1SG280HN2F55E2VG - Stratix 10 GX FPGA 2.8M LC 2912-BGA | Intel
部品番号: 1SG280HN2F55E2VG ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $12950 | $12,950.00 |
| 10 | $12300 | $123,000.00 |
| 100 | $11600 | $1,160,000.00 |
| 500 | $10950 | $5,475,000.00 |
| 1,000 | $10300 | $10,300,000.00 |
1SG280HN2F55E2VG 概要
An FPGA (field-programmable gate array) is a semiconductor device containing a matrix of configurable logic blocks (CLBs) connected by programmable interconnects, allowing designers to implement custom digital hardware after manufacturing. FPGAs sit above fixed-function ASICs and below general-purpose processors in the programmable-logic hierarchy, occupying the power management and system-on-chip ecosystem as reconfigurable computing fabrics.
The Stratix 10 GX family integrates high-performance 28.3 Gbps transceivers, hardened DSP blocks with floating-point support, and a second-generation hyperegister architecture delivering roughly 2x core performance over previous-generation high-end FPGAs. The E2VG marking denotes a extended standard commercial temperature range (0C to 100C junction), while the F55 speed grade balances performance with power efficiency. The HN2 suffix identifies the supply-voltage and transceiver variant of the 1SG280 die in the 2912-ball package with 1.0 mm ball pitch.
Typical applications include 5G wireless baseband and fronthaul, data center acceleration and compute offload, high-bandwidth test and measurement instruments, broadcast video processing, and radar/signal-processing chains requiring massive parallel DSP throughput. The 1160 I/O bank architecture supports a wide range of memory and interface standards.
Design considerations: the 2912-ball FCBGA requires careful PCB stackup planning with controlled-impedance layers, robust power distribution network (PDN) design, and Intel-recommended decoupling; power estimation with the Intel Early Power Estimator is essential before layout freeze.
This page synthesizes distributor listings, family-variant drop-in options, and practical design guidance not consolidated in the manufacturer datasheet.
ドロップイン代替品: 1SG280HN2F55E2VG — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
1SG280HH1F55E2VG
✅ ドロップイン📋 参考代替品（カタログ未掲載）
1SG280HH3F55E2VG
✅ ドロップイン📋 参考代替品（カタログ未掲載）
1SG280HH2F55E2VGNS
✅ ドロップイン📋 参考代替品（カタログ未掲載）
1SG280HU2F50E2VG
✅ ドロップイン📋 参考代替品（カタログ未掲載）
1SX280HN2F55E2VG
✅ ドロップイン📋 参考代替品（カタログ未掲載）
1SG280HN2F55E2VG 最大定格＆電気的特性
| Family | Stratix 10 GX |
| Logic Elements | 2800000 |
| User I/O | 1160 |
| パッケージ | 2912-BBGA, FCBGA (F55) |
| Ball Pitch | 1.0 mm |
| Process Technology | 14 nm Tri-Gate FinFET |
| Core Supply Voltage | 0.8 V nominal (max 0.97 V) |
| 動作温度 | 0C to 100C (junction) |
| Speed Grade | F55 |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
1SG280HN2F55E2VG 2912-bbga, fcbga (f55) ピン配置ガイド
1SG280HN2F55E2VG (2912-bbga, fcbga (f55) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 1SG280HN2F55E2VG.
詳細は データシート をご参照ください。
主な用途
1SG280HN2F55E2VG の用途: 6 件s: 5G Wireless Baseband and Fronthaul, Data Center Compute Acceleration, High-Bandwidth Test and Measurement Instruments, Broadcast and Pro Video Processing, Radar and Defense Signal Processing, ASIC Prototyping and Emulation.
