MW7IC2750GNR1 vs MW7IC2040GNR1 比較
詳細な並列比較: MW7IC2750GNR1 メーカー: NXP Semiconductors および MW7IC2040GNR1 メーカー: NXP Semiconductors。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | MW7IC2750GNR1 | MW7IC2040GNR1 |
|---|---|---|
| ブランド | NXP Semiconductors | NXP Semiconductors |
| カテゴリ | RF Amplifiers | RF Amplifiers |
| ライフサイクル状態 | 有効 | Obsolete |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $23.40 | $17.50 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale/Motorola) |
| Part Series | MW7IC2750N | — |
| RF Type | WiMAX / Broadband Wireless Access | General Purpose / Cellular Base Station PA |
| Frequency Range | 2300 MHz to 2700 MHz | 1805 MHz to 1990 MHz |
| Supply Voltage (VDD) | 28 V (rated 26 V to 32 V operation) | — |
| Quiescent Supply Current | 550 mA (typical) | — |
| Output Power (Pout) | 8 W average (per datasheet title) | — |
| Power Gain | 26 dB (typical) | — |
| Characteristic Impedance | 50 ohm | — |
| トポロジー | Multi-stage integrated (on-chip input and output matching) | — |
| Technology | RF LDMOS (Laterally Diffused MOSFET) | LDMOS (Laterally Diffused MOS) |
| Drain-Source Breakdown Rating | 65 V (per package marking referenced in distributor listings) | — |
| パッケージ / ケース | TO-270 WB-14 Gull Wing, 14-pin | TO-270-16 Variant, Gull Wing (TO-270 WBL-16) |
| 実装タイプ | Surface Mount (gull-wing leads with back-side flange) | Surface Mount (Gull Wing leads) |
| Packaging | Tape & Reel (TR) | Tape & Reel |
| Operating Class | Class AB or Class C (OFDM multicarrier capable) | — |
| RoHS ステータス | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status] |
| 動作温度 | [DATA_NEEDED: operating temperature range] | — |
| Part Family | — | MW7IC2040 (NR1 / GNR1 / NBR1) |
| Device Type | — | RF LDMOS Wideband Integrated Power Amplifier |
| Output Power (CW) | — | 4 W typical |
| Power Supply Voltage | — | 24 V to 32 V (28 V nominal) |
| 静止電流 | — | 75 mA (typical, per web data) |
| Small-Signal Gain | — | 23.5 dB (typical at 1.99 GHz, per web data) |
| Modulation Support | — | W-CDMA, GSM/EDGE, multi-carrier cellular |
| On-Chip Matching | — | Yes (input/output 50 ohm) |
| Number of Stages | — | 2 (multi-stage integrated) |
| Package Body Material | — | Plastic / Epoxy overmold |
| 動作温度範囲 | — | [DATA_NEEDED: operating temperature range] |
| ESD Protection | — | Yes (integrated) |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| ハロゲンフリー | — | Not Compliant (per GlobalSpec listing) |