APA750-BG456 - 750K Gate 180MHz ProASICPLUS FPGA | Microchip
部品番号: APA750-BG456 ✗ 生産終了APA750-BG456 概要
A field-programmable gate array is a programmable-logic device that combines configurable logic, memory, and I/O resources in one integrated circuit. The APA750 belongs to the ProASICPLUS family, a reprogrammable and nonvolatile FPGA platform positioned between mask-programmable custom logic and higher-density programmable-logic devices. It is useful when a design needs logic changes after manufacture without replacing the entire board assembly.
The APA750-BG456 provides 750K system gates, 147,456 RAM bits, and 356 I/O in a 456-PBGA package. The listed operating supply range is 2.3 V to 2.7 V, while the device description identifies 2.5 V operation and up to 180 MHz performance. The commercial-temperature ordering information identifies an operating range of 0°C to 70°C for the APA750-BG456 variant.
The ProASICPLUS architecture uses Flash-based configuration technology, allowing the device to retain its programmed configuration without volatile RAM. The high I/O count allows connections to external memory, parallel buses, control signals, and mixed-signal system interfaces. Designers should treat the published gate and RAM figures as device-family resources and verify the exact resource allocation in the design tool for the selected configuration.
Typical applications include industrial control, telecommunications interface equipment, instrumentation, embedded data acquisition, and high-I/O peripheral aggregation. The 456-pin package requires careful PCB layout with dense escape routing, ground-plane continuity, and controlled impedance for high-speed interfaces. The large pin count also requires attention to assembly capability, inspection, and thermal spreading beneath the BGA.
For a new PCB, use the Microchip pinout and package information to assign power, ground, configuration, clock, and user I/O signals. For a revision using an existing 456-BGA footprint, verify every power rail, configuration pin, and I/O signal against the exact package variant. The APA750-BGG456 is identified as package-compatible in the comparison data, while APA750-BG456I is an industrial-temperature ordering variant with the same 456-BBGA package designation.
This product page combines the APA750-BG456 specifications, package details, practical PCB considerations, drop-in comparison options, and sourcing guidance. It helps engineers distinguish the commercial APA750-BG456 from the BGG456 and BG456I variants before committing to a board layout or production BOM.
ドロップイン代替品: APA750-BG456 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
APA750-BGG456
✅ ドロップイン📋 参考代替品（カタログ未掲載）
APA750-BG456I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
APA750-BG456 最大定格＆電気的特性
| Device Type | ProASICPLUS field-programmable gate array (FPGA) |
| System Gates | 750,000 gates |
| RAM Bits | 147,456 bits |
| Number of I/O | 356 I/O |
| Maximum Performance | 180 MHz |
| Process Technology | 0.22 µm CMOS |
| 電源電圧 | 2.5 V |
| Operating Supply Range | 2.3 V to 2.7 V |
| パッケージ | 456-pin PBGA, 35 mm × 35 mm |
| Package Designation | 456-BBGA |
| 実装タイプ | Surface mount |
| 動作温度 | 0°C to 70°C (TA) |
| Programmable Logic | Flash-based reprogrammable and nonvolatile configuration |
| I/O Architecture | 356 configurable I/O |
| Moisture Sensitivity Level | MSL 3, 168 hours |
| ECCN | 3A991D |
| RoHS ステータス | RoHS non-compliant |
| REACH Status | REACH unaffected |
| Programmable | Yes; programmable status not verified |
APA750-BG456 456-bbga ピン配置ガイド
APA750-BG456 (456-bbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: APA750-BG456.
詳細は データシート をご参照ください。
主な用途
APA750-BG456 の用途: 6 件s: Industrial PLC and Automation Control, Telecommunications Interface Equipment, Data Acquisition and Instrumentation, Embedded Peripheral Aggregation, Industrial Networking and Protocol Conversion, Test and Measurement Equipment.
Industrial PLC and Automation Control
The APA750-BG456 fits industrial programmable-logic control systems that combine many discrete interfaces with deterministic internal logic. Its 356 I/O provide substantial connectivity for digital sensors, actuator drivers, interlocks, and machine-control buses, while 147,456 RAM bits support buffering and stateful control functions. According to the Microchip manufacturer datasheet, the device operates from 2.3 V to 2.7 V and offers up to 180 MHz performance. The Flash-based configuration remains nonvolatile, allowing field-updatable logic without volatile configuration memory. For production control equipment, the 456-BBGA footprint should be laid out with continuous ground distribution, carefully decoupled supply rails, and controlled escape routing for external I/O.
おすすめ
Telecommunications Interface Equipment
The APA750-BG456 is suitable for telecommunications interface modules that must consolidate parallel data paths, control signals, and status monitoring onto one programmable-logic device. The 750,000 system gates provide capacity for protocol conversion, framing, and control logic, while the 356 I/O facilitate connections to line-card processors, transceivers, and test equipment. According to the Microchip manufacturer datasheet, the device uses 0.22 µm CMOS technology and supports a 2.3 V to 2.7 V supply range. Flash-based nonvolatile configuration is useful in equipment that must retain logic through power loss. The 456-pin PBGA demands a dense but disciplined PCB stack-up, with uninterrupted reference planes and impedance-controlled routes for high-speed interfaces.
