MC9S08AC60CFGE vs MC9S08AW48CFGE 比較

詳細な並列比較: MC9S08AC60CFGE メーカー: NXP Semiconductors および MC9S08AW48CFGE メーカー: NXP Semiconductors。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。

NXP Semiconductors
MC9S08AC60CFGE MC9S08AC60CFGE - 8-bit S08 MCU, 60KB Flash, 40MHz | NXP

MC9S08AC60CFGE - 8-bit S08 MCU, 60KB Flash, 40MHz | NXP

MC9S08AC60CFGE Nrnd
NXP Semiconductors
MC9S08AW48CFGE MC9S08AW48CFGE - 8-bit HCS08 MCU, 48KB Flash, 40MHz | NXP

MC9S08AW48CFGE - 8-bit HCS08 MCU, 48KB Flash, 40MHz | NXP

MC9S08AW48CFGE Nrnd

仕様比較

パラメータ MC9S08AC60CFGE MC9S08AW48CFGE
ブランド NXP Semiconductors NXP Semiconductors
カテゴリ Microcontrollers Microcontrollers
ライフサイクル状態 NRND NRND
在庫状況 In Stock In Stock
単価(USD) $3.42 $4.05
Core Processor S08 (HCS08), 8-bit CISC —
Core Size 8-bit 8-bit
Maximum CPU Frequency 40 MHz —
Internal Bus Frequency 20 MHz 20 MHz
Flash Memory 60 KB (60K x 8) —
RAM 2 KB —
Supply Voltage Range 2.7 V to 5.5 V —
Operating Supply 3.3 V / 5 V —
ADC Resolution 10-bit —
ADC Channels (44-pin package) 8-channel (up to 16-channel family max) —
Communication Interfaces 2x SCI (LIN 2.0, SAE J2602), SPI, IIC —
GPIO (44-pin package) 34 general-purpose I/O —
I/O Ports (family max) 38 —
パッケージ 44-LQFP (10 x 10 mm) 44-pin LQFP (10x10 mm, 0.5 mm pitch)
実装タイプ Surface Mount Surface Mount
Packaging Tray —
動作温度 [DATA_NEEDED: operating temperature range] —
Debug Interface Background Debug Mode (BDM), 6-pin connector Single-wire background debug mode (BKGD)
Series S08AC (Flexis AC family) —
RoHS ステータス RoHS compliant Compliant
Core — HCS08 (S08)
CPU Speed — 40 MHz
Program Memory (Flash) — 48 KB (48K x 8)
RAM Size — 2 KB
I/O Ports — 38 (per NXP summary); 34 (per distributor listing)
電源電圧 — 2.7 V to 5.5 V
Operating Temperature Grade — Industrial
Connectivity — I2C, SCI, SPI
Peripherals — LVD, POR, PWM, WDT
Instruction Set — HC08 with added BGND instruction
ROM Type — Flash

データシート&リソース

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