DSPIC33EP64GS804-E/ML - 16-bit 70 MIPS Digital Power DSC | Microchip
部品番号: DSPIC33EP64GS804-E/ML ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
DSPIC33EP64GS804-E/ML 概要
A digital signal controller combines the computational throughput of a DSP core with the peripheral integration and interrupt architecture of a microcontroller. In the system hierarchy, this device sits between a general-purpose MCU and a dedicated DSP, offering hardware multiply-accumulate (MAC) and divide support alongside deterministic interrupt latency, which is essential for closed-loop control systems that execute current loops at switching frequency.
Key features include the interconnected high-Speed PWM module purpose-built for digital power conversion, high-speed 12-bit ADC with an integrated programmable gain amplifier (PGA), on-chip comparators, and a CAN module for industrial and automotive networking. The dual-partition Flash architecture enables live firmware updates, allowing one partition to execute while the other is reprogrammed.
Technically, the device belongs to Microchip's dsPIC33EP GS-series, which was architected specifically for digital power supplies. The PWM, ADC, and comparators are interconnected, so trigger and fault signals propagate between analog and digital domains without CPU intervention, minimizing loop latency. The -E/ML suffix confirms the extended temperature grade (up to +125C ambient) and the 44-QFN exposed-pad package, which also improves thermal dissipation into the PCB ground plane.
Typical applications include AC-DC and DC-DC power supplies, power factor correction (PFC) stages, LLC resonant converters, solar micro-inverters, and battery chargers where high-resolution PWM and fast ADC sampling directly improve control-loop bandwidth and efficiency.
When designing with this device, budget the exposed pad as the primary thermal path and confirm 3.3V supply decoupling on all VDD pairs. Note that third-party sources report both 60 MIPS and 70 MIPS for this part; verify the figure against the specific operating frequency in the manufacturer datasheet.
This page synthesizes distributor pricing channels, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: DSPIC33EP64GS804-E/ML — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: DSPIC33EP64GS804-E/ML （同一形状・フットプリント） — 相違点: Core Architecture, Package, Operating Temperature, PWM, Program Memory (Flash).
クイック比較ツール — 並列比較する代替部品を選択:
DSPIC33EP64GS804-I/ML
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3.98 / 個
データシートを見る →DSPIC33EP32GS804-E/ML
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33EP64GS504-I/ML
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$4.45 / 個
データシートを見る →DSPIC33EP32GS502-I/ML
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33EP64GS804-E/ML 最大定格＆電気的特性
| Core Architecture | 16-bit dsPIC DSC |
| Core Performance | 70 MIPS (60 MHz core clock per Newark/GlobalSpec; DigiKey lists 60 MIPs) |
| Program Memory (Flash) | 64KB (64K x 8) |
| RAM | 8KB |
| 電源電圧 | 3.3 V |
| パッケージ | 44-QFN (8x8 mm) with Exposed Pad |
| 実装タイプ | Surface Mount |
| 動作温度 | -40C to +125C (E grade) |
| CAN | Yes |
| PWM | Interconnected high-speed PWM (digital power optimized) |
| ADC | High-speed ADC with PGA |
| Comparators | On-chip comparators |
| Dual Partition Flash | Yes (live update capable) |
| Feature Segment | Functional Safety (FuSa) supported |
| ライフサイクル状態 | In Production |
| Packaging | Tube |
DSPIC33EP64GS804-E/ML 44-qfn (8x8 mm) with exposed pad ピン配置ガイド
DSPIC33EP64GS804-E/ML (44-qfn (8x8 mm) with exposed pad パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: DSPIC33EP64GS804-E/ML.
詳細は データシート をご参照ください。
主な用途
DSPIC33EP64GS804-E/ML の用途: 6 件s: Digital Power Factor Correction (PFC), AC-DC and LLC Resonant Power Supplies, Solar Micro-Inverters and String Optimizers, Battery Chargers and BMS Front Ends, Digital Lighting Ballasts and LED Drivers, Motor Control Drives with CAN Networking.
Digital Power Factor Correction (PFC)
The DSPIC33EP64GS804-E/ML fits interleaved PFC stages because its interconnected high-speed PWM can phase-shift multiple converter legs while the high-speed ADC with PGA samples inductor current and bus voltage with the low latency a current-mode control loop demands. Microchip's Interleaved PFC reference design for the SMPS dsPIC family demonstrates a universal-input unit producing a high-voltage DC output up to 350W, proving the architecture in production hardware. On-chip comparators provide hardware cycle-by-cycle overcurrent limiting that acts without CPU intervention, protecting the MOSFETs during input transients. The dual-partition Flash allows firmware-only efficiency optimizations to be field-deployed without a service visit, and the -40C to +125C E grade covers the hot environment near power-switching stages.
