TJA1024HG vs TJA1022HGZ 比較
詳細な並列比較: TJA1024HG メーカー: NXP Semiconductors および TJA1022HGZ メーカー: NXP Semiconductors。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
NXP Semiconductors
TJA1022HGZ - Dual LIN 2.2A/SAE J2602 Transceiver DHVQFN-24 | NXP
TJA1022HGZ ✓ 生産中仕様比較
| パラメータ | TJA1024HG | TJA1022HGZ |
|---|---|---|
| ブランド | NXP Semiconductors | NXP Semiconductors |
| カテゴリ | Interface ICs | Interface ICs |
| ライフサイクル状態 | 有効 | 有効 |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $2.84 | $1.98 |
| 機能 | Quad LIN 2.2A/SAE J2602 transceiver | Dual LIN 2.2A / SAE J2602 transceiver |
| Number of LIN Channels | 4 (two independent dual-LIN transceivers) | — |
| データレート | Up to 20 kBd | — |
| LIN Compliance | LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2A, SAE J2602 | — |
| LIN Bus Peak Current | 2.2 A | — |
| Supply Voltage (VBAT) | 5 V to 27 V (load-dump tolerant to 40 V) | 5 V to 27 V (load-dump tolerant to 40 V) |
| Sleep Mode Current | < 10 uA (typical per dual channel) | — |
| 動作温度 | -40 C to +125 C | -40 C to +125 C |
| ESD (LIN pin, HBM) | [DATA_NEEDED: HBM ESD value V] | — |
| パッケージ | DHVQFN-24 (SOT815-1), 3.5 x 5.5 mm | DHVQFN-24 (5.5 x 3.5 mm) with exposed pad |
| 実装タイプ | Surface Mount | Surface Mount |
| AEC-Q100 | Qualified | — |
| RoHS ステータス | Compliant | — |
| Software Compatibility | TJA1022, TJA1027, TJA1029 | — |
| ピン数 | 24 | — |
| Number of Channels | — | 2 (dual independent LIN physical layer) |
| Protocol | — | LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2A, SAE J2602 |
| Maximum Data Rate | — | 20 kBd |
| Logic Supply (VCC) | — | 3.3 V or 5 V integrated LDO |
| MSL (Moisture Sensitivity Level) | — | 1 |
| Peak Reflow Temperature | — | 260 C (max 30 s) |
| Terminal Finish | — | Nickel-Palladium-Gold-Silver (NiPdAuAg) |
| JEDEC J-Standard | — | JESD-609 code e4 |
| Automotive Qualification | — | AEC-Q100 (intended for in-vehicle sub-networks) |
| RoHS / REACH | — | RoHS compliant per NXP product page |