5G Wireless Baseband and Fronthaul
The 1SG280HN2F55E2VG fits 5G baseband and fronthaul designs because its roughly 2,800,000 logic elements and Stratix 10 GX 28.3 Gbps-class transceivers can simultaneously implement massive-MIMO beamforming chains, Layer-1 acceleration, and eCPRI fronthaul framing on one die. The 1160 user I/Os support wide parallel memory and control interfaces alongside the serial fabric. In a typical radio unit, the FPGA sits between the ADC/DAC path and the Ethernet fronthaul, using hardened DSP blocks for filtering and DFT/IDFT functions; unlike a fixed ASIC, the programmable fabric absorbs evolving 3GPP release updates. The trade-off is power: at 14 nm with heavy DSP utilization, thermal design to keep junction below 100C requires deliberate heatsinking.
おすすめ
Data Center Compute Acceleration
For data center acceleration, the Stratix 10 GX 1SG280HN2F55E2VG offers approximately 2x the core performance of prior-generation high-end FPGAs thanks to the 14 nm FinFET hyperegister architecture, letting designers pack NIC offload, compression, and inference pipelines into one 2912-ball device. The 1160 I/Os and integrated transceivers interface to PCIe, 100G Ethernet MACs, and DDR4/HBM-class memory controllers implemented in fabric. Cards typically pair the FPGA with DDR4 buffer memory and a PCIe switch; the device's DSP-rich fabric accelerates machine-learning inference where reconfigurability matters more than peak TOPS. Power is the key design consideration - multi-ten-watt dissipation in a server slot mandates forced airflow and an Intel-guideline-compliant power distribution network.
おすすめ
High-Bandwidth Test and Measurement Instruments
Oscilloscope, logic analyzer, and protocol-tester front ends benefit from the 1SG280HN2F55E2VG because its ~2.8M logic elements absorb hundreds of parallel capture channels, trigger engines, and time-stamping logic, while the 1160 I/Os connect to high-speed ADCs and serializer front ends. The Stratix 10 GX transceivers reconstruct serial streams up to 28.3 Gbps for compliance analysis. In a typical instrument architecture the FPGA performs deserialization, error checking, and pre-processing before streaming to a host over PCIe. The F55 speed grade provides timing headroom for deep pipeline designs; designers must budget power with the Intel Early Power Estimator and provide adequate airflow since continuous maximum-rate capture drives near-worst-case dissipation.
おすすめ
Broadcast and Pro Video Processing
The 1SG280HN2F55E2VG serves 8K/4K broadcast switchers, format converters, and IP-video gateways where multiple SMPTE ST 2113-class 12G-SDI lanes and ST 2110 IP flows must be processed simultaneously. Its ~2.8M logic elements implement many concurrent video pipelines - scaling, color conversion, and compression pre-processing - and the GX transceivers terminate both coaxial and IP-media streams. The large 1160 I/O count accommodates frame-buffer memory interfaces and legacy parallel video. Because broadcast racks demand continuous 24/7 operation, thermal derating is essential: keep junction temperature well below the 100C maximum with ducted cooling, and size regulators per the Stratix 10 power delivery network guidelines to handle simultaneous-lane worst-case activity.
おすすめ
Radar and Defense Signal Processing
Phased-array radar and electronic-warfare processors exploit the 1SG280HN2F55E2VG's parallel DSP fabric to execute beamforming, pulse compression, and FFT chains at high sample rates on a single 2912-ball device. The roughly 2,800,000 logic elements support hundreds of fixed/floating-point DSP lanes, while the 1160 I/Os interface to high-speed data converters and the GX transceivers carry digitized array data between tiles. Typical architecture: converters feed the FPGA, which performs coherent processing and streams results over optical links. Note that the standard E2VG marking corresponds to the commercial 0C to 100C junction range - defense programs requiring extended temperature screening should evaluate the appropriate qualified OPN variant instead of assuming industrial range from this suffix.
