DS3644B+ - DeepCover 1KB Secure Memory with Tamper Hierarchy | Analog Devices
部品番号: DS3644B+ ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $14.85 | $14.85 |
| 10 | $13.62 | $136.20 |
| 100 | $12.05 | $1,205.00 |
| 500 | $10.78 | $5,390.00 |
| 1,000 | $9.65 | $9,650.00 |
DS3644B+ 概要
A DeepCover security manager is a category of hardware security IC that combines nonvolatile or volatile secure memory with environmental tamper detection circuitry, typically used as a companion chip to a host microcontroller or secure element in FIPS-grade designs. The DS3644 belongs to the DeepCover family hierarchy, which sits under the broader Secure Authentication and Hardware Security taxonomy of ICs designed to defeat both logical and physical attacks.
Key features of the DS3644 include 1024 bytes (1 KB) of on-chip SRAM organized as eight 128-byte banks of nonimprinting memory, programmable tamper hierarchy with multiple independent tamper input comparators, an I²C-compatible serial interface for host access, and on-chip tamper response logic that can zeroize memory within microseconds of a detected intrusion. The CSBGA-49 package offers a compact 7 mm x 7 mm footprint, enabling drop-in placement next to host processors on space-constrained PCB designs.
Architecturally, the DS3644 pairs an SRAM array with a tamper-detection state controller; each of the eight memory banks can be independently zeroized under tamper events, and the nonimprinting SRAM prevents residual bit patterns from revealing prior contents after power cycling. Host-side access occurs through a standard I²C interface, while tamper events are signaled via dedicated external pins monitored by on-chip comparators.
Typical applications include cryptographic coprocessor subsystems, payment terminal secure storage, hardware security modules (HSMs), point-of-sale tamper enclosures, and FPGA bitstream encryption key storage. The combination of 1 KB secure SRAM with active tamper response makes it suitable for FIPS 140-2 boundary devices and for key injection into PCIe devices that lack integrated security.
Designers should ensure the tamper input pins are properly biased and that the I²C pull-ups match the chosen bus speed. Because the memory is volatile, an external backup battery or secure EEPROM strategy is required if persistence is needed across power loss; the DS28EC20+ is a common companion in such configurations.
This page synthesizes distributor pricing, secure-memory tier comparisons, and practical tamper-routing design notes that are not consolidated in the manufacturer datasheet.
ドロップイン代替品: DS3644B+ — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
DS3644B
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DS3644
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DS3644B+ 最大定格＆電気的特性
| Product Type | DeepCover Security Manager / Secure SRAM Supervisor |
| メモリサイズ | 1024 bytes (1 KB) SRAM |
| Memory Organization | 8 banks x 128 bytes |
| Tamper Inputs | Programmable tamper hierarchy |
| Host Interface | I²C-compatible serial interface |
| Zeroization Response | On-chip automatic tamper-triggered memory zeroize |
| メモリタイプ | Nonimprinting SRAM (prevents bit-pattern residue) |
| パッケージ | 49-ball CSBGA (7 mm x 7 mm x 0.8 mm) |
| Lead Finish | Pb-free |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant (Pb-free package) |
| Security Family | DeepCover |
| ピン数 | 49 (CSBGA) |
DS3644B+ 49-ball csbga (7 mm x 7 mm x 0.8 mm) ピン配置ガイド
DS3644B+ (49-ball csbga (7 mm x 7 mm x 0.8 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: DS3644B+.
詳細は データシート をご参照ください。
主な用途
DS3644B+ の用途: 6 件s: Cryptographic Coprocessor Secure Key Storage, Payment Terminal Tamper Enclosure, Hardware Security Module (HSM) Boundary Defense, FPGA Bitstream Encryption Key Vault, Industrial IoT Secure Element, Medical Device Data Protection.
Cryptographic Coprocessor Secure Key Storage
The DS3644B+ is well suited as a tamper-responsive key-storage companion to a host cryptographic coprocessor in HSM and PCIe cryptographic accelerator designs. Its 1 KB nonimprinting SRAM can hold AES, RSA, and ECC private keys in eight independently zeroizable 128-byte banks, so a detected intrusion destroys only the affected bank without corrupting unrelated key material. The I²C interface allows the host coprocessor to perform standard read/write transactions for key injection and unwrap operations, while dedicated tamper input pins monitor enclosure switches and mesh traces for breach attempts. Compared with discrete secure EEPROM solutions, the DS3644B+ adds active tamper response without external zeroization logic, simplifying FIPS 140-2 boundary designs and shortening the bill of materials.
