EPF10K250EFC672-3 vs EPF10K250EBI600-3 比較
詳細な並列比較: EPF10K250EFC672-3 メーカー: Intel および EPF10K250EBI600-3 メーカー: Intel。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | EPF10K250EFC672-3 | EPF10K250EBI600-3 |
|---|---|---|
| ブランド | Intel | Intel |
| カテゴリ | FPGA & CPLD | FPGA & CPLD |
| ライフサイクル状態 | Obsolete | ラストバイ |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $99.50 | $110.00 |
| Product Type | FPGA (Field Programmable Gate Array) | — |
| Family | FLEX 10KE | FLEX 10KE |
| Maximum Typical Gates | 250,000 | — |
| Logic Elements (LEs) | 12,160 | — |
| Embedded Memory (EAB) | 655,360 bits (80 EABs x 2,048 bits each) | — |
| Logic Array Blocks (LABs) | 392 (8 LEs per LAB) | — |
| User I/O Pins | 470 | — |
| Core Supply Voltage | 2.5 V | — |
| I/O Supply Voltage | MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Speed Grade | -3 (fastest) | -3 (fastest) |
| Temperature Grade | Commercial (0C to +70C) | — |
| パッケージ | 672-ball FineLine BGA (FC) | 600-ball BGA (HBGA) |
| Ball Pitch | 1.0 mm | 1.93 mm |
| Configuration Mode | JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM | — |
| Process Technology | 0.25 um CMOS, 5-layer metal | 0.22 µm CMOS, 4-layer metal |
| 実装タイプ | Surface Mount | Surface Mount |
| RoHS ステータス | [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing] | Not specified (SnPb / tin-lead finish per legacy distributor listing) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Logic Elements | — | 12,160 |
| Typical Gate Count | — | 250,000 system gates |
| Embedded System Blocks (ESBs) | — | 12 |
| Maximum User I/O | — | 470 |
| Dedicated Inputs | — | 4 |
| PLLs | — | 4 |
| On-chip RAM | — | Up to 40 Kbits |
| Core Voltage | — | 2.3 V (FLEX 10KE standard) [DATA_NEEDED: confirm exact VCCINT] |
| 動作温度 | — | Industrial, 0C to +85C [DATA_NEEDED: confirm -40C to +85C range] |
| Configuration Method | — | SRAM, requires external configuration device (EPC series) |
| Lead-free | — | no (legacy tin-lead per distributor description) |