BCM53282MKPBG - 8FE + 2GE Ethernet Controller | Broadcom
部品番号: BCM53282MKPBG ✓ 生産中BCM53282MKPBG 概要
An Ethernet controller is an interface integrated circuit that connects a host or switching system to physical Ethernet networks. It belongs to the interface IC hierarchy, alongside Ethernet PHYs, network controllers, and communication semiconductors. Physical-layer transceivers handle cable signaling, while controller functions organize port activity and expose data through standardized digital interfaces such as GMII, RGMII, MII, and RvMII.
The eight-FE configuration supports copper Fast Ethernet ports, while the two-GE configuration adds two Gigabit Ethernet channels. GMII and RGMII provide parallel or reduced-width digital connections to a MAC or switch fabric, while MII and RvMII address designs using legacy or reduced MII-style interfaces. This interface mix supports consolidated network-port designs without requiring eight separate PHY packages.
The Broadcom BCM53282 combines heterogeneous port rates in one controller and is identified as a RoHS3-compliant interface IC. Its 400-pin BGA package supports dense multilayer PCB layouts, but it also demands careful escape-routing, layer-transition, and via-pattern planning. Differential Ethernet pairs require uninterrupted routing between the PHY and the external magnetics or network connector.
Typical uses include industrial Ethernet gateways, multi-port network appliances, embedded switching platforms, communications equipment, and industrial control systems with mixed Fast Ethernet and Gigabit Ethernet connectivity. The MII/RvMII interface is particularly relevant to legacy network architectures, while GMII/RGMII supports higher-throughput digital connections to a host processor or switching fabric.
Designers should assign every power, ground, clock, reset, management, and serial interface signal from the manufacturer pin-description table before layout. Differential pairs should remain length-balanced and reference a continuous ground plane, while BGA escape routing should be planned before the first PCB revision. Confirm thermal performance, interface voltage levels, and external transceiver requirements against the manufacturer datasheet.
This product page consolidates the confirmed port configuration, supported interface types, package information, sourcing details, and engineering guidance into one design-oriented reference. It also distinguishes confirmed drop-in substitutions from parts that merely perform a similar Ethernet function and therefore require PCB or firmware validation.
ドロップイン代替品: BCM53282MKPBG — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
この製品に利用可能なドロップイン代替品はありません。
代替品をリクエストBCM53282MKPBG 最大定格＆電気的特性
| Device Type | Ethernet interface controller |
| Fast Ethernet PHY Count | 8 FE PHYs |
| Gigabit Ethernet PHY Count | 2 GE PHYs |
| Fast Ethernet Data Rate | 10/100 Mbit/s |
| Gigabit Ethernet Data Rate | 10/100/1000 Mbit/s |
| GMII Interface | Supported |
| RGMII Interface | Supported |
| MII Interface | Supported |
| RvMII Interface | Supported |
| Integrated PHY Type | 10/100BASE-T and 10/100/1000BASE-T |
| パッケージ | 400-pin BGA |
| 実装タイプ | Surface mount |
| RoHS ステータス | RoHS3 compliant |
| Lead-Free Status | Lead-free |
BCM53282MKPBG 400-pin bga ピン配置ガイド
BCM53282MKPBG (400-pin bga パッケージ) のピン配置。 このアナログコンポーネントは、入力、出力、および電源ピンを備えています。オフセットナル、補償、イネーブルピンの設定については、メーカーのデータシートを参照してください。信号調整やアンプ回路に最適です。
詳細なピン配置データはありません: BCM53282MKPBG.
詳細は データシート をご参照ください。
主な用途
BCM53282MKPBG の用途: 6 件s: Industrial Ethernet Gateway, Multi-Port Network Appliance, Embedded Switching Platform, Communications Control Equipment, Industrial Control Cabinet, Legacy Network Equipment Upgrade.
Industrial Ethernet Gateway
The BCM53282MKPBG fits an industrial gateway that must combine legacy 10/100M equipment connections with two higher-speed Gigabit Ethernet uplinks. Its eight FE PHYs and two GE PHYs consolidate ten copper channels in one 400-pin BGA controller while GMII, RGMII, MII, and RvMII provide several host-interface options. This helps equipment with mixed legacy and modern endpoints share a common network subsystem. The engineering tradeoff is PCB complexity: the layout must support dense BGA escape routing, external magnetics, balanced copper pairs, and separate clock and power domains without introducing excessive loss between PHY circuitry and connectors.
おすすめ
Multi-Port Network Appliance
The BCM53282MKPBG is appropriate for network appliances that need a high port count without using ten separate Ethernet PHY packages. Eight 10/100M channels can serve management, service, or legacy endpoints, while the two 10/100/1000M channels can support data-plane or uplink traffic. Integrating the PHYs also creates a clear migration path for boards whose external interface logic uses GMII, RGMII, MII, or RvMII. Board planning must reserve balanced differential pairs for all ten copper channels, suitable magnetics footprints, robust return paths, and controlled BGA escapes. Firmware and network architecture must also accommodate the device’s port-management and initialization behavior.
