AFS600-FG256K - 600K-Gate Mixed-Signal FPGA | Microchip
部品番号: AFS600-FG256K ✓ 生産中AFS600-FG256K 概要
A mixed-signal FPGA is a programmable semiconductor that integrates digital logic with configurable analog functions. Within the product hierarchy, a mixed-signal FPGA extends the conventional FPGA and CPLD categories by adding analog blocks and application-oriented peripherals on the same monolithic device. This integration can reduce board partitioning while allowing control, signal conditioning, conversion, timing, and programmable logic to be implemented in one package.
The AFS600-FG256K provides approximately 600,000 system gates and is reported with 13,824 logic cells. Its nonvolatile flash configuration retains the programmed design when power is removed and supports live-at-power-up operation. The advanced 130 nm CMOS process uses seven metal layers, while the monolithic construction places programmable logic, flash memory, analog circuitry, and clock-management resources on one device.
The device also belongs to the Fusion family with optional ARM support, allowing designers to select a variant suitable for processor-assisted control logic rather than implementing every control routine in programmable logic. Its integrated analog resources are intended for mixed-signal designs, and its clock-generation and management circuitry helps designers establish multiple internal or external clock domains within a deterministic FPGA implementation.
Typical uses include industrial monitoring and control, communications-interface consolidation, instrumentation, embedded control, mixed-signal sensor acquisition, and FPGA prototyping. AFS600-family devices can support designs that need substantially more logic than a small CPLD while retaining the convenience of nonvolatile flash configuration and integrated analog capabilities.
The principal design consideration is package density. A 256-ball BGA with 1.0 mm pitch requires careful PCB escape routing, via-in-pad or via-under-ball structures where appropriate, X-ray inspection, and assembly process controls. The supplied excerpts do not verify the exact ball map, so the package drawing must not be treated as a substitute for the manufacturer pinout and footprint documentation.
This product record consolidates verified device specifications, package identity, temperature limits, source links, and migration candidates into a design-oriented reference. It also distinguishes documented facts from unavailable pricing, pinout, compliance, and detailed electrical information so engineers can identify what must still be confirmed before schematic release or production sourcing.
ドロップイン代替品: AFS600-FG256K — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: AFS600-FG256K （同一形状・フットプリント） — 相違点: Device Type, Process Technology, System Gates, Package Type, Metal Layers.
AFS600-1FG256K
✅ ドロップイン価格はお問い合わせください
データシートを見る →M7AFS600-FG256I
✅ ドロップイン価格はお問い合わせください
データシートを見る →AFS600-FG256YK
✅ ドロップイン📋 参考代替品（カタログ未掲載）
AFS600-FGG256K
✅ ドロップイン価格はお問い合わせください
データシートを見る →AFS600-FG256
✅ ドロップイン価格はお問い合わせください
データシートを見る →AFS600-FG256K 最大定格＆電気的特性
| System Gates | 600,000 system gates |
| Logic Cells | 13,824 logic cells |
| Device Type | Fusion mixed-signal FPGA |
| Programmable Logic | Flash-based CMOS programmable logic |
| Configuration Technology | Nonvolatile flash configuration |
| Power-Off Retention | Program retained when powered off |
| Power-Up Behavior | Live at Power-Up (LAPU) |
| Process Technology | 130 nm CMOS |
| Metal Layers | 7 metal layers |
| Logic Family | CMOS |
| 電源電圧 | 1.5 V |
| 動作温度範囲 | 0°C to 70°C |
| Package Type | BGA-256, 1.0 mm pitch |
| ピン数 | 256 pins |
| 実装タイプ | Surface mount |
| ARM Support | Optional ARM support in the Fusion family |
AFS600-FG256K bga-256, 1.0 mm pitch ピン配置ガイド
AFS600-FG256K (bga-256, 1.0 mm pitch パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: AFS600-FG256K.
詳細は データシート をご参照ください。
主な用途
AFS600-FG256K の用途: 6 件s: Industrial Monitoring and Control, Communications Interface Consolidation, Precision Instrumentation, Mixed-Signal Sensor Acquisition, FPGA Design Prototyping, Embedded Control and Data Processing.
Industrial Monitoring and Control
The AFS600-FG256K fits industrial monitoring systems that combine sensor conditioning, programmable logic, control sequencing, communications, and local data handling in one FPGA. Its approximately 600,000 system gates and 13,824 logic cells provide substantial capacity for control state machines, diagnostics, data acquisition sequencing, and communication protocols. The verified 0°C to 70°C range suits controlled indoor equipment, while nonvolatile flash configuration and Live at Power-Up behavior support deterministic restart without an external configuration loader. Engineers should still confirm analog-channel requirements and the exact BGA pin map before assigning inputs or outputs.
おすすめ
Communications Interface Consolidation
The AFS600-FG256K can consolidate multiple communications interfaces, protocol converters, framing logic, and supervisory functions around a single 600,000-system-gate programmable-logic device. Its flash-based configuration allows the interface behavior to be updated without removing the FPGA, and the monolithic mixed-signal architecture can place programmable logic beside timing and analog resources when required. The 1.5 V supply and BGA-256 construction suit dense equipment designs, although high-speed layout must follow the manufacturer stack-up and pin guidance. Exact transceiver interfaces, clock targets, I/O standards, and timing margins remain subject to device-level verification.
おすすめ
Precision Instrumentation
The AFS600-FG256K is suitable for instrumentation that needs flexible logic alongside configurable analog functions and deterministic configuration retention. The 13,824 logic cells can implement acquisition control, calibration sequencing, digital filtering, trigger logic, measurement formatting, and interface management, while the 600,000-system-gate figure leaves substantial capacity for reusable processing blocks. Nonvolatile flash configuration is especially useful for field-programmable test equipment because operating logic can be updated without supplying power to the configuration memory. The 0°C to 70°C range fits laboratory and controlled industrial equipment, but calibration accuracy and analog performance must be validated from the complete datasheet.
