CMXO3LF-2100C-6BG324I - MachXO3LF 2112 LUT FPGA, 324-CABGA | Lattice
部品番号: CMXO3LF-2100C-6BG324I ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $29.25 | $292.50 |
| 100 | $26 | $2,600.00 |
| 500 | $23.5 | $11,750.00 |
| 1,000 | $21.4 | $21,400.00 |
CMXO3LF-2100C-6BG324I 概要
A Field Programmable Gate Array (FPGA) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable routing, and I/O cells, all of which can be re-programmed in-circuit to implement arbitrary digital logic. FPGAs occupy the middle ground between fixed-function ASICs (high NRE, low unit cost) and microcontrollers (limited parallelism, deterministic firmware). Within the broader taxonomy, the CMXO3LF belongs to the MachXO3LF sub-family: FPGAs optimized for bridging, control logic, and instant-on tasks rather than high-throughput DSP or AI workloads.
Key features of the CMXO3LF-2100C include 2112 LUTs (4-input), 75,776 bits of distributed/embedded block RAM, 279 user I/O across multiple banks, embedded block RAM with FIFO support, and on-chip Flash for instant-on configuration. The -6 speed grade and industrial temperature range (TJ -40C to +100C) make it suitable for harsh-environment designs. The 324-CABGA package supports high pin-count designs requiring wide parallel interfaces.
Technically, the MachXO3LF architecture combines LUT-based logic fabric with hardened I/O buffers supporting LVCMOS, LVTTL, SSTL, and other signaling standards. On-chip Flash eliminates the need for external boot memory, enabling sub-20 ms configuration times. The 324-CABGA package provides controlled impedance and robust mechanical reliability for industrial PCB assemblies.
Typical applications include industrial control and factory automation, bridging between legacy and modern bus protocols (I2C, SPI, UART to parallel), motor control glue logic, LED display controllers, sensor aggregation hubs, and IoT edge nodes. The combination of high I/O count and instant-on makes it ideal for systems that must wake up and respond quickly without external boot devices.
When designing with this device, verify that the chosen I/O bank voltages match your downstream peripherals and confirm the JTAG programming chain if in-system reprogramming is required. The 324-CABGA package demands careful PCB layout: controlled-impedance traces, sufficient via-in-pad design rules, and a robust ground plane are essential for signal integrity.
This page consolidates distributor pricing, drop-in same-package alternatives, and practical design notes that go beyond the manufacturer datasheet to help engineers select, source, and integrate the CMXO3LF-2100C-6BG324I efficiently.
ドロップイン代替品: CMXO3LF-2100C-6BG324I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
LCMXO3LF-2100C-5BG324I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
LCMXO3LF-2100C-6BG324I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
LCMXO3LF-2100C-6BG324C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
CMXO3LF-2100C-6BG324I 最大定格＆電気的特性
| Series | MachXO3LF |
| Family | MachXO3LF Field Programmable Gate Array (FPGA) |
| Logic Cells / LUTs | 2112 LUTs (4-input) |
| Total RAM Bits | 75,776 bits |
| Number of User I/O | 279 |
| 電源電圧 | 2.375 V to 3.465 V (2.5V/3.3V nominal) |
| Speed Grade | -6 (industrial) |
| 動作温度 | -40C to +100C (TJ) |
| 実装タイプ | Surface Mount |
| パッケージ / ケース | 324-LFBGA (CABGA-324) |
| Supplier Device Package | 324-CABGA |
| Configuration Memory | On-chip Flash (instant-on) |
| RoHS ステータス | Compliant |
CMXO3LF-2100C-6BG324I 324-cabga ピン配置ガイド
CMXO3LF-2100C-6BG324I (324-cabga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: CMXO3LF-2100C-6BG324I.
詳細は データシート をご参照ください。
主な用途
CMXO3LF-2100C-6BG324I の用途: 6 件s: Industrial Control and Factory Automation, Protocol Bridging and Interface Translation, LED Display and Backlight Controllers, Motor Control Glue Logic, Sensor Aggregation Hubs, IoT Edge Nodes and Smart Devices.
