BCM8157AIFBG - 11.352 Gbps SFI-4.1 Transceiver | Broadcom
部品番号: BCM8157AIFBG ✓ 生産中BCM8157AIFBG 概要
An Ethernet transceiver is an interface IC that converts parallel or high-speed serial data into a transmission-standard electrical signal and converts received signals back into data suitable for a digital controller. The BCM8157AIFBG belongs to the SFI-4.1 transceiver segment of Ethernet interface semiconductors, connecting 10G XFI processing logic with SFI-4.1-compatible equipment or modules.
Key characteristics include an 11.352 Gbps data rate, a single-driver and single-receiver configuration, a 1 V supply requirement, and support for the IEEE 802.3 Ethernet protocol family. Its low-power multirate design is intended to balance throughput with energy efficiency in communication equipment where parallel high-speed interfaces consume substantial board area and power.
The device separates the XFI and SFI-4.1 sides of the interface, allowing one side to connect to a 10G Ethernet controller or switching silicon while the other connects to SFI-4.1 equipment. The 1 V operating supply supports integration into modern high-speed line cards, where careful separation of power, high-speed differential routing, and return paths is essential for reliable signal integrity.
Typical uses include 10G Ethernet switches, network interface cards, routers, optical transport modules, server fabric equipment, and test systems. The 11.352 Gbps maximum rate covers the stated operating class and leaves design margin for the associated transmitter and receiver channels, although system-level BER, jitter, reach, and channel-loss requirements must be validated in the finished design.
During PCB layout, place decoupling close to the supply pins and treat the XFI and SFI-4.1 differential pairs as controlled-impedance, continuously referenced nets. Avoid adding test pads or routing discontinuities unless their loading has been evaluated. Follow the Broadcom datasheet for decoupling values, clock requirements, signal amplitudes, layout geometry, and thermal constraints.
This page combines the device identity, interface parameters, application guidance, sourcing workflow, and engineering-focused design notes in one concise reference. It also distinguishes verified interface attributes from package details that require direct confirmation before PCB release, helping engineers evaluate the BCM8157AIFBG early in an Ethernet-interface design cycle.
ドロップイン代替品: BCM8157AIFBG — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
この製品に利用可能なドロップイン代替品はありません。
代替品をリクエストBCM8157AIFBG 最大定格＆電気的特性
| Device Type | Multirate low-power 10G XFI to SFI-4.1 transceiver |
| Maximum Data Rate | 11.352 Gbps |
| 電源電圧 | 1 V |
| Protocol | IEEE 802.3 |
| Number of Drivers | 1 |
| Number of Receivers | 1 |
| Input Interface | 10G XFI |
| Output Interface | SFI-4.1 |
| 実装タイプ | Tray |
| Standard Package Quantity | 833 units |
| Moisture Sensitivity Level | MSL 1 |
| Export Control Classification Number | 5A991B1 |
| カテゴリ | Interface IC - transceiver |
BCM8157AIFBG 833 units ピン配置ガイド
BCM8157AIFBG (833 units パッケージ) のピン配置。 このアナログコンポーネントは、入力、出力、および電源ピンを備えています。オフセットナル、補償、イネーブルピンの設定については、メーカーのデータシートを参照してください。信号調整やアンプ回路に最適です。
詳細なピン配置データはありません: BCM8157AIFBG.
詳細は データシート をご参照ください。
主な用途
BCM8157AIFBG の用途: 6 件s: 10G Ethernet Switch Line Cards, Network Interface Cards, Optical Transport Modules, Routers and Network Processing Systems, High-Speed Communication Test Equipment, Server and Data-Center Fabric Equipment.
10G Ethernet Switch Line Cards
The BCM8157AIFBG fits line cards where a switching ASIC uses a 10G XFI interface but the board must terminate that traffic through an SFI-4.1 link. Its stated 11.352 Gbps maximum rate and single transmitter and receiver support the high-speed bridge without introducing a low-power parallel-to-serial transceiver in the signal path. The 1 V operating supply fits high-speed equipment built around closely regulated core rails. Layout should preserve controlled-impedance XFI and SFI-4.1 routes, provide continuous reference planes, and keep power and clock routing separated from sensitive differential pairs.
おすすめ
Network Interface Cards
The BCM8157AIFBG is appropriate for a 10G network interface card that separates a controller-side XFI connection from an SFI-4.1-facing port or internal channel. The 11.352 Gbps data-rate class supports the stated 10G interface role, while the single-driver, single-receiver arrangement keeps the device focused on one high-speed transmit and receive path. System designers must still validate channel loss, insertion loss, jitter, BER, reference-clock quality, and module interoperability. Short, symmetrical routing and carefully placed return-path vias help preserve signal integrity at this data rate.
