10AX115R2F40I2SG - Arria 10 GX FPGA 1150K LE | Intel
部品番号: 10AX115R2F40I2SG ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $9636.05 | $9,636.05 |
| 10 | $8945.32 | $89,453.20 |
| 50 | $8248.1 | $412,405.00 |
| 100 | $7721.45 | $772,145.00 |
| 250 | $7189.2 | $1,797,300.00 |
10AX115R2F40I2SG 概要
An FPGA (field-programmable gate array) is a semiconductor integrated circuit whose logic fabric and routing are configured after manufacture by the customer. FPGAs belong to the programmable logic device (PLD) family, sitting alongside CPLDs (complex PLDs) in the broader taxonomy of programmable logic -> digital IC -> integrated circuit. They are used to implement arbitrary digital logic, DSP pipelines, high-speed serial interfaces, and memory controllers without fabricating a custom ASIC.
Key features of the 10AX115R2F40I2SG include 427,200 adaptive logic modules (ALMs) organized into 35,650 logic array blocks (LABs), 1,518 variable-precision DSP blocks, and 24 transceiver channels supporting data rates up to 17.4 Gbps (chip-to-chip) and 14.1 Gbps (backplane). The device also embeds 1.54 Mb of distributed RAM, 31.5 Mb of MLAB memory, and a hard PCIe Gen3 x8 IP block for accelerator cards and compute platforms.
Architecturally, the Arria 10 GX series uses a coherent, multi-rail SmartVID power delivery system with six voltage rails (0.9 V core, 0.95 V transceiver, 1.0 V, 1.2 V, 1.5 V, 1.8 V auxiliary) and integrated digital voltage regulators, simplifying board power design. The hard memory controller and partial reconfiguration support enable in-field firmware updates without system downtime.
Typical applications include 100 Gbps network interface cards, high-definition video broadcast equipment, radar processing in defense and aerospace systems, medical imaging accelerators, and high-performance digital signal processing test equipment. Designers select the 10AX115R2F40I2SG when density, transceiver count, and embedded memory must coexist within a single, mid-power FPGA.
When designing with this device, ensure the PCB meets the 1517-ball FCBGA escape rules (0.8 mm pitch), keep differential transceiver traces length-matched within 150 mil, and provide adequate SmartVID power supply decoupling within 100 mil of each rail pin. Quartus Prime Pro edition is required for synthesis and place-and-route of Arria 10 designs.
This page synthesizes distributor pricing, drop-in alternatives from the Intel Arria 10 family, and practical design notes not found on the standard distributor product page.
ドロップイン代替品: 10AX115R2F40I2SG — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10AX115R2F40I2SG （同一形状・フットプリント） — 相違点: Package, Temperature Grade, DSP Blocks, Family, Speed Grade.
クイック比較ツール — 並列比較する代替部品を選択:
10AX115R2F40I2LG
✅ ドロップイン✓ 在庫あり
$4310 / 個
データシートを見る →10AX115R1F40I1SG
✅ ドロップイン✓ 在庫あり
$7232.71 / 個
データシートを見る →10AX115R2F40E2SG
✅ ドロップイン✓ 在庫あり
$5410 / 個
データシートを見る →10AX115R2F40E2LG
✅ ドロップイン✓ 在庫あり
$10300 / 個
データシートを見る →10AX115R2F40E1SG
✅ ドロップイン✓ 在庫あり
$6875 / 個
データシートを見る →10AX115R1F40I1SG
✅ ドロップイン✓ 在庫あり
$7232.71 / 個
データシートを見る →10AX115R2F40I2SG 最大定格＆電気的特性
| Series | Arria 10 GX |
| Family | Arria 10 |
| Logic Elements (LE) | 1,150,000 |
| Adaptive Logic Modules (ALMs) | 427,200 |
| Logic Array Blocks (LABs) | 35,650 |
| Total Embedded Memory | 68,857,856 bits (approx. 8.2 MB) |
| Maximum User I/O | 342 |
| DSP Blocks | 1,518 variable-precision |
| Transceivers | 24 channels, up to 17.4 Gbps |
| Hard Memory Controller | Yes (DDR3/DDR4/LPDDR3/RLDRAM3) |
| Hard PCIe Gen3 IP | Yes, x8 endpoint/root port |
| Temperature Grade | Industrial (-40C to +100C Tj) |
| Process Node | TSMC 20 nm |
| パッケージ | 1517-ball FCBGA (F40), 40 mm x 40 mm, 0.8 mm pitch |
| 実装タイプ | Surface Mount (BGA) |
| MSLレベル | 3 (168 hours) |
| RoHS ステータス | Compliant |
10AX115R2F40I2SG 1517-ball fcbga (f40), 40 mm x 40 mm, 0.8 mm pitch ピン配置ガイド
10AX115R2F40I2SG (1517-ball fcbga (f40), 40 mm x 40 mm, 0.8 mm pitch パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10AX115R2F40I2SG.
