DSPIC33EP512MC506-E/MR - 16-bit DSC 60 MIPS 512KB | Microchip
部品番号: DSPIC33EP512MC506-E/MR ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $8.12 | $8.12 |
| 10 | $7.35 | $73.50 |
| 100 | $6.55 | $655.00 |
| 500 | $5.92 | $2,960.00 |
| 1,000 | $5.35 | $5,350.00 |
DSPIC33EP512MC506-E/MR 概要
A digital signal controller combines the compute throughput of a digital signal processor (DSP) with the peripheral integration and deterministic control of a microcontroller (MCU). Within the power-management hierarchy, the dsPIC33E family sits above general-purpose PIC MCUs and targets embedded control systems that need multiply-accumulate (MAC) DSP instructions alongside real-time closed-loop control, such as digital power conversion and motor drives.
Key features include the dsPIC33E 16-bit core with integrated DSP engine, motor control PWM (MCPWM) outputs, quadrature encoder interface (QEI) inputs, on-chip operational amplifiers, analog comparators, a CAN 2.0B controller, and the peripheral trigger generator (PTG) for hardware-autonomous sequenced operation. These peripherals allow sensorless or encoder-based field-oriented control (FOC) without excessive CPU loading.
Architecturally, the controller executes from zero-wait-state Flash at up to 60 MIPS in this speed grade, with 24-bit instruction words, hardware divide support, and two 40-bit accumulators for DSP math. The extended-temperature -E grade supports industrial drives operating in hot enclosures, and the 64-VQFN exposed-pad package improves thermal performance and ground integrity versus the TQFP option.
Typical applications include brushless DC (BLDC) and permanent-magnet synchronous motor (PMSM) control, switched-mode power supplies and digital power factor correction, embedded motion control for factory automation, and automotive-adjacent industrial actuators that benefit from the CAN interface.
For design, supply the core from the on-chip regulator (3V to 3.6V VDD per family specifications) and decouple the VDDCORE/VCAP pin per the manufacturer datasheet; MCLR programming requires Microchip MPLAB X tooling and an ICSP-compatible programmer such as PICkit or ICD.
This page synthesizes distributor pricing context, same-package drop-in alternatives, pinout/download guidance, and practical design notes not found on the manufacturer product page alone.
ドロップイン代替品: DSPIC33EP512MC506-E/MR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: DSPIC33EP512MC506-E/MR （同一形状・フットプリント） — 相違点: Core, Mounting Type, Package, Peripheral Trigger Generator, Comparators.
クイック比較ツール — 並列比較する代替部品を選択:
DSPIC33EP512MC506-I/MR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
DSPIC33EP256MC506-E/MR
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33EP128MC506-E/MR
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
価格はお問い合わせください
データシートを見る →DSPIC33EP64MC506-E/MR
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3.86 / 個
データシートを見る →DSPIC33EP512MC506-E/MR 最大定格＆電気的特性
| Core | dsPIC33E 16-bit DSC core |
| CPU Speed | 60 MIPS (60 MHz) speed grade |
| Flash Memory | 512KB (170K x 24) |
| RAM | 48KB |
| パッケージ | 64-VQFN (9x9 mm), exposed pad |
| 動作温度 | -40C to +125C (-E extended grade) |
| 電源電圧 | 3 V to 3.6 V (VDD) |
| Motor Control PWM | MCPWM peripheral |
| Quadrature Encoder Interface | QEI included |
| On-chip Op Amps | Yes |
| Comparators | Yes |
| Peripheral Trigger Generator | PTG included |
| CAN | CAN 2.0B controller |
| 実装タイプ | Surface Mount |
| Instruction Word Width | 24-bit |
DSPIC33EP512MC506-E/MR 64-vqfn (9x9 mm), exposed pad ピン配置ガイド
DSPIC33EP512MC506-E/MR (64-vqfn (9x9 mm), exposed pad パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: DSPIC33EP512MC506-E/MR.
詳細は データシート をご参照ください。
主な用途
DSPIC33EP512MC506-E/MR の用途: 6 件s: BLDC / PMSM Motor Control, Digital Power Conversion, Industrial Automation and Motion, Automotive-Adjacent Actuators, Robotics and Drones, Medical and Lab Pump Control.
BLDC / PMSM Motor Control
The DSPIC33EP512MC506-E/MR is engineered for brushless DC and permanent-magnet synchronous motor drives. Its motor control PWM (MCPWM) peripheral generates complementary or independent PWM with dead-time insertion, while the quadrature encoder interface reads position sensors directly and on-chip op amps amplify shunt current signals, eliminating external signal-conditioning ICs. In a typical field-oriented control (FOC) loop, the 60 MIPS dsPIC33E core executes current-loop and speed-loop computations with headroom, and the comparators provide cycle-by-cycle overcurrent protection. The -40C to +125C grade suits drives inside hot industrial enclosures, and the 64-VQFN exposed pad conducts heat into the PCB for reliable continuous operation.
おすすめ
Digital Power Conversion
Switch-mode power supplies and power factor correction stages benefit from the DSPIC33EP512MC506-E/MR's combination of high-resolution PWM and DSP throughput. The MCPWM module supports phase-shifted and interleaved topologies such as LLC half-bridge and totem-pole PFC, with hardware fault inputs shutting outputs off within a clock cycle on overcurrent events. The 60 MIPS core closes voltage and current loops with proportional-integral or predictive algorithms, and the peripheral trigger generator (PTG) sequences ADC sampling without CPU intervention. Running from 3.3V with -E temperature rating, the DSC operates reliably on hot digital-power PCBs next to magnetics and power switches.
