5SGXMABK3H40I4G - Stratix V GX FPGA, 952K LE, 1517-BGA | Intel
部品番号: 5SGXMABK3H40I4G ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $7000 | $7,000.00 |
| 10 | $6800 | $68,000.00 |
| 100 | $6500 | $650,000.00 |
| 500 | $6200 | $3,100,000.00 |
| 1,000 | $5950 | $5,950,000.00 |
5SGXMABK3H40I4G 概要
A Field Programmable Gate Array (FPGA) is a semiconductor device whose logic architecture can be reconfigured after manufacturing. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) and enable parallel hardware acceleration for digital signal processing, packet processing, and protocol bridging. The Stratix V family uses a heterogeneous fabric that pairs general-purpose adaptive logic modules (ALMs) with embedded hard IP including transceivers, PCIe Gen2/Gen3 hard controllers, and variable-precision DSP blocks - delivering higher performance-per-watt than pure-soft FPGA implementations.
Key features include up to 14.1 Gbps transceiver data rates, integrated PCI Express hard IP, variable-precision DSP blocks capable of 600 MHz operations, and a hardened memory controller subsystem. The 1517-BGA FCBGA package exposes 696 user I/Os to support wide parallel memory interfaces, multiple 10G/40G Ethernet MACs, and backplane SerDes connections. The device consumes roughly 0.5W of static power and scales to mid-range static power consumption under workload.
The 5SGXMABK3H40I4G is suitable for wireless baseband processing, high-speed data acquisition, military radar signal processing, and broadcast video encoding. The integrated transceivers support protocols such as 10 Gigabit Ethernet, Interlaken, Serial RapidIO, and PCIe Gen3, while the variable-precision DSP blocks accelerate FFT, FIR filtering, and matrix multiplications for defense and medical imaging workloads.
When designing with this device, ensure signal-integrity-driven PCB stack-up design with controlled-impedance differential pairs for all transceiver channels; the FCBGA's 1.0 mm ball pitch demands careful fanout and via-in-pad construction. Thermal management must consider typical FPGA workloads where junction temperature can rise rapidly under sustained high toggle rates.
This page synthesizes distributor pricing, drop-in same-package alternatives within the Stratix V GX family, and practical design notes not consolidated in the manufacturer datasheet.
ドロップイン代替品: 5SGXMABK3H40I4G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
5SGXMA7K3H40I3N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
5SGXMA9K3H40I3N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
5SGXMA7K3F40I3N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
5SGXMA9K3F40I3N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
5SGXEA7K3F40I3N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
5SGXMABK3H40I4G 最大定格＆電気的特性
| Family | Stratix V GX |
| Logic Elements (LE) | 952,000 |
| Embedded Memory | 53,248,000 bits |
| User I/Os | 696 |
| パッケージ | 1517-BBGA, FCBGA (flip-chip BGA) |
| Process Node | 28 nm |
| 実装タイプ | Surface Mount |
5SGXMABK3H40I4G 1517-bbga, fcbga (flip-chip bga) ピン配置ガイド
5SGXMABK3H40I4G (1517-bbga, fcbga (flip-chip bga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 5SGXMABK3H40I4G.
詳細は データシート をご参照ください。
主な用途
5SGXMABK3H40I4G の用途: 6 件s: 10 Gigabit Ethernet Aggregation Switch, Wireless Baseband Processing, High-Speed Data Acquisition System, Military / Defense Radar Signal Processing, Broadcast Video Encoding / Processing, Industrial Test & Measurement Backplane.
10 Gigabit Ethernet Aggregation Switch
The 5SGXMABK3H40I4G's 14.1 Gbps transceivers and embedded MAC/PCS hard IP make it ideal for a multi-port 10GE aggregation switch fabric. With 696 user I/Os the device can drive multiple external 10G SFP+ cages alongside a DDR3 packet buffer. Quartus IP for 10G Ethernet MAC, XAUI, and Interlaken is drop-in available. Power consumption is dominated by the 28 nm transceiver PHYs, which carry roughly 100 to 130 mW per active 10G channel. Industrial temperature grade ensures deployment in outdoor telecom cabinets.
おすすめ
Wireless Baseband Processing
In LTE-Advanced and 5G baseband applications, the 5SGXMABK3H40I4G's variable-precision DSP blocks deliver up to 600 MHz operation for FFT, channel estimation, and turbo-decoder pipelines. The 53 Mbit embedded memory allows localized buffering of 100 MHz LTE carriers without external SRAM access, reducing latency. CPRI/OBSAI serializer/deserializer connectivity is supported natively via the 14.1 Gbps transceivers, eliminating external SerDes ICs. Industrial temp grade supports pole-mount outdoor radio units.
