ATSAM3S2CA-AUR - 64MHz Cortex-M3 MCU 128KB Flash | Microchip
部品番号: ATSAM3S2CA-AUR ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
ATSAM3S2CA-AUR 概要
A microcontroller (MCU) is a single-chip computer that integrates a processor core, program memory (flash), data memory (SRAM), and a rich set of peripherals such as timers, serial interfaces (USART, SPI, I2C/TWI), ADC channels, and general-purpose I/O. Within the semiconductor hierarchy, the ATSAM3S2CA-AUR belongs to the SAM3S family, the ARM Cortex-M3 core class, the 32-bit microcontroller category, and the broader embedded processor / power management system domain of a board design.
Key differentiating features include the Thumb-2 instruction set of the Cortex-M3 core, which delivers high code density; 128 KB (128K x 8) of on-chip flash for program storage; fast SRAM for data; and a comprehensive peripheral set that allows a single MCU to handle sensing, control, and communication tasks simultaneously. Industrial temperature qualification and a green, RoHS-compliant LQFP package make the part suitable for long-lifecycle embedded products.
Architecturally, the Cortex-M3 core uses a Harvard bus structure with separate instruction and data paths, a nested vectored interrupt controller (NVIC) for deterministic interrupt latency, and hardware multiply/divide support. The SAM3S series pairs this core with Microchip (formerly Atmel) peripheral infrastructure, including DMA-capable serial controllers that offload the CPU during data transfers.
Typical applications include industrial control and automation nodes, consumer and medical devices, test instruments, and smart sensing modules. The 100-pin LQFP offers abundant GPIO for keypad, display, and peripheral interfacing, which is why this variant is popular for human-machine interface boards.
When designing with this MCU, verify the flash density matches your firmware footprint before committing a footprint - larger SAM3S family members (ATSAM3S4CA, ATSAM3S8CA) are pin-compatible upgrades that require no PCB changes.
This page synthesizes distributor pricing context, drop-in alternatives, and practical design notes beyond what the manufacturer datasheet provides, giving engineers a single citable reference for the ATSAM3S2CA-AUR.
ドロップイン代替品: ATSAM3S2CA-AUR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: ATSAM3S2CA-AUR （同一形状・フットプリント） — 相違点: RoHS Status, Core Processor, Package, Supply Voltage Range, Connectivity.
クイック比較ツール — 並列比較する代替部品を選択:
ATSAM3S4CA-AUR
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
ATSAM3S8CA-AU
✅ ドロップイン📋 参考代替品（カタログ未掲載）
ATSAM3S2CA-AU
✅ ドロップイン✓ 在庫あり
$4.25 / 個
データシートを見る →ATSAM3S2CA-CUR
✅ ドロップイン✓ 在庫あり
$4.89 / 個
データシートを見る →ATSAM3S2CA-AUR 最大定格＆電気的特性
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| 最大クロック周波数 | 64 MHz |
| Flash Memory | 128 KB (128K x 8) |
| Instruction Set | Thumb-2 (RISC) |
| Supply Voltage Range | 1.62 V to 3.6 V (1.8 V / 3.3 V) |
| パッケージ | 100-LQFP (14x14 mm) |
| 実装タイプ | Surface Mount |
| Terminal Form | Gull Wing |
| Number of Terminals | 100 |
| Temperature Grade | Industrial |
| Packaging | Tape & Reel (TR) |
| RoHS ステータス | ROHS3 Compliant |
| Package Color / Green Status | LQFP GREEN |
ATSAM3S2CA-AUR lqfp green ピン配置ガイド
ATSAM3S2CA-AUR (lqfp green パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: ATSAM3S2CA-AUR.
詳細は データシート をご参照ください。
主な用途
ATSAM3S2CA-AUR の用途: 6 件s: Industrial Control and Automation, Human-Machine Interface (HMI) Boards, Test and Measurement Instruments, Medical and Health Monitoring Devices, Smart Sensing and IoT Edge Nodes, Consumer Appliance Control.
Industrial Control and Automation
The ATSAM3S2CA-AUR fits industrial control nodes because its industrial temperature grade and 64 MHz Cortex-M3 core handle deterministic interrupt-driven control loops while leaving CPU headroom for communication. The 1.62V-3.6V supply tolerance absorbs rail sag on factory floors, and the Thumb-2 instruction set keeps control firmware compact within the 128 KB flash. Typical topologies place the MCU between sensors and actuators, using USART/SPI for PLC backhaul and timers for PWM actuation. Unlike 8-bit MCUs, it runs full protocol stacks without external memory, though designers should budget flash for field-updatable bootloaders.
おすすめ
Human-Machine Interface (HMI) Boards
The 100-pin LQFP package of the ATSAM3S2CA-AUR provides abundant GPIO for keypads, rotary encoders, LCD segments, and status indicators, which is why HMI front panels are a classic SAM3S use case. The 64 MHz core drives segment or small TFT displays through SPI with DMA offload, keeping the CPU free for touch/keypad scanning. The 128 KB flash accommodates display fonts and localized string tables. Placing the MCU near the display connector shortens high-speed SPI traces; use series resistors on SCK/MOSI to control edge rates and reduce EMI on the front-panel assembly.