おすすめ
Payment Terminal Tamper Enclosure
PIN pads and POS terminals rely on the DS3644B+ to satisfy PCI PTS tamper-response requirements by zeroizing PIN encryption keys the instant a physical breach is detected. The DS3644B+'s programmable tamper hierarchy supports multiple independent tamper input comparators (case-open, temperature, clock glitch, mesh short) routed directly to the IC without external glue logic. The 49-ball CSBGA package is small enough to fit inside PCI-approved PIN pads while still providing eight isolated 128-byte key banks for separate PIN, MAC, and issuer certificates. Designers typically pair the DS3644B+ with a battery-backed real-time clock and a secure boot controller so that tamper events leave no forensic key residue for an attacker to recover with electron microscopy.
おすすめ
Hardware Security Module (HSM) Boundary Defense
In rack-mount and PCIe HSM appliances, the DS3644B+ provides the active tamper boundary between the cryptographic core and the enclosure mesh. Its eight-bank architecture lets the HSM hold master signing keys, vendor CA keys, and per-tenant working keys each in isolated 128-byte partitions, and any detected breach of the corresponding tamper input clears only that bank to minimize collateral damage. The I²C interface integrates cleanly with most HSM management controllers, while the 7 mm x 7 mm CSBGA footprint allows placement directly under the enclosure mesh routing area. Engineers should ensure that tamper traces are routed on an inner PCB layer beneath a mesh ground plane to maximize the DS3644B+ tamper detection sensitivity at the manufacturer.
おすすめ
FPGA Bitstream Encryption Key Vault
Xilinx and Microchip FPGAs that support encrypted bitstreams benefit from the DS3644B+ as a secure vault for the AES-256 bitstream decryption key. The 1 KB of SRAM easily holds the bitstream key plus per-region rekey slots, and the tamper hierarchy means that opening the enclosure to probe the FPGA instantly causes part decryption key zeroization at the manufacturer. The I²C host interface is compatible with the FPGA's I²C configuration bus, allowing the FPGA to read the bitstream key at boot time without external logic. Compared with a discrete battery-backed SRAM plus zeroization ASIC, the DS3644B+ integrates the entire secure vault into a single 49-ball CSBGA, reducing PCB area and improving tamper-resistance at the manufacturer.
おすすめ
Industrial IoT Secure Element
Industrial IoT gateways and edge nodes that store TLS client certificates and provisioning keys can use the DS3644B+ as a tamper-aware secure element on the gateway mainboard. The eight 128-byte SRAM banks allow separate storage of TLS private keys, device certificates, and per-tenant credentials, each with its own tamper input so the bridge can clear only the affected tenant key on a localized intrusion. The I²C interface connects directly to most industrial gateway SoCs without requiring extra GPIO pins for tamper signaling. The 49-ball CSBGA footprint fits within the gateway chassis alongside the SoM module, making the DS3644B+ a drop-in secure-vault addition per the manufacturer.