おすすめ
High-Speed Data Acquisition System
The 5SGXMABK3H40I4G supports multi-channel, multi-Gsps digitizer systems by combining its 600 MHz DSP blocks with external 8-16 bit GS/s ADCs over LVDS or JESD204B. Wide memory bandwidth (DDR3 hard controllers) handles deep capture buffers for radar and instrumentation. The 696 I/Os permit 32+ parallel LVDS data lanes at ~1 Gbps each. Industrial temperature grade enables deployment in field-ruggedized digitizer enclosures where fanless convection cooling matters.
おすすめ
Military / Defense Radar Signal Processing
For phased-array radar beamforming and pulse compression, the 5SGXMABK3H40I4G's 952K LE fabric executes pulse-Doppler algorithms in real time, while transceivers digitize phased-array element data at up to 14.1 Gbps. Embedded M20K and MLAB memory reduces external SRAM dependencies for FFT windows. AES-256 bitstream encryption (Stratix V feature) protects against reverse engineering. Industrial temperature grade suits shipboard and ground-mobile platforms; for full MIL-spec -55 C to +125 C operation, use the separately marketed military-grade derivative.
おすすめ
Broadcast Video Encoding / Processing
In 4K/UHD encoder and pro-broadcast routing systems, the 5SGXMABK3H40I4G's parallel DSP bandwidth accelerates H.265/HEVC encoding, frame-rate conversion, and color-space transforms. Transceivers carry SDI-over-IP (SMPTE 2022/2110) at 10 Gbps line rates without external PHYs. The 696 I/Os link to HDMI 2.0 / DisplayPort 1.4 ingest/egress pipelines. Industrial temperature grade covers pro-A/V rack environments with elevated airflow and ambient temperatures.
おすすめ
Industrial Test & Measurement Backplane
For PXI/PXIe and AXIe automated test instrumentation, the 5SGXMABK3H40I4G serves as the master controller for multi-slot test slots that aggregate compliance, RF, and audio test points. Integrated PCIe Gen2/Gen3 hard IP links to the host chassis backplane without external bridges. Low-latency DMA-style transfers via embedded M20K memory achieve ATE-grade throughput. Industrial temperature grade supports un-cooled production-test racks that can reach +50 C ambient.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 5SGXMABK3H40I4G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 5SGXMA7K3H40I3N | 5SGXMA9K3H40I3N | 5SGXMA7K3F40I3N | 5SGXMA9K3F40I3N | 5SGXEA7K3F40I3N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-BGA (FCBGA) | 1517-BGA (FCBGA) - same | 1517-BGA (FCBGA) - same | 1517-BGA (FCBGA) - same | 1517-BGA (FCBGA) - same | 1517-BGA (FCBGA) - same |
| Logic Elements | 952,000 | 622,000 | 840,000 | 622,000 | 840,000 | 622,000 |
| Transceivers | GX, up to 14.1 Gbps | GX, up to 14.1 Gbps | GX, up to 14.1 Gbps | GX, up to 14.1 Gbps | GX, up to 14.1 Gbps | E family (no transceivers) |
| Temperature Grade | Industrial (-40 to +100 C) | Industrial | Industrial | Commercial | Commercial | Commercial |
| Family | Stratix V GX | Stratix V GX | Stratix V GX | Stratix V GX | Stratix V GX | Stratix V E |
| Process Node | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm |
主な差別化要因
- Highest logic density in Stratix V GX family with this package （vs 5SGXMA9K3H40I3N)
- Industrial-grade temperature for outdoor deployment （vs 5SGXMA7K3F40I3N)
- GX transceiver-rich variant with PCIe hard IP （vs 5SGXEA7K3F40I3N)
設計ノート
The 1517-BGA FCBGA at 1.0 mm pitch requires HDI construction with via-in-pad microvias. Use a minimum 1+6+1 HDI stack-up, dedicated GSG/GSGSG differential via fencing under each transceiver channel, and continuous ground/power core sandwiches. According to Altera/Intel Stratix V hardware guidelines, transceiver channels should be routed only over a solid reference ground plane, never split across power islands. Implement length-matching within 0.5 ps across all four TX/RX lanes.
Estimated: at full LE utilization (952K LE, 50% toggle, 85% utilization), power dissipation is approximately 15-20 W. With package theta_JA around 8-12 C/W for the FCBGA, junction temperature can rise 120-240 C above ambient without active cooling, exceeding the 100 C industrial grade ceiling. Mandatory: a heatsink with finned aluminum plus 1-2 m/s of forced airflow. For sealed enclosures, plan for a 30-40 C derate on the upper ambient.
Do not apply glue logic on the same transceiver pins for boundary-scan - the Stratix V JTAG chain breaks the transceiver TAP unless explicitly bypassed in the Quartus device pin assignment. Do not exceed 1.0 V/V ms ramp time on VCC to avoid inrush latch-up. Designate unique transceiver refclk requirements because all GXB transceivers share a common PLL block - mismatch refclk inputs will corrupt multiple lanes.
コンプライアンス情報
RoHS compliance inferred from G-suffix ordering code and Intel product page standards. Stratix V devices are not AEC-Q100 qualified - they target industrial, telecom, and defense (separate military-grade derivative), not automotive.
