EP3SE260F1152I3G vs EP3SE260F1152I3N 比較
詳細な並列比較: EP3SE260F1152I3G メーカー: Intel および EP3SE260F1152I3N メーカー: Intel。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | EP3SE260F1152I3G | EP3SE260F1152I3N |
|---|---|---|
| ブランド | Intel | Intel |
| カテゴリ | FPGA & CPLD | FPGA & CPLD |
| ライフサイクル状態 | NRND | ラストバイ |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $1,240.00 | $3,360.00 |
| Series | Stratix III E | Stratix III E |
| Family | Stratix III | — |
| Logic Elements (LE) | 255,000 | — |
| Embedded Memory Bits | 16,672,640 bits | — |
| Embedded Memory Bits (alternate) | 20,880 Kb (16,672,640 / 1024) | — |
| User I/O Count | 744 | — |
| パッケージ | 1152-BBGA, FCBGA (FineLine BGA) | — |
| 動作温度範囲 | -40C to +100C (Industrial) | — |
| Speed Grade | I3 (Industrial, balanced) | — |
| Process Technology | 40 nm TSMC low-power | 65 nm CMOS |
| Supply Voltage Core | 0.9 V (typical, see handbook) | — |
| Configuration Bitstream Encryption | AES-256 (Stratix III feature) | — |
| I/O Standards Supported | LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X | — |
| 実装タイプ | Surface Mount (BGA) | Surface Mount |
| RoHS ステータス | [DATA_NEEDED: RoHS compliance not stated in scraped data] | [DATA_NEEDED: RoHS status] |
| 湿気感度レベル（MSL） | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] | — |
| Lead-Free Reflow | [DATA_NEEDED: peak reflow temperature] | — |
| Design Toolchain | Quartus II / Quartus Prime | — |
| Country of Origin / Distribution | Multiple authorized distributors (DigiKey, Mouser) | — |
| Family Name | — | Stratix III E |
| Logic Elements / Cells | — | 255000 |
| Logic Array Blocks (LABs) | — | 10200 |
| Total RAM Bits | — | 16672768 |
| Number of I/Os | — | 744 |
| Number of Gates | — | [DATA_NEEDED: number of gates] |
| Core Voltage | — | 0.9 V to 1.1 V selectable |
| 動作温度 | — | -40C to +100C (industrial) |
| パッケージ / ケース | — | 1152-BBGA, FCBGA (FC-FBGA) |
| Max Internal Frequency | — | 500 MHz |
| Supplier Temperature Grade | — | Industrial |
| MSLレベル | — | [DATA_NEEDED: MSL level] |