10AS032E4F27E3SG - Arria 10 SX SoC FPGA 320K LE | Altera (Intel)
部品番号: 10AS032E4F27E3SG ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 50 | $1650 | $82,500.00 |
| 100 | $1550 | $155,000.00 |
| 500 | $1425 | $712,500.00 |
10AS032E4F27E3SG 概要
An SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a hybrid semiconductor that combines a hardened CPU subsystem with programmable logic on a single die. SoC FPGAs sit at the intersection of Application Processor (AP) -> SoC -> SoC FPGA -> programmable logic device, enabling hardware-accelerated signal processing, custom peripherals, and deterministic real-time control that pure microprocessors cannot achieve, while retaining software flexibility that hard ASICs lack.
Key features include 320K logic elements (LEs), 1.5 GHz maximum internal frequency, embedded ARM Cortex-A9 MPCore with CoreSight debug, 20 nm process technology, 0.9 V core supply, 672-ball FC-FBGA package with 27x27 mm body, and the commercial (E4) speed grade. The device integrates a Hard Processor System (HPS) that includes dual ARM Cortex-A9 cores, L1/L2 caches, on-chip RAM, SDRAM controller, and a rich set of peripherals, while the FPGA fabric provides DSP blocks, M20K memory blocks, variable-precision DSP, and high-speed transceivers.
The Arria 10 architecture delivers a balance of power efficiency and performance for mid-range FPGA applications. The SX variant specifically targets designs that benefit from tight CPU-to-FPGA coupling through the AXI-based HPS-to-FPGA bridge, allowing the ARM cores to offload compute-intensive tasks to FPGA hardware accelerators. The 20 nm process enables lower static power than the prior 28 nm Cyclone/Arria V generations while maintaining high DSP and transceiver throughput.
Typical applications include wireless baseband processing, military radar and SIGINT, industrial machine vision, medical imaging pipelines, broadcast video processing, and high-performance embedded computing. The integration of ARM cores and FPGA fabric makes the Arria 10 SX especially suitable for applications that require deterministic real-time response combined with software programmability.
When designing with this device, ensure the PCB has a high-density, high-layer-count stack-up with controlled-impedance routing for the HPS memory interface (DDR3/DDR4) and the FPGA's high-speed transceivers. Thermal management is critical because the 27x27 mm package concentrates significant power; a heatsink or chassis airflow is typically required for full-performance operation. Pin compatibility within the Arria 10 SX F27 package family allows migration to larger logic densities (10AS048/066) on the same PCB footprint.
This page synthesizes authorized distributor pricing, same-package drop-in alternatives within the Arria 10 SX family, and practical design notes not found in the manufacturer datasheet, helping engineers evaluate 10AS032E4F27E3SG for both new designs and supply-chain recovery scenarios.
ドロップイン代替品: 10AS032E4F27E3SG — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10AS032E4F27E3SG （同一形状・フットプリント） — 相違点: Package, Family, Hard Processor System, HPS Clock Frequency, Number of Terminals.
クイック比較ツール — 並列比較する代替部品を選択:
10AS032E4F27E3LG
✅ ドロップイン✓ 在庫あり
$1950 / 個
データシートを見る →10AS032E4F27E3NG
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
10AS048E4F27E3SG
✅ ドロップイン📋 参考代替品（カタログ未掲載）
10AS066E4F27E3SG
✅ ドロップイン📋 参考代替品（カタログ未掲載）
10AS032E3F27I3SG
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC7Z030-1FBG676C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
10AS032E4F27E3SG 最大定格＆電気的特性
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 320,000 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| パッケージ | 672-FBGA, FC (27x27 mm) |
| ピン数 | 672 |
| Speed Grade | E4 (commercial) |
| 動作温度 | 0C to +100C (commercial) |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| 実装タイプ | Surface Mount |
| Package Type | FC-FBGA (flip-chip fine-pitch BGA) |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
| MSLレベル | 3 |
10AS032E4F27E3SG fc-fbga (flip-chip fine-pitch bga) ピン配置ガイド
10AS032E4F27E3SG (fc-fbga (flip-chip fine-pitch bga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10AS032E4F27E3SG.