詳細は データシート をご参照ください。
主な用途
10AX115R2F40I2SG の用途: 7 件s: 100 Gbps Network Interface Card, High-Definition Video Broadcast Equipment, Radar Processing in Defense Systems, Medical Imaging Accelerator, Test and Measurement Instrumentation, Industrial Automation and Robotics, 5G Wireless Fronthaul/Backhaul Equipment.
100 Gbps Network Interface Card
The Intel 10AX115R2F40I2SG is well-suited for 100 Gbps NIC designs because it provides 24 transceiver channels at up to 17.4 Gbps each, exceeding the bandwidth needed for four 25 Gbps lanes or two 50 Gbps PAM4 links. With 1,150K logic elements and 1,518 DSP blocks, it can implement MAC-layer packet processing, RDMA offload engines, and traffic shaping in a single chip. The hard PCIe Gen3 x8 endpoint enables direct attachment to host CPUs at 8 GT/s without an external bridge. Designers typically place the FPGA on a full-height, half-length PCIe card with QSFP28 cage and high-frequency LPDDR4 for packet buffers. Unlike smaller FPGAs that would require a multi-chip solution, the 1150K LE fabric handles 100 Gbps wire-speed processing in one device.
おすすめ
High-Definition Video Broadcast Equipment
For UHD video broadcast encoder/decoder equipment, the 10AX115R2F40I2SG delivers the DSP throughput required for real-time HEVC/H.265 4K60p encode at 8-bit or 10-bit color depth. The 1,518 variable-precision DSP blocks implement motion estimation, deblocking filters, and CABAC entropy coding at wire rate. The industrial temperature range ensures reliable 24/7 operation in broadcast racks and outdoor transmitter sites. The 342 user I/O accommodate multiple 12G-SDI video streams (which require ~12 Gbps each) alongside gigabit Ethernet control planes. Designers use the FPGA's hard memory controllers to attach DDR4 for frame buffer storage.
おすすめ
Radar Processing in Defense Systems
The 10AX115R2F40I2SG suits phased-array radar signal processing in defense applications due to its combination of high-density logic (1,150K LE), massive DSP resources (1,518 blocks for FFT and pulse compression), and 24 high-speed transceivers for ADC data ingest. Each transceiver channel can connect to a 12-bit ADC sampling at 1.5 GSPS, capturing the full bandwidth of modern AESA radar front-ends. The industrial temperature range supports operation in ruggedized enclosures with extended environmental screening. Engineers implement beamforming, clutter filtering, and target detection algorithms entirely in the FPGA fabric.
おすすめ
Medical Imaging Accelerator
For CT, MRI, and ultrasound imaging systems, the 10AX115R2F40I2SG enables real-time image reconstruction algorithms such as filtered back-projection (FBP) and iterative reconstruction. The 1,518 DSP blocks parallelize convolutions and FFT operations across detector channels, while the 68 Mb embedded memory holds rotation matrix coefficients and intermediate voxel data. The 24 transceivers accept raw data from multiple high-speed detector arrays. Industrial temperature grading ensures reliable operation in hospital equipment rooms and mobile imaging carts. The hard PCIe Gen3 interface allows direct attachment to workstation CPUs for diagnostic display.
おすすめ
Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and arbitrary waveform generators use the 10AX115R2F40I2SG as the central processing fabric. The FPGA aggregates data from multiple high-speed ADCs, implements digital triggering, runs protocol decodes, and drives high-resolution displays. With 1,150K LE and 1,518 DSP blocks, the device can perform real-time FFT analysis up to 1 GHz bandwidth and decode multi-lane PCIe 4.0 or USB 3.2 traffic. The 24 transceivers handle high-bandwidth probe inputs while the 342 user I/O support multiple trigger and front-panel interfaces. Industrial temperature enables portable test equipment used in field maintenance.
おすすめ
Industrial Automation and Robotics
The 10AX115R2F40I2SG drives motion control and machine vision systems in industrial automation by combining real-time deterministic control with high-bandwidth image processing. The 1,150K logic elements implement EtherCAT master, PROFINET, or EtherNet/IP industrial protocols while the 1,518 DSP blocks accelerate image preprocessing and convolutional neural network inference for defect classification. Industrial -40C to +100C temperature rating supports operation in factory floors without air conditioning. The 24 transceivers interface with multi-megapixel Camera Link or CoaXPress cameras for high-speed inspection lines.