おすすめ
Embedded Switching Platform
The BCM53282MKPBG can support an embedded switching platform with eight Fast Ethernet access ports and two Gigabit Ethernet ports at the edge. The Fast Ethernet ports provide economical copper connectivity for endpoint equipment, while the Gigabit Ethernet channels accommodate higher-throughput trunk or uplink connections. RGMII or GMII can suit a switch fabric requiring wider parallel data paths, whereas MII and RvMII can connect simpler control logic or established host interfaces. A successful implementation depends on matching the selected MAC or fabric timing, clocking, and data-valid expectations to the device’s electrical and initialization requirements. The 400-pin package also requires a multilayer PCB with careful power, ground, and differential-pair planning.
おすすめ
Communications Control Equipment
The BCM53282MKPBG fits communications equipment that must connect several slow-speed service ports to faster backbone or aggregation links. Eight Fast Ethernet PHYs can accommodate supervisory, voice, maintenance, and legacy data interfaces, while two Gigabit Ethernet PHYs can support higher-rate uplinks. Supporting GMII, RGMII, MII, and RvMII gives the equipment designer flexibility when connecting the controller to an existing MAC, FPGA-based network engine, or embedded processor. Integration reduces component count, but it does not remove the need for disciplined signal integrity work. Engineer the PCB with short BGA escapes, continuous return planes, controlled impedance, isolated supply domains where required, and a thermal design appropriate for the 400-pin BGA.
おすすめ
Industrial Control Cabinet
The BCM53282MKPBG is suitable for industrial control cabinets where controllers, sensors, service tools, and supervisory systems require numerous copper Ethernet links. Eight 10/100M channels can serve slower field devices and management ports, while the two 10/100/1000M channels can connect to plant-level networks. The combination of MII/RvMII and GMII/RGMII supports different levels of embedded processing architecture, helping legacy control platforms evolve without changing the external copper-port concept. Deployment conditions still require confirmation of temperature range, isolation, EMC behavior, and surge protection from the manufacturer documentation. Layout should separate sensitive Ethernet pairs from noisy power and switching-converter regions while preserving continuous ground references.
おすすめ
Legacy Network Equipment Upgrade
The BCM53282MKPBG can support upgrades of legacy network equipment that retain MII or RvMII connectivity while adding newer copper ports. Existing control logic may communicate through the reduced MII-style interfaces, while GMII or RGMII provides access to faster host paths when the system architecture permits it. This combination allows an equipment designer to consolidate multiple port rates into one controller and reduce the number of discrete Ethernet PHY positions. Compatibility must be assessed at both hardware and firmware levels, including initialization timing, interface configuration, interrupt behavior, and management software. The dense 400-pin BGA should be introduced only when the PCB stack-up, escape routing, and assembly process can support its fanout and thermal requirements.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: BCM53282MKPBG — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 |
|---|---|
| Brand | Broadcom |
| Package | 400-pin BGA |
| Fast Ethernet PHY Count | 8 FE PHYs |
| Gigabit Ethernet PHY Count | 2 GE PHYs |
| Fast Ethernet Data Rate | 10/100 Mbit/s |
| Gigabit Ethernet Data Rate | 10/100/1000 Mbit/s |
| GMII Interface | Supported |
| RGMII Interface | Supported |
| MII Interface | Supported |
| RvMII Interface | Supported |
| RoHS Status | RoHS3 compliant |
主な差別化要因
- Ten integrated copper Ethernet channels in one controller （vs Discrete multi-PHY implementation)
- Supports both modern and legacy host-interface families （vs GMII/RGMII-only interface design)
- Mixed-rate port integration （vs Uniform-rate PHY controller)
設計ノート
Plan the 400-pin BGA escape routing before component placement is finalized. Assign power and ground balls early in the stack-up, route high-speed interfaces through adjacent signal layers, and use short, regularly spaced escape vias. The Ethernet differential pairs should approach their associated PHY channels through a controlled impedance structure and maintain a continuous ground reference. Do not route sensitive signals across split planes or beneath the BGA area without confirming return-path continuity.
Use the manufacturer pin-description and layout guidance to associate every external magnetic or connector-side Ethernet pair with its corresponding PHY channel. Keep each copper channel’s transmit and receive routing geometry consistent, preserve pair symmetry, and minimize stubs. Maintain suitable clearance from clocks, switching-regulator nodes, and high-current power paths. External magnetics must also follow the manufacturer's placement and grounding recommendations because their geometry directly affects cable-side signal integrity.
Do not treat a controller with eight FE and two GE channels as a universal pin-compatible substitute for another Ethernet IC. A replacement must match the 400-ball footprint, power architecture, clocking, reset requirements, management interface, PHY characteristics, and host-interface behavior. Similar GMII or RGMII support is insufficient for drop-in approval. Verify startup sequencing, configuration method, and register compatibility before substituting a part into an existing board.
Evaluate junction temperature from the actual supply voltage, total port activity, and board thermal resistance rather than assuming the large BGA is automatically cool. Place the device near effective copper areas and follow the manufacturer’s exposed-pad, via-array, and layer-stack guidance. Where copper area is constrained by BGA escape routing, improve spreading through the via fence and multilayer construction, then validate the assembled design under sustained traffic in the highest expected ambient temperature.
コンプライアンス情報
The Broadcom listing identifies BCM53282MKPBG as RoHS3 compliant and lead-free. No separate REACH, halogen-free, conflict-minerals, or automotive-qualification statement is confirmed.
