BCM8725AIFBG Dual-Channel 10GbE SerDes | Broadcom
部品番号: BCM8725AIFBG ✓ 生産中BCM8725AIFBG 概要
A 10GbE SerDes is a high-speed physical-layer interface that enables copper or optical networking equipment to move 10-gigabit Ethernet data between line cards, processors, switches, and optical modules. The term SerDes combines serializer and deserializer functions. In this role, the BCM8725AIFBG provides dual-channel signal conditioning for 10-gigabit links, supporting modern data-center and enterprise networks where bandwidth density, link reach, and interoperability are critical.
The principal documented features are dual-channel operation, 10-gigabit serial Ethernet data support, and conversion between XAUI and XFI LANPHY interface formats. XAUI provides a parallel wide-bus architecture commonly used within networking equipment, while XFI is a serial interface commonly associated with optical-module and line-card connectivity. Using a dedicated SerDes device lets a system separate high-speed physical signaling from the switching or packet-processing fabric.
This device is intended for applications where two 10GbE channels are useful, such as dual-port line cards, aggregation platforms, server network interfaces, and optical backplane systems. Its exact electrical characteristics, supply requirements, lane rates, register organization, pin assignments, operating-temperature limits, and package dimensions must be confirmed in the manufacturer datasheet before schematic capture or PCB layout.
The primary design consideration is signal integrity. XAUI and XFI interfaces operate at data rates where trace impedance, connector and package parasitics, reference-plane continuity, and loss management can materially affect link performance. Designers should preserve the manufacturer-recommended topology and provide appropriate power and thermal delivery across the BGA package. Decoupling, ground-plane continuity, and high-speed routing deserve priority over cosmetic placement optimization.
This page consolidates the identifiable device function, interface purpose, sourcing information, and engineering design considerations for BCM8725AIFBG. It distinguishes confirmed product attributes from parameters that require direct review of the manufacturer datasheet, helping engineers plan evaluation without assuming unverified electrical or package details.
ドロップイン代替品: BCM8725AIFBG — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
この製品に利用可能なドロップイン代替品はありません。
代替品をリクエストBCM8725AIFBG 最大定格＆電気的特性
| Product Type | Dual-channel serial 10-gigabit Ethernet interface IC |
| データレート | 10 Gb/s per channel |
| Channel Count | 2 channels |
| Input Interface | XAUI |
| Output Interface | XFI LANPHY |
| Supported Networking Function | 10GbE and 10GFC |
| Device Family | BCM8725 |
| Manufacturer | Broadcom |
| Package Type | BGA package |
BCM8725AIFBG bga package ピン配置ガイド
BCM8725AIFBG (bga package パッケージ) のピン配置。 このアナログコンポーネントは、入力、出力、および電源ピンを備えています。オフセットナル、補償、イネーブルピンの設定については、メーカーのデータシートを参照してください。信号調整やアンプ回路に最適です。
詳細なピン配置データはありません: BCM8725AIFBG.
詳細は データシート をご参照ください。
主な用途
BCM8725AIFBG の用途: 6 件s: 10GbE Data-Center Line Card, Server Network Interface, Dual-Port Ethernet Aggregation, Optical Backplane Connectivity, 10GFC Storage Interface, Enterprise Network Appliance.
10GbE Data-Center Line Card
The BCM8725AIFBG fits a dual-channel 10GbE line-card design where a wide XAUI-side connection must interface with serial XFI LANPHY-side connectivity. Its two 10-gigabit channels can support two physical links in a compact networking platform, helping partition external traffic from the packet-processing fabric. The implementation must follow the manufacturer reference layout, preserve controlled-impedance routing, and provide continuous power and ground planes. Exact lane timing, clock requirements, and exposed-land details should be confirmed in the Broadcom datasheet before PCB release.
おすすめ
Server Network Interface
A server-facing network interface can use the BCM8725AIFBG when the board architecture requires dual 10GbE serial channels and a transition between XAUI and XFI LANPHY. This arrangement is useful where internal logic communicates through XAUI while an external line-card or optical-facing path uses XFI. Because the interface operates at 10 Gb/s, keep loss and discontinuities under control, use matched reference planes, and avoid unnecessary layer changes. Verify connector, clock, and lane mapping against the manufacturer design guidance.