詳細は データシート をご参照ください。
主な用途
10AS032E4F27E3SG の用途: 6 件s: Wireless Baseband Processing, Industrial Machine Vision, Military Radar and SIGINT, Medical Imaging Pipelines, Broadcast Video Processing, High-Performance Embedded Computing.
Wireless Baseband Processing
The 10AS032E4F27E3SG's combination of 320K logic elements and a dual ARM Cortex-A9 HPS up to 1.5 GHz makes it well-suited for small-cell and macro baseband preprocessing, LTE PHY layer functions, and digital predistortion (DPD). The 20 nm process delivers the DSP throughput required for real-time FFT, channelization, and crest-factor reduction at low power. Placed as the main SoC, it handles both PHY-layer hardware acceleration in FPGA fabric and upper-layer protocol stack on the ARM cores via AXI bridges. Compared with ASIC alternatives, it offers late-stage firmware reconfigurability for multi-standard support.
おすすめ
Industrial Machine Vision
The 10AS032E4F27E3SG fits industrial machine-vision pipelines that need on-camera image preprocessing (debayering, color correction, edge detection) plus an embedded processor for inspection logic. The 320K LE budget supports multiple Camera Link or MIPI CSI-2 input pipelines running in parallel, while the HPS runs the inspection algorithms and Ethernet/IP or PROFINET connectivity. The E4 commercial speed grade and 0C-100C operating range suit factory-floor enclosures. Compared to discrete CPU+FPGA two-chip designs, the integrated HPS reduces PCB area and BOM cost.
おすすめ
Military Radar and SIGINT
The 10AS032E4F27E3SG's DSP blocks and high-speed transceivers make it a strong fit for mid-range radar pulse compression, FFT processing, and electronic-warfare (EW) signal-intelligence front-ends. The HPS handles control-plane tasks (beam steering, scheduling, health monitoring) while the FPGA fabric runs the data plane at deterministic real-time rates. The 20 nm process enables low power consumption suitable for vehicle-mounted or man-pack platforms. However, for MIL-spec temperature range, the industrial-grade 10AS032E3F27I3SG should be selected instead.
おすすめ
Medical Imaging Pipelines
The 10AS032E4F27E3SG supports ultrasound beamforming, CT image reconstruction, and MRI signal processing where deterministic real-time DSP is required alongside an embedded processor for user-interface and post-processing. The 320K LE fabric accommodates channel-count scaling for portable ultrasound carts, while the HPS runs Linux for DICOM connectivity and user controls. The integrated SoC reduces bill-of-materials cost in price-sensitive medical equipment. Compared to discrete DSP+MCU designs, the unified HPS-FPGA memory space simplifies the data flow.
おすすめ
Broadcast Video Processing
The 10AS032E4F27E3SG supports broadcast video format conversion (SDI to HDMI, up/down/cross conversion), video wall processing, and studio-grade switching matrices. The 320K LE fabric handles multi-stream 3G-SDI processing with on-the-fly scaling, while the HPS manages network control (NMOS, Ember+) and front-panel UI. Transceiver-based SDI I/O simplifies PCB layout versus parallel solutions. Compared to dedicated ASSP video processors, the Arria 10 SX adds programmable video overlay and customer-specific effects.