Industrial Control and Factory Automation
The CMXO3LF-2100C-6BG324I is well-suited for industrial control and factory automation systems where deterministic glue logic and high I/O count are required. With 2112 LUTs and 279 user I/O in a 324-CABGA package, the device can aggregate sensor inputs, drive multiple actuator outputs, and bridge between legacy fieldbus protocols (RS-485, RS-232) and modern Ethernet-based control networks. The industrial temperature rating (-40C to +100C) and on-chip Flash instant-on make it robust against factory floor temperature swings and power-cycle events. Compared to microcontrollers, the FPGA fabric executes parallel logic deterministically without RTOS overhead. Companion components include Lattice MachXO3LF base boards, RS-485 transceivers such as MAX3485, and Lattice Diamond design tools.
おすすめ
Protocol Bridging and Interface Translation
Protocol bridging between I2C, SPI, UART, and parallel buses is a core use case for the CMXO3LF-2100C-6BG324I. The 2112 LUTs and 279 I/O allow simultaneous management of multiple serial streams with custom framing, while the multiple I/O banks support mixed-voltage peripherals (1.8V, 2.5V, 3.3V) without external level shifters. The on-chip Flash instant-on feature allows the bridge to be active within 20 ms of power-up, critical for systems that must respond to bus traffic immediately after reset. Companion ICs include I2C/SPI EEPROMs, UART transceivers like MAX3232, and bus isolators such as ADuM141E.
おすすめ
LED Display and Backlight Controllers
LED display controllers benefit from the CMXO3LF-2100C-6BG324I's 279 I/O count, which can drive hundreds of LED channels in parallel without external MUX expansion. The -6 industrial speed grade delivers sufficient logic throughput for PWM generation at refresh rates above 1 kHz, eliminating visible flicker in video-rate displays. On-chip Flash instant-on ensures the display reaches full brightness within 20 ms of power-up, important for signage and automotive dashboard applications. Companion drivers include LED driver ICs such as TLC5940, TLC5941, or constant-current sink arrays. The BGA-324 footprint also supports high-density PCB layouts for slim display modules.
おすすめ
Motor Control Glue Logic
In motor control systems, the CMXO3LF-2100C-6BG324I serves as glue logic between microcontroller command paths and power-stage gate drivers. The 2112 LUTs handle encoder feedback decoding (QEP, Hall sensors), PWM conditioning, and fault interlocks with deterministic latency that microcontrollers cannot match. The 279 I/O supports multi-axis control boards with separate enable, fault, and PWM signals per axis. The industrial temperature rating and on-chip Flash make it suitable for harsh automotive under-hood and industrial cabinet environments. Companion parts include gate drivers such as DRV8323RS and isolated SPI bridges like ADuM4151.
おすすめ
Sensor Aggregation Hubs
Sensor aggregation hubs consolidate multiple I2C/SPI sensor inputs into a single high-speed upstream interface (typically SPI or parallel). The CMXO3LF-2100C-6BG324I's 279 I/O and multi-bank support allows simultaneous interfacing with diverse sensors at different voltages. The 75,776 bits of block RAM enables time-stamping and short-term buffering for sensor fusion preprocessing before forwarding data to a host processor. Companion ICs include multi-axis IMUs like LSM6DSO, environmental sensors such as BME280, and high-speed ADCs like ADS1118. Industrial temperature range supports outdoor and automotive sensor pod deployments.