おすすめ
5G Wireless Fronthaul/Backhaul Equipment
In 5G base station and small cell infrastructure, the 10AX115R2F40I2SG implements the Common Public Radio Interface (CPRI) and enhanced CPRI (eCPRI) protocols over its 24 transceivers, aggregating multiple radio units onto a single backhaul fiber. The 1,150K logic elements handle IQ data compression, beamforming weight calculation, and MAC-layer scheduling. Industrial temperature grade supports deployment in outdoor small cell cabinets exposed to extreme weather. The hard PCIe Gen3 x8 interface connects to baseband processing cards and DSP co-processors.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10AX115R2F40I2SG — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10AX115R2F40I2LG | 10AX115R1F40I1SG | 10AX115R2F40E2SG | 10AX115R2F40E2LG | 10AX115R2F40E1SG | 10AX115R1F40I1SG |
|---|---|---|---|---|---|---|---|
| Package | 1517-FCBGA (F40) | 1517-FCBGA (F40) - same | 1517-FCBGA (F40) - same | 1517-FCBGA (F40) - same | 1517-FCBGA (F40) - same | 1517-FCBGA (F40) - same | 1517-FCBGA (F40) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Transceiver Grade | R2 (up to 17.4 Gbps) | R2 | R1 (lower data rate) | R2 | R2 | R2 | R1 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Extended (-40C to +125C) | Extended | Extended | Industrial |
| Lead Finish | Pb-free (SG) | Pb-bearing (LG) | Pb-free (SG) | Pb-free (SG) | Pb-bearing (LG) | Pb-free (SG) | Pb-free (SG) |
| Max Transceiver Data Rate | 17.4 Gbps | 17.4 Gbps | 12.5 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 12.5 Gbps |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits |
| DSP Blocks | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 |
主な差別化要因
- Higher transceiver data rate (17.4 Gbps) than R1-grade alternatives （vs 10AX115R1F40I1SG)
- Industrial temperature grade for harsh environment operation （vs 10AX115R2F40E2SG)
- Pb-free lead finish meets modern environmental compliance （vs 10AX115R2F40I2LG)
- Optimal cost-performance balance within Arria 10 1150K family （vs 10AX115R2F40E1SG)
設計ノート
Estimated: The 1517-FCBGA F40 package at 0.8 mm ball pitch requires a minimum 6-layer PCB stackup with microvia (HDI) technology. Signal layers must escape at least 4 rows of balls per direction from the BGA. Outer-layer trace width should be 0.1 mm with 0.15 mm spacing to maintain 100 ohm differential impedance for transceiver lanes. Per the Intel Arria 10 datasheet, transceiver reference clock traces require 100 ohm differential routing with 0.5 mm spacing.
Estimated: At full utilization (1,150K LE at 100% toggle, 24 transceivers active), the Arria 10 GX consumes approximately 25-35 W. With a junction-to-ambient thermal resistance (theta_JA) of approximately 5 C/W (when mounted on a standard JEDEC test board), junction temperature would rise 125-175C above ambient - well above the 100C industrial limit. A heatsink with 4 C/W resistance plus 200 LFM forced airflow is mandatory. The F40 package supports a heat-spreader mounting scheme with thermal interface material (TIM) between the lid and heatsink.
The Arria 10 GX uses SmartVID power delivery requiring six voltage rails: 0.9 V core, 0.95 V transceiver, 1.0 V, 1.2 V, 1.5 V, and 1.8 V auxiliary. Per the Intel Arria 10 datasheet, the integrated digital voltage regulators on the device simplify board design but require stable bulk decoupling within 100 mil of each power pin. Designers should plan for a 12 V input with intermediate switching regulators (e.g., from MEAN WELL or Vicor) followed by point-of-load LDOs for each rail.
Differential transceiver traces must be length-matched within 150 mil (3.8 mm) and routed as 100 ohm differential pairs. AC-coupling capacitors of 100 nF should be placed within 100 mil of the FPGA transceiver pins with the other end directly going to the adjacent component (e.g., SFP+ cage or QSFP28 connector). Reference planes should be continuous under all high-speed traces; no ground splits crossing these traces. Skew matching across the 24 transceiver lanes is critical for multi-lane protocols like PCIe Gen3 and 100G Ethernet.
Do not mistake the 'I' (industrial) and 'E' (extended) temperature suffixes in the MPN. Industrial grade is -40C to +100C Tj; extended grade is -40C to +125C Tj with different speed grading (E1 fastest, E2 mid, E3 slowest). Verify your design's required temperature range before ordering. Also note that SG = Pb-free lead finish and LG = Pb-bearing (legacy applications). Quartus Prime Pro Edition is REQUIRED - Standard Edition does not support Arria 10 devices.
コンプライアンス情報
RoHS compliant per Intel product page. AEC-Q100 not applicable - this is a programmable logic device, not an automotive-grade IC per se. The 'I' suffix indicates industrial temperature grade which differs from AEC-Q100 automotive qualification. Halogen-free status not explicitly confirmed in provided data.
