XPC8260ZUIFBC vs MPC8250ACZUMHBC 比較
詳細な並列比較: XPC8260ZUIFBC メーカー: NXP Semiconductors および MPC8250ACZUMHBC メーカー: NXP Semiconductors。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
NXP Semiconductors
XPC8260ZUIFBC - PowerQUICC II MPC8260 MPU, 200MHz, 480-TBGA | NXP
XPC8260ZUIFBC ObsoleteNXP Semiconductors
MPC8250ACZUMHBC - PowerPC G2 MPU 266MHz 480-TBGA | NXP
MPC8250ACZUMHBC ⚠ ラストタイムバイ仕様比較
| パラメータ | XPC8260ZUIFBC | MPC8250ACZUMHBC |
|---|---|---|
| ブランド | NXP Semiconductors | NXP Semiconductors |
| カテゴリ | Microcontrollers | Microcontrollers |
| ライフサイクル状態 | Obsolete | ラストバイ |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $99.50 | $85.00 |
| Core Architecture | PowerPC G2 | — |
| Processor Family | PowerQUICC II (MPC82xx) | — |
| Core Count | 1 | — |
| データバス幅 | 32-bit (external 64-bit bus) | 32-bit internal / 64-bit external |
| Maximum Core Frequency | 200 MHz | — |
| Instruction Cache | 32 KB | — |
| Data Cache | 32 KB | — |
| Supply Voltage - Core | 2.5 V (operating range 2.4 V - 2.7 V) | — |
| Supply Voltage - I/O | 3.3 V | — |
| Process Technology | 0.29 micron HiP4 CMOS | 0.25 micron |
| 動作温度 | -40C to +105C (commercial case grade per part suffix) | [DATA_NEEDED: operating temperature range] |
| パッケージ | 480-TBGA (LBGA), 37.5 x 37.5 mm | — |
| 実装タイプ | Surface Mount | Surface Mount (BGA) |
| Integrated Peripherals | Dual 10/100 Ethernet MAC, 4x SCC, 2x SMC, Dual UART, I2C, SPI, PCI 2.2, SDRAM controller, DMA | — |
| MMU | Yes, with 32-entry TLB | — |
| Ethernet | 2x 10/100 Mbps MAC (MII/RMII) | — |
| Packaging | Tray | — |
| RoHS ステータス | [DATA_NEEDED: lead-free / RoHS status not stated in web data] | [DATA_NEEDED: RoHS compliance status] |
| Manufacturer | — | NXP Semiconductors (formerly Freescale/Motorola) |
| Series | — | MPC82xx (PowerQUICC II) |
| Core Processor | — | PowerPC G2 |
| Number of Cores | — | 1 Core, 32-Bit |
| Co-Processors / DSP | — | Communications; RISC CPM |
| Speed | — | 266 MHz |
| Supply Voltage (I/O) | — | 3.3 V |
| Core Voltage | — | 1.8 V |
| パッケージ / ケース | — | 480-TBGA (37.5 x 37.5 mm) |
| ピン数 | — | 480 |
| Architecture | — | RISC |
| RAM Controllers | — | DRAM, SDRAM |
| Graphics Acceleration | — | No |
| ライフサイクル状態 | — | Last Time Buy (NXP EOL announced) |
| Lead Free | — | Yes (per BGA-516 datasheet note: LEAD FREE, PLASTIC) |