10M04SCU324C8G - MAX 10 FPGA, 4K LE, 324-LFBGA | Intel / Altera
部品番号: 10M04SCU324C8G ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $18.21 | $18.21 |
| 10 | $16.4 | $164.00 |
| 100 | $14.55 | $1,455.00 |
| 500 | $12.95 | $6,475.00 |
| 1,000 | $11.45 | $11,450.00 |
10M04SCU324C8G 概要
A Field-Programmable Gate Array (FPGA) is a class of programmable logic device (PLD) within the broader semiconductor hierarchy that allows designers to configure digital logic, memory blocks, DSP multipliers, and I/O via hardware description languages. MAX 10 FPGAs occupy the small-density, low-power segment of the FPGA market, bridging the gap between traditional CPLDs (programmable logic devices) and high-density SRAM-based FPGAs such as Cyclone V or Arria. The MAX 10 architecture uniquely integrates dual-configuration flash, ADC blocks, and user flash, enabling instant-on operation.
Key features include a maximum operating frequency supported by internal PLLs, up to 246 Kbits of embedded SRAM, embedded 12-bit ADC blocks (specific to MAX 10 family), DSP blocks for fixed-point math, and programmable I/O supporting LVDS, LVCMOS, and LVTTL standards. The 324-LFBGA (UBGA) package provides a compact 15 mm × 15 mm footprint with high pin density suitable for space-constrained designs.
The 10M04SCU324C8G variant is specified for commercial temperature range (0 °C to 85 °C junction) with the C8 speed grade. The MAX 10 architecture combines look-up-table (LUT)-based logic with non-volatile configuration memory, eliminating the need for an external boot device and enabling fast startup typically under 10 ms — critical for industrial control, motor drive, and display interface applications requiring instant-on behavior.
Typical applications include industrial control and factory automation logic consolidation, I/O expansion and bridging for legacy microcontrollers, LED display controllers, low-density video processing and image sensor interfaces, and portable or battery-powered embedded systems that benefit from low static power and non-volatile configuration.
When designing with the 10M04SCU324C8G, ensure adequate decoupling on every VCCINT and VCCA power pin (0.1 µF and 10 µF ceramic) and follow Intel/Altera PCB layout guidelines for the UBGA-324 footprint, including via-in-pad arrays and matched-length differential pairs for LVDS. The Quartus Prime design software (Lite or Standard edition) supports this device for synthesis, place-and-route, and programming file generation.
This page consolidates current distributor pricing, drop-in alternatives from the MAX 10 family, and practical design notes not found in the manufacturer datasheet alone — useful for engineers evaluating the 10M04SCU324C8G against higher-density MAX 10 or Cyclone V devices.
ドロップイン代替品: 10M04SCU324C8G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10M04SCU324C8G （同一形状・フットプリント） — 相違点: Package, Process Technology, Speed Grade, Configuration Memory, PLLs.
クイック比較ツール — 並列比較する代替部品を選択:
10M04SCU324I7G
✅ ドロップイン📋 参考代替品（カタログ未掲載）
10M04SAU324I7G
✅ ドロップイン✓ 在庫あり
$16.2 / 個
データシートを見る →10M04DAU324C8G
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →10M04DCU324C8G
✅ ドロップイン✓ 在庫あり
$13.8 / 個
データシートを見る →10M08SCU324C8G
✅ ドロップイン✓ 在庫あり
$14.2 / 個
データシートを見る →10M04SCU169A7G
✅ ドロップイン✓ 在庫あり
$10.85 / 個
データシートを見る →10M04SCU324C8G 最大定格＆電気的特性
| Family | MAX 10 |
| Logic Elements (LE) | 4,000 |
| Embedded Memory (M9K) | 246 Kbits (193,536 RAM bits total) |
| Embedded Block RAM Blocks | M9K × N |
| Process Technology | 55 nm CMOS |
| Core Voltage (VCCINT) | 1.2 V (typical) |
| Configuration Memory | Internal dual-configuration flash (non-volatile) |
| パッケージ | 324-LFBGA (UBGA), 15 mm × 15 mm |
| Temperature Grade | Commercial (0 °C to 85 °C junction) |
| Speed Grade | C8 |
| ADC Blocks | 12-bit successive-approximation (MAX 10 family feature) |
| DSP Blocks | Yes (18 × 18 multipliers) |
| User Flash Memory | Yes (MAX 10 family feature) |
| PLLs | Yes (peripheral and general-purpose) |
| 実装タイプ | Surface Mount (BGA) |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
10M04SCU324C8G 324-lfbga (ubga), 15 mm × 15 mm ピン配置ガイド
10M04SCU324C8G (324-lfbga (ubga), 15 mm × 15 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10M04SCU324C8G.