おすすめ
Optical Transport Modules
The BCM8157AIFBG can support optical-module and transport-equipment designs that require conversion between a 10G XFI host interface and an SFI-4.1-side connection. Its low-power multirate architecture is suitable for compact communication equipment where board area and energy use matter. In a module implementation, the transceiver's channels must be integrated with appropriate optical signaling circuitry and a compliant host interface. High-speed differential routing should use the manufacturer's geometry and via guidance, while bypassing and decoupling arrangements should be placed without introducing discontinuities in the signal path.
おすすめ
Routers and Network Processing Systems
The BCM8157AIFBG is suitable for router and network-processing systems that use a 10G Ethernet controller on the XFI side and require SFI-4.1 connectivity elsewhere on the board. The 1 V supply and 11.352 Gbps maximum data-rate statement align with the power-density and throughput demands of modern line cards. Designers should account for the complete BER budget across controller, transceiver, connectors or modules, and any intervening channel. They should also verify clock-jitter tolerance, lane equalization requirements, and the Broadcom startup sequence before committing the system architecture.
おすすめ
High-Speed Communication Test Equipment
The BCM8157AIFBG can be used in test equipment that exercises or bridges XFI and SFI-4.1 links at multirate Ethernet speeds. Its stated maximum rate of 11.352 Gbps and single transmit and receive channels provide a defined high-speed endpoint for instrumentation. The design must include stable reference-clock distribution, calibrated measurement paths, and controllable channel loss if BER or signal-integrity behavior is being evaluated. Keep test pads and switches away from the critical pairs unless their parasitics have been included in channel simulations and impedance calculations.
おすすめ
Server and Data-Center Fabric Equipment
The BCM8157AIFBG can serve in server fabric and data-center interface boards that need a 10G XFI-to-SFI-4.1 signal path. The 11.352 Gbps maximum data rate, 1 V supply, and one driver and one receiver suit a focused high-speed link rather than a broad multiport PHY. The implementation should account for server-grade power integrity, thermal conditions, EMI containment, and long enclosure or backplane channels. Use short reference planes, maintain differential-pair symmetry, and qualify all interconnect choices against the Broadcom channel and BER requirements before production.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: BCM8157AIFBG — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 |
|---|---|
| Brand | Broadcom |
| Maximum Data Rate | 11.352 Gbps |
| Supply Voltage | 1 V |
| Input Interface | 10G XFI |
| Output Interface | SFI-4.1 |
| Number of Drivers | 1 |
| Number of Receivers | 1 |
| Protocol | IEEE 802.3 |
| Packaging | Tray, 833 units |
| Moisture Sensitivity Level | MSL 1 |
| Export Control Classification Number | 5A991B1 |
主な差別化要因
- Purpose-built XFI-to-SFI-4.1 interface conversion （vs Generic 10G Ethernet transceiver)
- Single-channel high-speed transmit and receive arrangement （vs Multi-channel transceiver)
- Low core operating supply （vs Higher-voltage multi-interface transceiver)
設計ノート
Treat the XFI and SFI-4.1 nets as independent high-speed differential channels. Maintain the geometry, spacing, impedance, and reference-plane continuity specified by Broadcom, and use matched via structures when transitioning between PCB layers. Avoid test pads, stubs, and abrupt width changes on the critical pairs unless their loading is included in channel simulation. Confirm receiver and transmitter amplitude, timing, jitter, and BER requirements in the assembled design.
Place the required bypass capacitors close to the device's power and ground pins, with the shortest possible connection to the relevant planes. Follow the Broadcom datasheet for the exact capacitor values and whether additional filtering or sequencing is required. Keep switching regulators, inductors, and high-current return paths away from the XFI and SFI-4.1 pairs, and provide a quiet ground reference beneath the high-speed channels.
Estimate dissipated power with the actual input voltage, total current, and ambient conditions for the finished board. Compare that estimate with the package and board-level thermal limits in the manufacturer datasheet before selecting copper area or cooling. Place the device where airflow is available when practical, and verify that adjacent converters and optical-module circuitry do not create a localized thermal hotspot.
Do not substitute a generic 10G transceiver based only on data rate. XFI and SFI-4.1 devices can differ in pin assignment, reference-clock architecture, termination, lane width, protocol support, and electrical limits. Check every pin and power rail against the Broadcom datasheet, then validate startup sequencing and link training with the intended controller and module. A PCB change is required unless both the footprint and functional behavior are confirmed identical.
コンプライアンス情報
The product listings identify the export control classification as 5A991B1 and the moisture sensitivity level as MSL 1. No explicit RoHS, REACH, lead-free, halogen-free, conflict-minerals, or automotive qualification statement was identified.