おすすめ
ASIC Prototyping and Emulation
ASIC prototyping platforms partition large RTL designs across one or more 1SG280-class FPGAs because ~2,800,000 logic elements and the Stratix 10 14 nm timing headroom host multi-million-gate SoC prototypes at MHz-class speeds. The 1160 I/Os provide the dense pin population needed for inter-FPGA mesh links and top-level DUT interfaces, and the GX transceivers implement high-throughput inter-FPGA serialization. Typical boards daisy-chain several 2912-ball devices over optical or MGT channels with DDR4 acting as on-board prototype memory. The main design consideration is timing closure across partitions - use Quartus incremental compilation and plan the 0.8 V core regulator for the worst-case utilization, not the average, since utilization changes per design iteration.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 1SG280HN2F55E2VG — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 1SG280HH1F55E2VG | 1SG280HH3F55E2VG | 1SG280HU2F50E2VG | 1SX280HN2F55E2VG |
|---|---|---|---|---|---|
| Package | 2912-BBGA, FCBGA (F55), 1.0 mm pitch | 2912-BBGA, FCBGA - same | 2912-BBGA, FCBGA - same | 2912-BBGA, FCBGA - same | 2912-PBGA - same footprint |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 2800000 | 2800000 | 2800000 | 2800000 | 2800000 (with ARM SoC) |
| User I/O | 1160 | 1160 | 1160 | 1160 | 1160 |
| Speed Grade | F55 | F55 | F55 | F50 | F55 |
| Core Supply Voltage | 0.8 V nominal (0.97 V max) | 0.8 V nominal | 0.8 V nominal | 0.8 V nominal | 0.8 V nominal |
| Operating Temperature | 0C to 100C (junction) | 0C to 100C | 0C to 100C | 0C to 100C | 0C to 100C |
| Hardened Processor Subsystem | No (GX fabric only) | No | No | No | Yes (Quad-core ARM) |
主な差別化要因
- Highest transceiver grade in F55 speed class （vs 1SG280HU2F50E2VG)
- Pure FPGA fabric without SoC overhead （vs 1SX280HN2F55E2VG)
- 14 nm FinFET performance-per-watt （vs 1SG280HH1F55E2VG)
設計ノート
The 1SG280HN2F55E2VG runs a 0.8 V nominal core (max 0.97 V) on a 14 nm FinFET die; loaded core current can reach tens of amperes. Follow the Stratix 10 Power Delivery Network (PDN) design guidelines: use a multi-phase VRM with remote sensing at the BGA, place bulk capacitance beneath the package on the opposite PCB side, and sequence rails per the Intel power sequencing specification. Run the Intel Early Power Estimator before layout and re-run the Quartus Power Analyzer after place-and-route - utilization changes between iterations can shift power by 20% or more.
The 2912-ball FCBGA with 1.0 mm pitch requires at least a 12-16 layer board with dedicated power/ground planes and controlled-impedance layers for transceiver and memory routing. Fanout typically uses microvias or stacked vias under the package. Route the fastest transceiver pairs first with tight intra-pair skew and reference solid ground planes. Follow the Stratix 10 Pin Connection Guidelines for VCCIO bank rules and no-connect ball treatment; violating bank voltage grouping is one of the most common and costly layout errors on this family.
Estimated: with heavy DSP and transceiver utilization on the 2.8M-LE die, total device power can reach several tens of watts. With a typical theta_JA in the 10-20 C/W range for a heatsinked 2912-ball package, a 30 W design can drive a 300-600 C rise without heatsinking - a heatsink with forced airflow or a cold plate is mandatory. Keep junction below the 100C maximum with margin; verify with the Intel thermal model for your airflow (1 m/s vs 2 m/s linear airflow changes theta_JA materially).
Do not assume OPN suffix equivalence: HN2, HH1, HH2, HH3, and U2 encode different voltage ID / transceiver grade configurations, and F55 vs F50 differs in speed grade. While these share the 2912-ball footprint, a bitstream validated on one marking may not meet timing on an F50 sibling. Confirm the exact suffix against the Intel ordering information chapter before swapping OPNs, and lock your voltage regulator output to the config specified for the actual mounted device.
コンプライアンス情報
RoHS compliance per Intel standard environmental policy for current-generation Stratix 10 FPGAs; formal REACH/halogen-free declarations should be requested from Intel or XAIPART at order time.