おすすめ
IoT Edge Nodes and Smart Devices
IoT edge nodes benefit from the CMXO3LF-2100C-6BG324I's instant-on Flash configuration (sub-20 ms wake-up) and 2112 LUTs of deterministic logic for protocol preprocessing before wireless transmission. The device can pre-format sensor data, manage low-power wireless radio states, and handle local decision logic, offloading tasks from a main MCU. The industrial temperature range supports outdoor smart-city and industrial IoT deployments. Companion parts include sub-GHz transceivers such as CC1310F128RHBR, low-power MCUs like ATSAMR21G18A-MUT, and step-down regulators such as TPS62840. The 324-CABGA supports dense edge-node PCB layouts.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: CMXO3LF-2100C-6BG324I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | LCMXO3LF-2100C-5BG324I | LCMXO3LF-2100C-6BG324I | LCMXO3LF-2100C-6BG324C |
|---|---|---|---|---|
| Package | 324-LFBGA (CABGA-324) | 324-LFBGA (CABGA-324) - same | 324-LFBGA (CABGA-324) - same | 324-LFBGA (CABGA-324) - same |
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Logic Cells / LUTs | 2112 LUTs | 2112 LUTs | 2112 LUTs | 2112 LUTs |
| Total RAM Bits | 75,776 bits | 75,776 bits | 75,776 bits | 75,776 bits |
| User I/O Count | 279 | 279 | 279 | 279 |
| Speed Grade | -6 | -5 | -6 | -6 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Supply Voltage | 2.375 V to 3.465 V | 2.375 V to 3.465 V | 2.375 V to 3.465 V | 2.375 V to 3.465 V |
| Configuration Memory | On-chip Flash (instant-on) | On-chip Flash (instant-on) | On-chip Flash (instant-on) | On-chip Flash (instant-on) |
| Qty-1 Unit Price (USD) | 32.50 | 31.80 | 32.50 | 30.20 |
主な差別化要因
- On-chip Flash instant-on (sub-20 ms configuration) （vs SRAM-based FPGAs requiring external boot memory)
- 279 user I/O in 324-CABGA package （vs Smaller MachXO3LF variants (e.g. 256-BGA packages))
- Industrial -40C to +100C temperature grade （vs Commercial temperature -6 grade variants (0C to +85C))
設計ノート
The 324-CABGA package (0.8 mm pitch typical) requires via-in-pad PCB technology with filled and plated-over vias to prevent solder joint voiding. Design a continuous ground plane beneath the device and route high-speed signals on inner layers with controlled impedance (50 ohm single-ended, 90 ohm differential). Maintain 4-layer minimum stackup with dedicated power and ground planes. Thermal vias under the central die paddle are recommended for high-utilization designs exceeding 70% LUT occupancy.
Decouple each VCCIO bank with 0.1 uF and 10 uF ceramic capacitors placed within 5 mm of the package pins. Add a bulk 47 uF to 100 uF tantalum or polymer capacitor on the main VCC rail. The MachXO3LF core voltage requires a dedicated LDO; do not share core and I/O supply regulators as switching noise can couple into PLL-sensitive analog circuits. Power sequencing per the Lattice datasheet must be observed to prevent latch-up.
Do not exceed the maximum I/O bank voltage of 3.465 V - mixing 1.8 V peripherals on a 3.3 V-configured bank will damage the I/O cells. The JTAG pins (TDI, TDO, TMS, TCK) must be pulled to known states during power-up per the Lattice MachXO3LF datasheet; floating JTAG pins can cause configuration failures. Avoid using NC pins as signal routing channels - they are not bonded internally. Verify all unused I/O are configured as tri-state inputs with weak pull-ups per the Lattice recommendations.
Estimated: at full 2112 LUT utilization with 100 MHz toggle rate, the core power dissipation is approximately 0.5 W to 1.0 W. Combined with I/O switching, total dissipation can reach 1.5 W in worst-case designs. The 324-CABGA junction-to-ambient thermal resistance (theta_JA) is approximately 25 C/W on a 4-layer JEDEC test board, yielding a junction temperature rise of 37C above ambient at 1.5 W. Industrial designs targeting 100C junction must keep ambient below 63C or apply active cooling. Reference Lattice Power Calculator tool for application-specific thermal modeling.
コンプライアンス情報
RoHS and REACH compliant per Lattice product page. Not AEC-Q100 qualified; automotive cabin designs acceptable, but under-hood AEC-Q100 applications require dedicated automotive-grade FPGAs.