おすすめ
Test and Measurement Instruments
Bench and handheld instruments benefit from the ATSAM3S2CA-AUR's Cortex-M3 timing precision, hardware divider, and 64 MHz clock for measurement sequencing. Its 128 KB flash stores calibration tables and multi-language menus, while SRAM buffers sampled data streamed through DMA-capable USART or SPI links. Industrial temperature rating keeps handheld instruments stable across field conditions. Designers typically pair the MCU with a precision ADC front end, using a dedicated crystal for the MCU and shielding the analog section from the digital bus to preserve measurement accuracy at the microvolt level.
おすすめ
Medical and Health Monitoring Devices
Portable health devices use the ATSAM3S2CA-AUR for its balance of 64 MHz processing, 128 KB flash for signal-processing code, and 1.62V-3.6V single-supply operation compatible with battery-backed 3.3V rails. The Cortex-M3 NVIC supports fast, deterministic servicing of sensor-ready interrupts from physiological front ends (heart-rate, SpO2, temperature). DMA-driven serial interfaces stream samples without CPU intervention, extending battery life. Because medical designs require long procurement lifecycles, the active lifecycle status of the SAM3S family and Microchip's longevity commitments make this MCU a defensible platform choice for regulated product roadmaps.
おすすめ
Smart Sensing and IoT Edge Nodes
IoT edge nodes pair the ATSAM3S2CA-AUR with radio modules over USART or SPI; the 64 MHz core runs protocol framing, AES-style payload preparation, and sensor fusion while the radio sleeps. The 128 KB flash holds a full TCP/LoRa-style stack plus OTA-update bootloader, and DMA buffers decouple bursty radio traffic from the MCU. Supply tolerance from 1.62V allows direct operation from a single-cell regulator chain. The main design trade-off versus newer ultra-low-power cores is standby energy - put the MCU in its lowest-power wait modes between sensor intervals and gate peripheral clocks aggressively.
おすすめ
Consumer Appliance Control
Appliances such as coffee machines, air purifiers, and small HVAC units use the ATSAM3S2CA-AUR to run user interfaces, motor control sequencing, and safety monitoring in one chip. The industrial temperature grade exceeds consumer requirements, adding reliability margin, and the green ROHS3-compliant LQFP supports high-volume SMT assembly on tape and reel. The 128 KB flash is sufficient for touch-debounce logic, display drivers, and fault-logging firmware. Use timer peripherals for zero-cross detection and triac firing, and reserve one USART for a production-line diagnostic port to reduce field-service costs.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: ATSAM3S2CA-AUR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | ATSAM3S4CA-AUR | ATSAM3S8CA-AU | ATSAM3S2CA-AU | ATSAM3S2CA-CUR |
|---|---|---|---|---|---|
| Package | 100-LQFP (14x14 mm) | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit |
| Max Clock Frequency | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| Flash Memory | 128 KB | 256 KB | 512 KB | 128 KB | 128 KB |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial | Commercial |
| Packaging | Tape & Reel | Tape & Reel | Tray | Tray | Tape & Reel |
主な差別化要因
- Cost-optimized 128 KB flash density within the SAM3S 100-pin family （vs ATSAM3S4CA-AUR)
- Tape-and-reel packaging for automated SMT lines （vs ATSAM3S2CA-AU)
- Industrial temperature qualification （vs ATSAM3S2CA-CUR)
設計ノート
Design the 3.3V rail for the ATSAM3S2CA-AUR within its 1.62V-3.6V datasheet window and follow the SAM3S datasheet power-supply decoupling scheme: place a 100 nF ceramic capacitor at each VDD/VDDIO pin pair plus bulk capacitance near the regulator. Brown-out behavior should be enabled so the MCU resets cleanly rather than executing corrupted code during rail sag on shared industrial supplies. Estimated: total current draw depends on enabled peripherals; consult the datasheet power consumption section for per-mode figures before sizing the regulator.
For the 100-pin LQFP (0.5 mm pitch, 14x14 mm), follow the package drawing in the SAM3S datasheet for land pattern dimensions and use the exposed-numbering convention consistently in your footprint library. Route the main crystal as close as possible to the OSC pins with short guard traces and a local ground. Because this is a fine-pitch gull-wing package, specify a no-clean or water-wash soldering process and verify with X-ray or AOI that no bridges exist on the densest corners of the footprint.
Do not confuse ordering suffixes: the -AUR is industrial grade, tape and reel; the -CU variant is commercial grade and unsuitable for extended-temperature products; the -AU tray variant is identical silicon but packaged for prototypes. Also confirm flash sizing headroom - at 128 KB, a bootloader plus OTA payload double-buffering can consume the majority of flash; if your roadmap includes field updates, consider pin-compatible ATSAM3S4CA or ATSAM3S8CA parts from the start of layout.
コンプライアンス情報
ROHS3 compliant and green package per Mcu-Supplier and Mouser listings (LQFP GREEN, industrial temp). REACH, halogen-free, and conflict minerals declarations must be confirmed via the Microchip compliance portal.