ATSAM3S4AA-MUR - 64MHz Cortex-M3 MCU 256KB Flash | Microchip
部品番号: ATSAM3S4AA-MUR ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $7.5 | $7.50 |
| 10 | $6.95 | $69.50 |
| 100 | $6.3 | $630.00 |
| 500 | $5.8 | $2,900.00 |
| 1,000 | $5.25 | $5,250.00 |
| 3,000 | $4.85 | $14,550.00 |
ATSAM3S4AA-MUR 概要
A microcontroller unit (MCU) is a single-chip computer that integrates a processor core, program memory, data memory, and peripherals on one die, sitting at the heart of the embedded-system hierarchy between simple logic devices and full application processors. The SAM3S series is Microchip's (formerly Atmel) medium-range general-purpose MCU family, positioned for designs balancing low power consumption, processing power, and peripheral integration.
Key features include the 64 MHz Cortex-M3 core with a 3-stage pipeline and Thumb-2 instruction set, 256 KB (256K x 8) of zero-wait-state flash, and an operating supply range of 1.62 V to 3.6 V. The device integrates a fast 12-bit ADC, an on-chip 1.8 V LDO regulator (VDDOUT), USB 2.0 full-speed device port on SAM3S A-variant peripherals, and parallel data capture mode on the PIOs that collects data from non-standard sources such as low-cost image sensors, with DMA offloading the CPU.
Technical depth: the SAM3S architecture pairs the Harvard-architecture Cortex-M3 with an on-chip ARC bus, nested vectored interrupt controller, and 12-channel DMA, enabling peripheral-to-memory transfers without CPU intervention. Flash memory is organized to permit simultaneous read-while-write operation for EEPROM emulation. Power management modes include backup, wait, and sleep, supporting battery-operated designs.
Typical applications include industrial sensing and control nodes, consumer appliances, battery-powered portable instruments, USB-connected devices, and image-sensor front ends leveraging the parallel capture mode.
Design consideration: operate within the 1.62 V to 3.6 V supply window and decouple VDDIN with the LDO output VDDOUT per the manufacturer datasheet to preserve ADC accuracy and EMC performance.
This page synthesizes distributor pricing, verified drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: ATSAM3S4AA-MUR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: ATSAM3S4AA-MUR （同一形状・フットプリント） — 相違点: Packaging, Flash Memory, Package, RoHS Status, Core Processor.
クイック比較ツール — 並列比較する代替部品を選択:
ATSAM3S4BA-MU
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$5.12 / 個
データシートを見る →ATSAM3S2AA-MU
✅ ドロップイン✓ 在庫あり
$3.6 / 個
データシートを見る →ATSAM3N4AA-MU
✅ ドロップイン✓ 在庫あり
$4.1 / 個
データシートを見る →ATSAM3S2BA-MU
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
ATSAM3S4AA-MUR 最大定格＆電気的特性
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| 最大クロック周波数 | 64 MHz |
| Flash Memory | 256 KB (256K x 8) |
| Series | SAM3S |
| Supply Voltage Range | 1.62 V to 3.6 V |
| Operating Supply Classes | 1.8 V / 3.3 V |
| パッケージ | 48-QFN (7x7 mm) Exposed Pad |
| 実装タイプ | Surface Mount |
| ピン数 | 48 |
| Instruction Set | Thumb-2 (RISC) |
| インターフェース | USB, UART, SPI, TWI (I2C) |
| DMA | Yes |
| Data Capture | PIO parallel capture mode (image-sensor compatible) |
| On-chip Regulator | 1.8 V LDO (VDDOUT) |
| Packaging | Tape & Reel (MUR suffix) |
| RoHS ステータス | RoHS Compliant (Green package per Mouser listing) |
ATSAM3S4AA-MUR 48-qfn (7x7 mm) exposed pad ピン配置ガイド
ATSAM3S4AA-MUR (48-qfn (7x7 mm) exposed pad パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: ATSAM3S4AA-MUR.
詳細は データシート をご参照ください。
主な用途
ATSAM3S4AA-MUR の用途: 6 件s: Industrial Sensing and Control Nodes, Battery-Powered Portable Instruments, USB-Connected Devices, Image-Sensor Front Ends, Consumer Appliance Control, Metering and Data Loggers.
Industrial Sensing and Control Nodes
The ATSAM3S4AA-MUR fits industrial sensing and control nodes because its 64 MHz Cortex-M3 core delivers deterministic interrupt handling via the nested vectored interrupt controller, its 12-bit ADC digitizes analog transducer signals natively, and the 12-channel DMA moves samples to SRAM without CPU load. Operating from 1.62 V to 3.6 V, it accepts 3.3 V industrial rails directly, while the 256 KB flash accommodates protocol stacks and data logging. In a typical node, UART or TWI links to a supervisor and SPI connects external memory; the QFN-48 exposed-pad package provides good thermal and ground performance on standard two-layer control boards.
おすすめ
Battery-Powered Portable Instruments
For battery-powered portable instruments, the ATSAM3S4AA-MUR's 1.62 V to 3.6 V supply range allows direct operation from two alkaline cells or a single lithium cell with a small LDO, and the SAM3S power-management modes (sleep, wait, backup) cut average current in duty-cycled measurements. The 64 MHz Cortex-M3 executes signal-processing bursts quickly and returns to low-power states, and the on-chip 1.8 V LDO (VDDOUT) removes an external core regulator, saving board area. The 256 KB flash supports instrument firmware plus calibration tables, and Tape & Reel packing suits volume production of handheld meters, dataloggers, and portable medical accessories.