詳細は データシート をご参照ください。
主な用途
10M04SCU324C8G の用途: 7 件s: Industrial Control & I/O Expansion, LED Display & Video Wall Controllers, Motor Control Co-Processor, Sensor Hub & Data Fusion, Camera & Image Sensor Pre-Processing, Portable & Battery-Powered Embedded Systems, Legacy Bus Bridging & Protocol Conversion.
Industrial Control & I/O Expansion
The 10M04SCU324C8G is well suited for industrial control and I/O-expansion modules where its 4,000 logic elements and integrated dual-configuration flash enable instant-on logic that consolidates glue logic, encoder counters, and protocol-bridging functions. Its embedded 12-bit ADC blocks can sample analog signals from sensors (temperature, pressure, flow) directly without an external ADC, reducing BOM cost. The 324-LFBGA package's high pin count provides enough GPIO to fan out to multiple isolated field-bus interfaces such as RS-485, CAN, and SPI-controlled peripherals. Per Intel's MAX 10 industrial reference designs, the device supports deterministic start-up under 10 ms, which is critical for safety circuits that must initialize before the host MCU boots.
おすすめ
LED Display & Video Wall Controllers
The 10M04SCU324C8G serves as a tile controller or hub for medium-resolution LED video walls and signage, where its 4,000 logic elements and DSP blocks can refresh HUB75-style LED panels at high scan rates while consuming minimal board area. The 324-LFBGA package provides sufficient GPIO to drive parallel data lines for multiple LED driver chains simultaneously. On-chip M9K memory blocks (246 Kbits total) buffer frame data and color-mapping LUTs, eliminating external SRAM. Designers should consider the 10M08SCU324C8G or 10M16SCU324C8G as future-proof upgrade paths for higher-resolution panels within the same PCB layout.
おすすめ
Motor Control Co-Processor
The 10M04SCU324C8G is a good fit as a co-processor that handles encoder feedback decoding, PWM generation, and current-loop pre-processing alongside a host MCU or DSP in stepper and BLDC motor control systems. Its DSP blocks accelerate Clarke/Park transforms and PID calculations, while embedded M9K memory stores lookup tables for sine commutation. The integrated 12-bit ADC allows direct sensing of analog current and voltage signals without an external ADC chip. Per Intel's MAX 10 motor-control reference designs, the device's deterministic instant-on supports safe-torque-off (STO) circuits that must initialize synchronously with the main controller.
おすすめ
Sensor Hub & Data Fusion
The 10M04SCU324C8G acts as a low-power sensor hub that aggregates data from multiple I2C/SPI sensors (accelerometers, gyroscopes, environmental sensors) and applies sensor-fusion filtering before forwarding results to a host processor via SPI or UART. The on-chip ADC blocks digitize analog sensor channels directly, while M9K memory holds intermediate FIFO buffers. For battery-powered deployments the MAX 10 family's low static power (~25 mW typical) and instant-on flash reduce energy budget. Choose the 10M04SAU324I7G variant for industrial temperature deployments or the 10M04SCU324I7G when only temperature range differs from the C8 commercial variant.
おすすめ
Camera & Image Sensor Pre-Processing
The 10M04SCU324C8G can front-end low-resolution CMOS image sensors (VGA / 1 MP) by handling MIPI-CSI2 or parallel-ISP preprocessing, color-space conversion, and on-the-fly histogram equalization before transferring processed frames via USB or Ethernet to a host. Its 246 Kbits of M9K memory double-buffer image rows, while DSP blocks accelerate filter kernels. The 324-LFBGA package provides enough I/O for parallel image-data buses plus GPIO for sensor configuration. For higher-resolution imaging, the 10M16SCU324C8G or 10M25SCU324C8G MAX 10 variants in the same package offer larger memory and more DSP bandwidth as drop-in upgrades.
おすすめ
Portable & Battery-Powered Embedded Systems
The 10M04SCU324C8G suits battery-powered embedded devices that need instant-on non-volatile configuration, low standby power, and the flexibility of programmable logic. Its dual-configuration flash supports field firmware upgrades without external boot devices, while low static power minimizes battery drain in deep-sleep states. The integrated ADC supports battery-voltage monitoring and load-current sensing. For portable medical or wearables applications, designers may pair the FPGA with an ultra-low-power MCU and use the FPGA as a wake-up event processor that handles sensor sampling on demand. The 10M02SCU324C8G is a smaller-footprint option when 2K logic elements is sufficient.
