EPF10K200EBC600-2 vs EPF10K200EGC599-3 比較
詳細な並列比較: EPF10K200EBC600-2 メーカー: Intel および EPF10K200EGC599-3 メーカー: Altera。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | EPF10K200EBC600-2 | EPF10K200EGC599-3 |
|---|---|---|
| ブランド | Intel | Altera |
| カテゴリ | FPGA & CPLD | FPGA & CPLD |
| ライフサイクル状態 | Obsolete | ラストバイ |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $198.00 | $39.20 |
| Series | FLEX-10KE | FLEX-10KE |
| Logic Family | CMOS (SRAM-based) | — |
| Process Technology | 0.30 µm CMOS | 0.22 µm SRAM CMOS |
| Typical Gate Count | 200,000 gates | — |
| Logic Elements (LEs) | 9984 | — |
| Logic Array Blocks (LABs) | 1248 | — |
| Embedded Memory (EAB) | 98304 bits (96 Kbits) | — |
| Maximum User I/O | 470 pins | 470 |
| Propagation Delay | 0.4 ns | 0.8 ns |
| 電源電圧 | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) | — |
| I/O Standards | LVTTL, LVCMOS, PCI, GTL+ | — |
| Package Type | 600-ball BGA (BGA-600) | — |
| Package Dimensions | 45 × 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Package Height | 1.1 mm max | — |
| 動作温度 | 0°C to +70°C (Commercial) | — |
| 実装タイプ | Surface Mount | Through Hole (Pin/Peg) |
| Configuration Method | JTAG (IEEE 1149.1), EPC2 serial PROM | — |
| Part Status | Obsolete | — |
| RoHS ステータス | unknown | — |
| Manufacturer | — | Altera (Intel) |
| Family | — | FLEX 10KE |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Logic Elements | — | 9984 |
| System Gates | — | 200000 (approx.) |
| Total RAM Bits | — | 98304 |
| Number of Terminals | — | 599 |
| パッケージ | — | 599-BCPGA (62.48 x 62.48 mm) |
| Package Code | — | PGA (Ceramic Pin Grid Array) |
| Operating Temperature Grade | — | Commercial |
| Core Supply Voltage | — | 2.375 V to 2.625 V (typical 2.5 V) |
| Maximum Frequency | — | 166.67 MHz |
| Speed Grade | — | -3 (0.8 ns) |
| Programming Interface | — | JTAG (IEEE 1149.1) |
| Configuration Memory | — | SRAM-based (volatile) |