おすすめ
High-Performance Embedded Computing
The 10AS032E4F27E3SG fits HPEC applications that need ARM software flexibility plus FPGA acceleration for vector math, signal conditioning, or cryptography. The HPS runs a full Linux or RTOS stack with networking, file system, and application logic, while the FPGA fabric offloads compute kernels through AXI bridges with sub-microsecond latency. This makes the device ideal for tactical computing, avionics prototyping, and test-and-measurement platforms where the design must evolve via software alone. Compared to pure FPGA + soft-core designs, the hardened ARM cores deliver much higher CPU efficiency.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10AS032E4F27E3SG — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10AS032E4F27E3LG | 10AS032E4F27E3NG | 10AS048E4F27E3SG | 10AS066E4F27E3SG | 10AS032E3F27I3SG | XC7Z030-1FBG676C |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Xilinx (AMD) |
| Package | 672-FBGA, FC (27x27) | 672-FBGA, FC (27x27) | 672-FBGA, FC (27x27) | 672-FBGA, FC (27x27) | 672-FBGA, FC (27x27) | 672-FBGA, FC (27x27) | 676-FBGA (27x27) |
| Logic Elements | 320,000 | 320,000 | 320,000 | 480,000 | 660,000 | 320,000 | 125,000 |
| Hard Processor System | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Speed Grade | E4 (commercial) | E4 | E4 | E4 | E4 | E3 | -1 |
| Operating Temperature | 0C to +100C | 0C to +100C | 0C to +100C | 0C to +100C | 0C to +100C | -40C to +100C | 0C to +85C |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 28 nm |
| Approx. Unit Price (USD, qty 1, as of 2026-09-04) | $1,850 | $1,850 | $1,850 | $2,650 | $3,950 | $2,150 | $650 |
主な差別化要因
- Hardened dual ARM Cortex-A9 HPS integrated on-die （vs XC7Z030-1FBG676C)
- Pin-compatible density migration within F27 package （vs 10AS032E3F27I3SG)
- Smaller density point in the Arria 10 SX F27 family （vs 10AS048E4F27E3SG)
- 20 nm process vs prior 28 nm Cyclone V / Arria V （vs XC7Z030-1FBG676C)
設計ノート
Estimated: at typical Arria 10 SX operating conditions with full HPS + 70% LE utilization, junction power can reach 15-20 W, requiring a heatsink or 200 LFM airflow. The 27x27 mm FC-FBGA package has a theta_JA of approximately 8 C/W with a standard 4-layer JEDEC test board; failure to provide adequate cooling will trigger thermal throttling. Place a 5 mm copper pad array under the package and connect the thermal balls to inner ground planes for best heat-spreading.
The 672-ball FC-FBGA with 1.0 mm ball pitch requires high-density PCB interconnect: minimum 12-layer stack-up with stacked microvia (HDI) build-up, plus controlled-impedance routing for HPS DDR3/DDR4 (50 ohm single-ended, 100 ohm differential) and high-speed transceivers (100 ohm differential). Estimated: the HPS SDRAM interface runs up to 1066 MHz DDR, so length matching within +/- 25 mil across the byte lanes is required. Reference the Arria 10 SX device pin connection guidelines before laying out the BGA breakout.
Do not assume 10AS032, 10AS048, and 10AS066 share identical pinout in the same F27 package - while the FBGA ball map is shared, some user-I/O and transceiver assignments differ at the silicon level. Always re-run Quartus pin assignments when migrating density. Also, ensure the HPS boot configuration pins (BSEL, CSEL) and clock source match the chosen boot mode (QSPI, NAND, SD, eMMC), as incorrect settings will leave the HPS non-responsive.
The Arria 10 SX requires multiple supply rails: 0.9 V core, 0.95 V HPS, 1.1 V transceiver, 1.8 V/2.5 V/3.3 V I/O, and 1.8 V/2.5 V HPS I/O. A power-sequencing controller (such as the LTC2928 or TI UCD90120A) is recommended to enforce the correct rail ramp order per the Arria 10 SX datasheet. Decoupling requires at least 40 low-ESL MLCCs (0402 or 0201) placed within 1 mm of the BGA balls to meet transient current demand during FPGA configuration and HPS boot.
Keep the JTAG and CoreSight debug signals (TCK, TMS, TDI, TDO, TRST) away from high-speed transceiver traces and clock nets to avoid debug lockups. Route HPS-to-FPGA AXI bridges on inner signal layers with reference-ground stitching vias every 100 mil. Per the Arria 10 handbook, leave at least one full reference ground plane adjacent to all high-speed signal layers; do not split the ground plane under the BGA.
コンプライアンス情報
RoHS compliant per Altera (Intel) product page. Not AEC-Q100 qualified - this is a commercial/industrial FPGA, not an automotive grade part. For automotive applications, evaluate Cyclone V or newer Arria 10 Auto variants instead.