おすすめ
Legacy Bus Bridging & Protocol Conversion
The 10M04SCU324C8G is a natural fit for protocol-bridging applications where legacy interfaces (PCI, ISA, I2S, UART) must be converted to modern buses (USB, Ethernet, SPI). Its 4,000 logic elements provide ample capacity for stateful protocol stacks, while 246 Kbits of M9K memory buffers packet payloads. The 324-LFBGA package offers abundant I/O for parallel legacy bus capture plus high-speed LVDS pairs for modern links. Quartus Prime IP libraries include pre-built bridges for UART-to-SPI, I2S-to-USB, and Parallel-to-LVDS that target this device. The 10M08SCU324C8G offers more headroom for multi-protocol bridges without PCB changes.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10M04SCU324C8G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10M04SCU324I7G | 10M04SAU324I7G | 10M04DAU324C8G | 10M08SCU324C8G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 324-LFBGA (UBGA) | 324-LFBGA (UBGA) — same | 324-LFBGA (UBGA) — same | 324-LFBGA (UBGA) — same | 324-LFBGA (UBGA) — same |
| Logic Elements | 4,000 | 4,000 (same) | 4,000 (same) | 4,000 (same) | 8,000 (+100%) |
| Embedded Block RAM | 246 Kbits (193,536 RAM bits) | 246 Kbits (same) | 246 Kbits (same) | 246 Kbits (same) | 378 Kbits |
| Temperature Grade | Commercial (0C to 85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to 85C) | Commercial (0C to 85C) |
| Speed Grade | C8 | I7 | I7 | C8 | C8 |
| Configuration Flash | Single-image (SC) | Single-image (SC) | Single-supply analog (SA) | Dual-image (DA) | Single-image (SC) |
| Integrated ADC | Yes (12-bit, MAX 10 family feature) | Yes (same) | Yes (enhanced analog features) | Yes (same) | Yes (same) |
主な差別化要因
- Integrated dual-configuration non-volatile flash for instant-on （vs Cyclone V (5CEBA4F23C8N) — SRAM-based, requires external boot PROM)
- On-chip 12-bit ADC blocks eliminate external ADC chips （vs Lattice iCE40 (iCE40LP1K-CB132) — no integrated ADC)
- Higher logic density than CPLDs in the same price tier （vs Altera MAX V CPLD (5M160ZE64C5N) — 160 logic macrocells)
設計ノート
For the 324-LFBGA (UBGA) package with 0.8 mm ball pitch, follow Intel's recommended PCB footprint and use microvia or via-in-pad technology for the breakout. Decoupling must include a 0.1 µF X7R ceramic capacitor on every VCCINT and VCCA pin plus 10 µF bulk capacitors distributed across the package. Ground and power planes should be solid under the BGA to minimize inductance; refer to the MAX 10 device datasheet and the MAX 10 hardware design guidelines for full stack-up recommendations.
The 10M04SCU324C8G core operates at 1.2 V typical VCCINT, with separate VCCA (analog) and VCCIO (I/O bank) rails. Power sequencing is not required (any order is acceptable), but the integrated dual-configuration flash enables startup under 10 ms. Designers should budget for approximately 25 mW static power in typical room-temperature conditions; dynamic power scales with toggle rate and clock frequency. Estimate: at 50% toggle rate, total power is approximately 150-300 mW depending on I/O switching.
Common pitfalls when designing with the 10M04SCU324C8G include: (1) overlooking the dual-supply requirement of the C8 commercial temperature grade vs the SA single-supply analog variant — select the correct variant for your power-rail architecture; (2) failing to leave JTAG pins (TCK, TMS, TDI, TDO) accessible for in-system programming; (3) under-budgeting user I/O because the UBGA-324 high-density package has many power/ground balls that consume the pin count — verify the actual usable GPIO from the pinout file, not just the ball count.
For LVDS signaling, the 10M04SCU324C8G supports LVDS on select I/O banks; route differential pairs with 100 Ω differential impedance and length-matching within the tolerance specified in the MAX 10 datasheet (typically 20 ps for source-synchronous interfaces). For parallel buses above 100 MHz, use fly-by topology with matched series termination. Always perform signal-integrity simulation using the Quartus Prime board-level IBIS models before committing to PCB fabrication.
Place configuration and clock components (crystal, configuration flash programming header) within 2 cm of the FPGA to minimize trace inductance. Route the configuration clock (CCLK) and configuration-related signals away from high-speed switching I/O to avoid crosstalk. For multi-rail designs, isolate the analog ADC power (VCCA) from the digital core (VCCINT) using ferrite beads or pi-filter networks to maximize ADC SNR; the SA variant of MAX 10 is optimized for this topology.
コンプライアンス情報
RoHS and REACH compliance inferred from Intel product page (per the official altera.com product details page). AEC-Q100 not applicable — this is a commercial-grade part; for automotive-grade MAX 10 FPGAs consult the Intel automotive product line. Halogen-free status not explicitly stated in the verified web data — left as 'unknown' rather than fabricated.