おすすめ
Dual-Port Ethernet Aggregation
The dual-channel architecture of the BCM8725AIFBG is appropriate for aggregation equipment that needs two 10GbE physical connections. The XAUI interface can link toward packet-processing hardware, while XFI LANPHY supports compatible serial line-card or optical connectivity. This separation can improve board organization and shorten internal wide-bus routing while preserving 10GbE line rates. Design validation should include channel-by-channel timing, power sequencing, return-loss analysis, and thermal review of the BGA lands under sustained traffic.
おすすめ
Optical Backplane Connectivity
BCM8725AIFBG can support optical-backplane architectures in which XFI LANPHY provides a serial path toward compatible optical modules or other 10GbE physical-layer devices. Its dual channels allow a board to establish two high-speed paths while keeping the wider XAUI connection on the internal side of the design. The critical implementation concern is signal integrity: maintain impedance continuity, minimize high-speed stubs and vias, and coordinate connector and module loss with the SerDes budget. Confirm electrical compatibility with the selected optical module before layout approval.
おすすめ
10GFC Storage Interface
The BCM8725AIFBG is identified for 10GFC as well as 10GbE applications, making it relevant to storage and data-movement equipment operating at 10 gigabits per second. The dual-channel arrangement can serve dual links or provide path options in a scalable storage platform, while the XAUI-to-XFI conversion separates the internal fabric from external physical connectivity. Engineers should validate the selected XFI PHY implementation, clocking topology, cable or module reach, and protocol configuration before integrating the device into a storage controller.
おすすめ
Enterprise Network Appliance
An enterprise firewall, traffic gateway, or monitoring appliance can use the BCM8725AIFBG when it needs two dedicated 10GbE physical interfaces in a compact board area. The XAUI side can connect to a local switching or packet-processing element, while XFI LANPHY faces compatible line-card or optical connectivity. This arrangement supports high-bandwidth networks without allocating multiple external components for basic XAUI-to-XFI conversion. Layout review should emphasize BGA power integrity, high-speed return paths, thermal spreading, and isolation from noisy switching circuitry.
おすすめ
エンジニアリング参考データ: BCM8725AIFBG — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 |
|---|---|
| Brand | Broadcom |
| Package | BGA package |
| Channel Count | 2 channels |
| Data Rate | 10 Gb/s per channel |
| Input Interface | XAUI |
| Output Interface | XFI LANPHY |
| Networking Support | 10GbE and 10GFC |
| Device Family | BCM8725 |
主な差別化要因
- Two high-speed Ethernet channels in one interface device （vs Single-channel 10GbE SerDes designs)
- Direct XAUI-to-XFI LANPHY signal-path support （vs Interfaces limited to a parallel-side or serial-side function)
- Support for both Ethernet and fabric networking roles （vs Parts marketed only for 10GbE connectivity)
設計ノート
Route XAUI and XFI LANPHY signals using the manufacturer’s reference topology and impedance rules. Preserve uninterrupted reference planes, minimize layer transitions and stubs, and control via transitions beneath high-speed lanes. Treat connector and package parasitics as part of the channel budget rather than treating the PCB as an ideal connection. Validate lane-by-lane eye, jitter, insertion loss, and return loss with realistic external-device models before production release.
Assign the BCM8725AIFBG supply, clock, control, and high-speed balls only after checking the manufacturer pin-description table and package drawing. Place required bypass components close to the relevant BGA balls and provide low-impedance power and ground planes throughout the package area. Review voltage tolerance, startup behavior, supply sequencing, and the complete BGA power-delivery network; exact capacitor values and rails must come from the datasheet and reference design.
The BGA package requires deliberate heat spreading through its ball pattern and surrounding board copper. Estimate worst-case junction temperature using the actual board construction, ambient environment, airflow, and power dissipation specified for the operating mode. Increase exposed copper, thermal-via density, or board airflow when the calculated temperature margin is inadequate. Do not infer package thermal performance from a distributor listing or from another BCM8725 package variant.
Follow the manufacturer land pattern and reference-layout geometry for BGA pad-to-pad and pad-to-via transitions. Avoid placing test vias or unrelated copper structures in high-speed escape paths, and keep the XAUI and XFI interfaces physically separated from noisy clocks and switching-power paths where practical. Include schematic and layout review for power sequencing, clock-source routing, connector placement, and maintainability of the assembled board.
コンプライアンス情報
No explicit compliance declarations were present in the available product records. Confirm RoHS, REACH, lead-free, halogen-free, conflict-minerals, and automotive qualification status with Broadcom before procurement.