おすすめ
Industrial Automation and Motion
Factory automation nodes use the DSPIC33EP512MC506-E/MR as an embedded motion controller. The QEI input tracks incremental encoder feedback, MCPWM drives servo or stepper power stages, and the CAN 2.0B controller links the node to a plant network through a single transceiver. The PTG offloads repetitive trigger sequences from the CPU, keeping control-loop jitter minimal. With 512KB of Flash, one controller can store multiple motion profiles, compensation tables, and a command interpreter simultaneously. The extended -40C to +125C operating range and 64-VQFN package allow mounting near actuators inside sealed machinery cabinets without forced-air cooling.
おすすめ
Automotive-Adjacent Actuators
Industrial-vehicle and off-highway actuator designs adopt the DSPIC33EP512MC506-E/MR where CAN networking and wide temperature tolerance are mandatory. The integrated CAN 2.0B controller communicates with vehicle ECUs over a single transceiver, while MCPWM and QEI close position loops on electric actuators for throttle, valve, or lift control. The -E grade covers engine-bay and underbody ambient extremes from -40C to +125C, and the on-chip comparators implement hardware-level current limiting for fault safety. The 64-pin VQFN footprint integrates motor drive control, sensing, and networking in one chip, reducing harness complexity and controller PCB area versus multi-chip solutions.
おすすめ
Robotics and Drones
Compact robotic joints and UAV propulsion controllers leverage the DSPIC33EP512MC506-E/MR's single-chip integration. Each joint controller reads an encoder through QEI, drives motor phases through MCPWM, and amplifies current feedback with on-chip op amps, so a multi-axis robot uses one small DSC per axis. The 48KB RAM holds trajectory buffers and state estimators, and the 512KB Flash stores kinematic firmware with room for field updates. The 9x9 mm VQFN package fits dense driver boards, and the exposed pad provides thermal relief for continuous motor current operation. DSP instructions accelerate notch filtering and sensor fusion in vibration-prone servo mechanisms.
おすすめ
Medical and Lab Pump Control
Precision fluid-handling equipment such as infusion pumps and lab autosamplers uses the DSPIC33EP512MC506-E/MR for quiet, accurate stepper and BLDC actuation. Microstepping PWM sequences from the MCPWM module, combined with current-sense feedback through the on-chip op amps and comparators, deliver smooth low-acoustic-noise motion that meets medical quietness expectations. The PTG automates repetitive step-timing so the core remains free for safety monitoring and host communication over CAN or UART. The extended temperature grade tolerates sterilization-adjacent warm compartments, and the 64-VQFN package consolidates control electronics onto compact single-board designs typical of desktop medical devices.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: DSPIC33EP512MC506-E/MR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | DSPIC33EP512MC506-I/MR | DSPIC33EP256MC506-E/MR | DSPIC33EP128MC506-E/MR | DSPIC33EP512MC506-E/PT |
|---|---|---|---|---|---|
| Package | 64-VQFN (9x9) | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-TQFP (10x10) - different footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 512KB (170K x 24) | 512KB (170K x 24) | 256KB | 128KB | 512KB (170K x 24) |
| RAM | 48KB | 48KB | 48KB | 48KB | 48KB |
| CPU Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Operating Temperature | -40C to +125C | -40C to +85C | -40C to +125C | -40C to +125C | -40C to +125C |
| Motor Control Peripherals | MCPWM, QEI, Op Amps, Comparators, PTG, CAN | Identical peripheral set | Identical peripheral set | Identical peripheral set | Identical peripheral set |
| Development Toolchain | MPLAB X + XC16 + ICSP | MPLAB X + XC16 + ICSP | MPLAB X + XC16 + ICSP | MPLAB X + XC16 + ICSP | MPLAB X + XC16 + ICSP |
主な差別化要因
- Extended temperature range for hot environments （vs DSPIC33EP512MC506-I/MR)
- Largest Flash in the 64-VQFN MC506 family （vs DSPIC33EP256MC506-E/MR)
- Fully integrated motor-control signal chain （vs DSPIC33EP64MC506-E/MR)
設計ノート
The dsPIC33E family uses an internal core regulator fed from the 3V-3.6V VDD rail; connect the VCAP/VDDCORE pin to a low-ESR capacitor (typically around 10 uF, verify the exact value in the manufacturer datasheet) and keep the trace short. Place a 0.1 uF ceramic decoupling capacitor at each VDD/VSS pin pair plus at least one bulk 10 uF capacitor near the supply entry. In motor-drive boards, separate the DSC ground from power-switching ground with a single-point connection to prevent PWM edge jitter coupling into ADC readings.
The -E grade is rated to +125C ambient, but junction margin depends on the VQFN exposed pad. Estimated: dissipating roughly 0.3 W on a 4-layer board with a solid ground plane tied to the exposed pad typically keeps junction rise moderate, but a poor thermal pad connection on a 2-layer board can more than double it. Solder the exposed pad to a copper pour with an array of thermal vias, and verify junction temperature against the datasheet theta-JA for your stack-up in high-ambient enclosures.
Route the MCPWM outputs away from analog op-amp and comparator inputs; the on-chip analogs are convenient but susceptible to digital crosstalk on a shared die. Use guard traces or analog ground islands under current-sense routing. Keep PGD/PGC ICSP programming pads on the PCB even in production for field firmware updates. Confirm that the MCLR pull-up and programmer connector follow the manufacturer programming specification to avoid bricking devices during in-circuit reprogramming.
コンプライアンス情報
Compliance data not stated in the provided web data. Verify RoHS/REACH status on the Microchip product page or distributor compliance documents before design-in.