おすすめ
USB-Connected Devices
The ATSAM3S4AA-MUR suits USB-connected devices because the SAM3S A-variant integrates a USB 2.0 full-speed device peripheral, enabling direct attachment to hosts for data upload, configuration, or firmware updates. The 64 MHz Cortex-M3 sustains USB throughput alongside application code, and the 256 KB flash holds both the application and bootloader. DMA channels service the USB endpoint FIFOs, minimizing CPU overhead and jitter. Typical products include USB dongles, programming adapters, and instrument front panels powered entirely from the 5 V VBUS rail through an on-board 3.3 V regulator within the MCU's 1.62 V to 3.6 V input window.
おすすめ
Image-Sensor Front Ends
The ATSAM3S4AA-MUR is explicitly suited to image-sensor front ends: per Microchip, the parallel data capture mode on the PIOs collects data from external devices not compliant with standard memory read protocols, such as low-cost image sensors, while DMA transfers the data to memory and offloads the CPU. This eliminates glue logic or an external FIFO for simple CMOS sensors. The 12-channel DMA sustains streaming into the on-chip SRAM at sensor line rates, and the 64 MHz core performs framing, downsampling, or barcode decoding. The 48-QFN footprint keeps camera-module host boards compact for access-control and IoT vision products.
おすすめ
Consumer Appliance Control
In consumer appliance control, the ATSAM3S4AA-MUR provides a balanced mix of processing power, memory, and peripherals at a medium-range price point described by Microchip as the 'best ratio in terms of reduced power consumption, processing power and peripheral set'. The 256 KB flash stores UI code, recipes, or motor-control parameters; the 12-bit ADC reads temperature sensors and user potentiometers; TWI drives touch controllers and OLED displays; and timers generate PWM for heaters, fans, or motors. Industrial-temperature green QFN packaging and Tape & Reel supply support high-volume automated assembly lines for white goods and small appliances.
おすすめ
Metering and Data Loggers
For energy and utility metering, the ATSAM3S4AA-MUR combines the 12-bit ADC for analog measurement channels, ample 256 KB flash for history logging and EEPROM emulation in flash, and the Cortex-M3 core for tariff computation and communication protocols over UART or TWI. Wide 1.62 V to 3.6 V operation tolerates battery sag in battery-powered meter variants, while DMA-driven acquisition keeps sampling consistent under communication load. The 48-QFN (7x7 mm) exposed-pad package dissipates heat efficiently in sealed enclosures, and long-term availability of the active SAM3S family supports multi-year metering product lifecycles and service commitments.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: ATSAM3S4AA-MUR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | ATSAM3S4BA-MU | ATSAM3S2AA-MU | ATSAM3N4AA-MU | ATSAM3S2BA-MU |
|---|---|---|---|---|---|
| Package | 48-QFN (7x7 mm) Exposed Pad | 48-QFN (7x7) - same footprint | 48-QFN (7x7) - same footprint | 48-QFN (7x7) - same footprint | 48-QFN (7x7) - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Frequency | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz |
| Flash Memory | 256 KB | 256 KB | 128 KB | 256 KB | 128 KB |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Pin Compatibility | Pin-to-pin compatible with SAM3N4A (per Microchip) | Same SAM3S 48-QFN footprint | Same SAM3S 48-QFN footprint | Officially pin-to-pin compatible with SAM3S4A | Same SAM3S 48-QFN footprint |
| Packaging | Tape & Reel (MUR) | Tray (MU suffix) | Tray (MU suffix) | Tray (MU suffix) | Tray (MU suffix) |
主な差別化要因
- Double the flash of the cost-down variant （vs ATSAM3S2AA-MU)
- PIO parallel data capture mode （vs ATSAM3N4AA-MU)
- Tape & Reel supply for automated assembly （vs ATSAM3S4AA-MU)
- Honest trade-off: peripheral-mux risk on B-variant （vs ATSAM3S4BA-MU)
設計ノート
The SAM3S4A integrates an on-chip 1.8 V LDO: connect the 1.62 V-3.6 V system rail to VDDIN and decouple VDDOUT with the capacitor values specified in the manufacturer datasheet. Do not drive VDDOUT from an external regulator, as the core supply is generated internally. Ensure the input rail stays within 1.62 V to 3.6 V under all battery and load conditions; brownouts below this window can corrupt flash writes during logging operations. Estimated: budget the LDO's dropout headroom when using low-cell-count supplies.
The 48-QFN (7x7 mm) exposed pad must be soldered to a grounded thermal landing on the PCB. Define a via array under the pad (e.g., 3x3 pattern of ~0.3 mm vias) tied to the ground plane to improve grounding and heat dissipation - this is standard practice for QFN exposed-pad assemblies and supports ADC accuracy by providing a low-impedance ground reference. Place 0.1 uF decoupling capacitors within 2 mm of each VDDIO pin and at VDDIN per the datasheet layout guidelines.
Confirm the exact peripheral set and pin multiplexing before switching within the family: SAM3S4A, SAM3S4B, SAM3S2A, and SAM3N4A share the 48-QFN footprint but differ in flash size and peripheral muxing (for example, parallel capture mode availability). Verify the 32 kHz crystal load capacitors against the XIN32/XOUT32 specification for RTC accuracy, and confirm MUR (Tape & Reel) versus MU (tray) ordering codes to match your assembly process.
コンプライアンス情報
Mouser lists the part as 'QFN GREEN IND TEMP MRL', indicating Microchip's green/RoHS-compliant industrial-temperature package. REACH, halogen-free, and conflict-minerals certificates not present in provided data - request Microchip environmental documentation for formal confirmation.