おすすめ
Mixed-Signal Sensor Acquisition
The AFS600-FG256K supports mixed-signal sensor-acquisition designs because the Fusion architecture integrates configurable analog resources with flash-based programmable logic in a monolithic 1.5 V CMOS device. Programmable logic can coordinate sampling, filtering, compensation, threshold detection, and data transfer around the analog functions. Its 600,000 system gates provide more implementation capacity than a small CPLD, while LAPU behavior helps the acquisition system enter a defined state after power restoration. Engineers should verify the number and characteristics of analog resources, input bandwidth, sample-rate requirements, and board-level grounding before assigning the device to a precision sensor front end.
おすすめ
FPGA Design Prototyping
AFS600-FG256 platforms are used for prototyping smaller Fusion devices within a compatible package family, making the AFS600-FG256K relevant to hardware bring-up and system-level demonstrations before a smaller production device is selected. The verified Microsemi application note identifies AFS600-FG256 as a prototyping platform and states that it can demonstrate most Fusion features. Engineers can use its 600,000 system gates to implement the intended programmable logic, analog control, flash-memory usage, and clock-management behavior before transferring the design to a smaller footprint. Timing, I/O, memory, and power differences must still be reviewed during that final migration.
おすすめ
Embedded Control and Data Processing
The AFS600-FG256K is appropriate for embedded control systems that require more programmable logic than a conventional microcontroller provides while retaining nonvolatile configuration. Its 13,824 logic cells and approximately 600,000 system gates can support parallel data paths, real-time state machines, custom peripherals, acquisition pipelines, and communications adaptors. The optional ARM support associated with the Fusion family allows engineers to evaluate processor-assisted architectures without treating all family members as identical. The exact order code must be checked for ARM capability, and the design must account for the BGA-256 assembly requirements and the 0°C to 70°C operating limit.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: AFS600-FG256K — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | AFS600-1FG256K | AFS600-FG256I | AFS600-FG256YK | AFS600-FGG256K | AFS600-FG256 |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | BGA-256, 1.0 mm pitch | 256-LBGA | 256-LBGA | 256-terminal S-PBGA | BGA-256 | BGA-256, 1.0 mm pitch |
| System Gates | 600,000 system gates | 600,000 system gates | 600,000 system gates | 600,000 equivalent gates | 600,000 system gates | 600,000 system gates |
| Configuration Memory | Nonvolatile flash | Flash-based | Flash-based | Flash-based | Flash-based | Flash-based |
| Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process Technology | 130 nm CMOS, 7 metal layers | 130 nm CMOS, 7 metal layers | 130 nm CMOS, 7 metal layers | 130 nm CMOS, 7 metal layers | 130 nm CMOS, 7 metal layers | 130 nm CMOS, 7 metal layers |
| Live at Power-Up | Yes | Yes | Yes | Yes | Yes | Yes |
主な差別化要因
- Combines configurable analog resources and flash-based programmable logic （vs AFS600-FG256)
- Provides a large 600,000-system-gate implementation target for mixed-signal designs （vs A2F060)
- Retains configuration and supports Live at Power-Up （vs A2F200)
- Uses a dense 256-pin, 1.0 mm-pitch surface-mount BGA （vs AFS600-1FG256K)
設計ノート
Treat the BGA-256 land pattern as a controlled assembly artifact. Use the current Microchip package drawing to define pad dimensions, solder-mask and paste apertures, and ball orientation, then plan a BGA escape strategy before placing the FPGA. At 1.0 mm pitch, a conventional two-layer board may not provide sufficient routing or assembly margin. Validate the selected stack-up, microvia or buried-via structure, impedance, and fabrication capability with the assembly house.
The verified supply-voltage value is 1.5 V, but that value alone is insufficient to design the power tree. Obtain the complete recommended operating conditions, core and I/O supply topology, rail sequencing, permissible tolerance, and current limits from the AFS600 family datasheet. Place required high-frequency decoupling directly at the relevant supply balls and keep analog and digital return paths controlled, especially if the selected design uses configurable analog resources.
Do not substitute an AFS600 ordering code solely because its package name matches BGA-256. The verified excerpts distinguish -FG256K, -1FG256K, -FG256I, -FG256YK, and -FGG256K, but do not disclose the full meaning of every suffix. Confirm package pin compatibility, temperature grade, speed grade, device identifiers, operating voltages, and lifecycle status in the official ordering guide before converting an existing design or releasing a footprint.
Complete signal-integrity and power-integrity analysis before high-speed implementation. The programmable-logic and mixed-signal resources may have sensitive timing and analog routing constraints that are not visible in the package-outline data. Use the manufacturer clocking guidance, preserve the intended ball assignments, minimize return-path discontinuities, and verify differential or high-speed pairs with the selected PCB stack-up and simulation tools.
The verified excerpts do not provide junction temperature, thermal resistance, or FPGA power dissipation, so a defensible thermal estimate cannot be calculated from the supplied data. After obtaining the electrical characteristics, calculate worst-case static and dynamic dissipation under the intended clock, I/O, memory, and analog loading. Use the package thermal model and PCB copper assumptions for junction-temperature assessment rather than relying on the 0°C to 70°C ambient specification alone.
コンプライアンス情報
The verified excerpts do not provide RoHS, REACH, lead-free, halogen-free, or conflict-minerals statements. AEC-Q100 is marked not_applicable because no automotive qualification claim was supplied for this ordering code.