おすすめ
Data Acquisition and Instrumentation
The APA750-BG456 can act as the central programmable-logic device in a multi-channel data-acquisition system. Its 147,456 RAM bits provide resources for sample buffering, correlation, filtering, and temporary data organization, while 356 I/O can connect multiplexers, converters, timing circuits, and communication transceivers. According to the Microchip manufacturer datasheet, performance reaches up to 180 MHz, allowing the device to coordinate digital signal-path functions. The 2.5 V nominal supply operation suits low-voltage mixed-signal boards when designers follow the prescribed power and ground connections. For precision instrumentation, separate analog and digital routing where practical, keep switching and high-current return paths away from sensitive inputs, and verify timing closure for every implemented interface.
おすすめ
Embedded Peripheral Aggregation
The APA750-BG456 is useful in embedded systems where several legacy parallel peripherals must be consolidated behind programmable logic. Its 356 I/O can connect memory buses, GPIO expanders, display controllers, storage interfaces, and capture blocks, while the 750,000 system gates allow dedicated logic for arbitration, timing, and protocol handling. According to the Microchip manufacturer datasheet, the ProASICPLUS family uses Flash-based programmable and nonvolatile configuration, making the implementation suitable for field maintenance and firmware-driven logic updates. The 456-pin PBGA provides the required I/O density but increases routing complexity, so designers should reserve escape lanes, preserve plane continuity under the device, and validate solder-ball wetting and inspection coverage during assembly qualification.
おすすめ
Industrial Networking and Protocol Conversion
The APA750-BG456 fits legacy industrial networking equipment that translates between parallel processor buses, lower-speed management interfaces, and custom backplane signaling. The large 356-I/O count supports concurrent data, clock, chip-select, and control connections, while up to 180 MHz performance provides headroom for synchronous protocol logic. According to the Microchip manufacturer datasheet, the device uses 2.3 V to 2.7 V operation with 2.5 V nominal supply voltage and retains its configuration in Flash memory. Engineering teams should assign I/O standards according to the complete bank power requirements, keep sensitive receiver paths away from high-current outputs, and confirm package-ball assignments against the exact APA750 suffix before PCB release.
おすすめ
Test and Measurement Equipment
The APA750-BG456 can serve as a programmable sequencer and interface controller inside automated test equipment. Its 750,000 system gates and 147,456 RAM bits support timing control, result collection, pattern sequencing, and temporary test-vector handling, while 356 I/O connect instruments, relays, DUT fixtures, and status displays. According to the Microchip manufacturer datasheet, the Flash-based ProASICPLUS configuration is nonvolatile and reprogrammable, supporting product-specific test sequences and field upgrades. The dense 456-BBGA package requires exact ball-pattern matching, robust power-plane distribution, and thermal analysis because high-speed switching activity can create local heating. Signal-integrity checks should include termination, trace skew, and return-path continuity on every external test port.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: APA750-BG456 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | APA750-BGG456 | APA750-BG456I |
|---|---|---|---|
| Package | 456-pin PBGA (35x35 mm) | 456-pin PBGA (35x35 mm) | 456-pin PBGA (35x35 mm) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Device Type | ProASICPLUS FPGA | ProASICPLUS FPGA | ProASICPLUS FPGA |
| System Gates | 750,000 gates | 750,000 gates | 750,000 gates |
| RAM Bits | 147,456 bits | 147,456 bits | 147,456 bits |
| Number of I/O | 356 I/O | 356 I/O | 356 I/O |
| Maximum Performance | 180 MHz | 180 MHz | 180 MHz |
| Supply Voltage Range | 2.3 V to 2.7 V | 2.3 V to 2.7 V | 2.3 V to 2.7 V |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS | 0.22 µm CMOS |
主な差別化要因
- Package-compatible family alternative （vs APA750-BGG456)
- Industrial-temperature ordering path （vs APA750-BG456I)
- High-density programmable logic （vs APA750-BGG456)
設計ノート
Use the manufacturer 456-PBGA land pattern and ball map without substituting a generic BGA footprint. The package is identified as 35 mm × 35 mm, and the 356 I/O plus power, ground, and configuration balls require careful escape routing. Preserve uninterrupted reference planes beneath the device, maintain the specified ball-pad geometry, and route high-speed signals with short returns before launching fabrication.
Follow the complete manufacturer power-pin and decoupling recommendations for the APA750-BG456. The listed supply range is 2.3 V to 2.7 V with 2.5 V nominal operation, but I/O banks may impose additional constraints when different voltage standards are mixed. Place bypass capacitors close to their associated supply balls, provide adequate current capacity for configuration and I/O activity, and verify sequencing against the configuration requirements in the manufacturer datasheet.
Estimate thermal performance using the actual switching activity, core utilization, I/O loading, ambient temperature, and PCB copper area rather than relying only on the device's maximum clock rate. Estimated: power dissipation equals supply power plus I/O power, and junction rise depends on the effective package-to-ambient path. Include a thermal spreading design under the BGA and use the manufacturer's power-dissipation data to set conservative operating limits.
Do not treat APA750-BG456, APA750-BGG456, and APA750-BG456I as interchangeable merely because their headline gate, RAM, and I/O figures match. Verify the exact ball assignments, temperature grade, configuration compatibility, device status, and ordering requirements. For an existing PCB, compare every power and ground ball and all configuration pins before approving a substitution or launching a replacement order.
コンプライアンス情報
The exact-MPN technical listing records RoHS as non-compliant and REACH as unaffected. AEC-Q100 status is not listed and is not applicable to this general-purpose programmable-logic device.