おすすめ
Medical Device Data Protection
Connected medical devices such as infusion pumps and patient monitors that must protect stored PHI benefit from the DS3644B+ as the tamper-responsive vault for encryption keys. The 1 KB of secure SRAM holds AES-256 keys protecting PHI at rest, while the eight-bank layout lets the device segregate audit-log signing keys from PHI encryption keys, satisfying HIPAA technical-safeguard guidance at the manufacturer. Tamper inputs can be wired to enclosure-open switches, accelerometer tilt sensors, and temperature sensors so that any physical intrusion destroys the encryption material. The 7x7 mm CSBGA-49 footprint fits inside the small-form-factor enclosures typical of wearable and bedside medical devices per the manufacturer datasheet.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: DS3644B+ — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | DS3644B | DS3644 | DS28EC20+ |
|---|---|---|---|---|
| Brand | Analog Devices (Maxim Integrated) | Analog Devices (Maxim Integrated) | Analog Devices (Maxim Integrated) | Analog Devices (Maxim Integrated) |
| Package | 49-ball CSBGA (7x7 mm, 0.8 mm pitch) | 49-ball CSBGA - same | 49-ball CSBGA - same | 6-pin TSOC - different footprint |
| Memory Type | 1 KB SRAM (8 banks x 128 bytes) | 1 KB SRAM (8 banks) - same | 1 KB SRAM (8 banks) - same | 4 KB secure EEPROM (nonvolatile) |
| Host Interface | I2C-compatible | I2C-compatible - same | I2C-compatible - same | 1-Wire |
| Tamper Hierarchy | Programmable multi-input with auto-zeroize | Programmable multi-input - same | Programmable multi-input - same | Limited tamper detection (no external inputs) |
| Pin Compatibility | Reference (CSBGA-49) | Pin-to-pin compatible - same die | Pin-to-pin compatible - same die | Not pin-compatible - requires PCB redesign |
| Nonimprinting Memory | Yes (anti-forensic SRAM) | Yes - same | Yes - same | N/A (EEPROM is nonvolatile, persistent) |
| RoHS / Pb-free | Pb-free (lead-free finish) | Non-Pb-free variant (legacy) | Pb-free - same | Pb-free - same |
| Approximate Unit Price (qty-1) | ~$14.85 | ~$14.85 (legacy, lower availability) | ~$14.85 (authorized channels) | ~$3.50 (lower-cost, different footprint) |
主な差別化要因
- Active tamper hierarchy with on-chip zeroization （vs DS28EC20+)
- Nonimprinting SRAM for anti-forensic security （vs Battery-backed discrete SRAM)
- Eight independently zeroizable memory banks （vs Single-bank secure EEPROMs)
設計ノート
The DS3644B+ integrates only 1 KB of volatile SRAM - any key material that must survive a power-loss event requires an external backup strategy such as a battery-backed secure EEPROM (e.g., DS24B33+ or DS28EC20+). Designers should not assume the on-chip SRAM retains contents across power cycles; the nonimprinting feature actively destroys residual bit patterns on power-down. Plan a host-side key-restore flow at boot if persistence is needed per the manufacturer datasheet.
Route tamper input traces on an inner PCB layer directly beneath a continuous ground-mesh pour so that any attempt to probe or cut the tamper trace triggers a detection event at the DS3644B+. Place the IC as close as practical to the enclosure edge so tamper-input wiring remains short and well-shielded. Use guard rings around the IC's CSBGA ball footprint to prevent side-channel probing of the package substrate; this is critical for PCI PTS and FIPS boundary designs.
The DS3644B+ I²C bus should be pulled up to the same rail that powers the host MCU's I²C peripheral; mismatched pull-up voltages can cause indeterminate logic levels and bus contention. For bus speeds above 400 kHz, calculate pull-up values based on the total bus capacitance including all CSBGA ball-pin pads and PCB traces. Place the I²C pull-ups within 10 mm of the DS3644B+ to minimize rise-time degradation across the 49-ball BGA footprint per the manufacturer datasheet.
The DS3644B+ consumes relatively little power (tens of mW during active tamper monitoring), but the 49-ball CSBGA's small 7x7 mm footprint has limited thermal dissipation. In enclosed POS terminal and HSM designs where ambient temperatures can reach 70-85°C, ensure adequate airflow or thermal coupling to the enclosure chassis. For fan-less designs, derate the operating temperature range by 10-15°C relative to the manufacturer datasheet maximum to guarantee long-term reliability.
Estimated: at the manufacturer's typical Iq (~10 mA active), the 49-ball CSBGA dissipates approximately 30 mW at 3.3V. With a CSBGA-49 theta_JA of roughly 40-50 C/W on a standard 4-layer PCB, the resulting self-heating rise is approximately 1.5°C above ambient - well within the manufacturer's operating range. Engineers should still validate thermal performance in their specific enclosure geometry because the CSBGA package's exposed die backside can be thermally coupled to the PCB inner ground plane for improved dissipation per the manufacturer.
コンプライアンス情報
Pb-free lead finish per the '+' suffix and CSBGA package designation per the manufacturer datasheet. REACH and halogen-free status not explicitly stated in verified web data and should be confirmed with Analog Devices for EU-bound designs. AEC-Q100 not applicable - this is a security manager IC, not an automotive-qualified part.
