CMUDM8004-TR-PBFREE vs NOPB 比較

詳細な並列比較: CMUDM8004-TR-PBFREE メーカー: Central Semiconductor および NOPB メーカー: Texas Instruments。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。

Central Semiconductor
CMUDM8004-TR-PBFREE CMUDM8004-TR-PBFREE - 30V 450mA P-Channel MOSFET | Central Semiconductor

CMUDM8004-TR-PBFREE - 30V 450mA P-Channel MOSFET | Central Semiconductor

CMUDM8004-TR-PBFREE ✓ 生産中

仕様比較

パラメータ CMUDM8004-TR-PBFREE NOPB
ブランド Central Semiconductor Texas Instruments
カテゴリ MOSFETs Logic ICs
ライフサイクル状態 有効 有効
在庫状況 In Stock In Stock
単価(USD) $0.08 $0.00
トランジスタタイプ P-Channel Enhancement Mode MOSFET —
Drain-Source Voltage (Vdss) 30 V —
Continuous Drain Current (Id) at Ta 450 mA —
Power Dissipation (Pd) at Ta 250 mW —
実装タイプ Surface Mount Surface Mount (packaging dependent on base MPN)
パッケージ SOT-523 —
Configuration Single FET —
Gate Drive Low threshold voltage, logic-compatible —
Drain-Source On-Resistance (Rds on) [DATA_NEEDED: Rds(on)] —
Gate-Source Threshold Voltage (Vgs th) [DATA_NEEDED: Vgs(th)] —
Gate-Source Voltage (Vgs) Max [DATA_NEEDED: Vgs max] —
動作温度範囲 [DATA_NEEDED: operating temperature range] —
Lead Free Yes (PBFREE) —
RoHS ステータス Compliant —
Packaging Tape and Reel (TR) —
Typical Applications Load/Power Switches, Power Supply Converter Circuits —
Technology Silicon MOSFET —
Suffix Type — Part-number ordering suffix (not a standalone IC)
Meaning — No Lead / No Pb (lead-free packaging)
Origin — National Semiconductor ordering system (inherited by TI)
Lead Finish — Matte tin (Sn) or Sn-Ag-Cu (lead-free)
RoHS Compliance — Yes - compliant with EU Directive 2011/65/EU
REACH Compliance — Compliant (per TI declaration)
Peak Reflow Temperature — 260 C (JEDEC J-STD-020 lead-free profile)
MSL Classification — Per JEDEC J-STD-033 (device-dependent, typically MSL 2 or 3)
動作温度 — Inherits base MPN specification
Equivalent Legacy Suffixes — /PBFREE, /LEADFREE, /LF (vendor-specific)
Functional Equivalence — Identical die and electrical specs to non-NOPB variant
Backwards Compatibility — Compatible with Sn-Pb and lead-free assembly lines when reflow profiled correctly
Document Reference — TI Packaging Terminology Guide (ti.com/design-development/packaging)
Country of Origin — Multiple (per base MPN country of assembly)

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