| On-board DRAM | 128 MB DDR2 SDRAM (1 Gbit) | — |
| On-board Flash | 32 MB QSPI NOR Flash (256 Mbit) | — |
| Ethernet | 10/100 Mbit with on-board PHY | — |
| USB | 2x USB 2.0 High-Speed (Host/Device) | — |
| Card Slot | 1x microSD | — |
| Display Interface | Parallel LCD connector (up to 4.3") | — |
| Audio | Line In / Line Out (on-board codec) | — |
| CAN | 2x CAN-FD | — |
| On-board Debugger | Embedded J-Link OB | — |
| Expansion Headers | Arduino, RPi, MikroElektronika Click | — |
| Input Voltage | 5 V (USB DEBUG or external supply) | — |
| Packaging | Bulk (Box) | Box |
| Product Status | Obsolete (per Octopart listing) | — |
| RoHS ステータス | Compliant | [DATA_NEEDED: RoHS Status] |
| Target Device | — | ATSAM4CP16C (SAM4CP series) |
| Core | — | Dual-core 32-bit ARM Cortex-M4 |
| Core Speed | — | 120 MHz per core |
| Flash Memory | — | 1 MB embedded |
| SRAM | — | 128 KB plus on-chip cache |
| Crypto Engine | — | Advanced cryptographic engine |
| PLC Modem | — | G3-PLC modem |
| PLC Profiles | — | CENELEC, ARIB, FCC |
| Supported Standards | — | G3-PLC specification |
| Architecture | — | Stacked dies (per distributor data) |
| Board Category | — | Embedded MCU, DSP Evaluation Boards |
| 動作温度 | — | [DATA_NEEDED: Operating Temperature] |
| Board Dimensions | — | [DATA_NEEDED: Board Dimensions] |