おすすめ
AC-DC and LLC Resonant Power Supplies
LLC converters require precisely controlled, frequency- and phase-modulated gate drive with nanosecond-scale resolution - exactly what the GS804's interconnected high-speed PWM delivers. The controller updates PWM duty and phase from the control loop at rates matched to the 60-70 MHz core, while the high-speed ADC digitizes the resonant tank current through its PGA without external amplification stages, reducing BOM cost and offset error. The on-chip comparators implement fast burst-mode or protection tripping independent of software, which is critical during fault events in offline supplies. The 3.3V rail and 44-QFN 8x8 mm footprint allow compact placement on the secondary-side control board, and CAN connectivity supports hot-swap PSU racks in server and telecom infrastructure where digital telemetry is mandatory.
おすすめ
Solar Micro-Inverters and String Optimizers
Micro-inverters combine MPPT control, grid-synchronized inversion, and safety compliance in a thermally stressed outdoor enclosure, making the GS804's -40C to +125C E temperature grade and digital-power PWM architecture a strong match. The high-speed ADC with PGA tracks panel current and grid voltage simultaneously, while interconnected PWM modules generate the interleaved high-frequency stages that shrink magnetics and improve panel-level efficiency. Dual-partition Flash enables field firmware updates for evolving grid codes (anti-islanding, reactive power support) without hardware recall - a decisive commercial advantage. The CAN module links multiple optimizers on a rooftop daisy chain for monitoring, and the 44-QFN exposed pad sinks heat into the aluminum enclosure, keeping junction temperature within limits at full solar irradiance.
おすすめ
Battery Chargers and BMS Front Ends
Multi-chemistry battery charging demands precise CC/CV profiling, temperature-qualified charging, and fast fault response. The GS804 executes the charging state machine while its interconnected PWM and comparators enforce cycle-by-cycle current limits in hardware, catching short-circuit events far faster than software alone. The high-speed ADC with PGA reads current-sense shunt voltages directly, and multiple analog channels monitor cell temperatures for JEITA-style charge derating. The CAN module integrates the charger into vehicle or industrial battery networks for command and telemetry, and the 125C-capable E grade suits under-hood or high-power charger cabinets. With 64KB dual-partition Flash, charging algorithms can be updated in the field as new battery chemistries are added to the product line without a hardware change.
おすすめ
Digital Lighting Ballasts and LED Drivers
High-intensity and industrial LED drivers use the GS804's high-speed PWM both for power conversion and for precise dimming control, where the same 60-70 MHz timer resolution gives flicker-free wide-range dimming. The high-speed ADC samples output current and photodiode or temperature feedback, closing the loop that maintains constant lumen output over LED aging and thermal drift. Hardware comparators enforce open-circuit and short-circuit protection without CPU latency, extending luminaire lifetime. The 3.3V single-supply operation and compact 8x8 mm QFN fit inside driver enclosures alongside the power stage, and the CAN interface supports DALI-over-CAN or building-network control schemes in smart-lighting installations, with dual-partition Flash enabling field updates when lighting control protocols evolve.
おすすめ
Motor Control Drives with CAN Networking
The GS804 runs field-oriented control for PMSM and BLDC motors using its DSP MAC instructions for the Clarke/Park transforms while interconnected PWM produces the three-phase complementary gate patterns with programmable dead time. The high-speed ADC with PGA samples phase currents synchronized to the PWM center, minimizing switching-noise corruption of the current feedback, and hardware comparators trip the PWM outputs on overcurrent within a single PWM cycle. The on-chip CAN module connects the drive to industrial automation networks for command, telemetry, and functional-safety monitoring, consistent with the FuSa support classification distributors attach to this part. The -40C to +125C E grade withstands drive-enclosure temperatures near the power stage during sustained load.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: DSPIC33EP64GS804-E/ML — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | DSPIC33EP64GS804-I/ML | DSPIC33EP32GS804-E/ML | DSPIC33EP64GS504-I/ML | DSPIC33EP32GS502-I/ML |
|---|---|---|---|---|---|
| Package | 44-QFN (8x8) EP | 44-QFN (8x8) EP - same | 44-QFN (8x8) EP - same | 44-QFN (8x8) EP - same | 44-QFN (8x8) EP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64KB | 64KB | 32KB | 64KB | 32KB |
| Core Performance | Up to 70 MIPS (60 MHz) | Up to 70 MIPS (60 MHz) | Up to 70 MIPS (60 MHz) | Up to 70 MIPS (60 MHz) | Up to 70 MIPS (60 MHz) |
| Operating Temperature | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) |
| Digital Power Peripherals (PWM/PGA) | Interconnected high-speed PWM + ADC PGA (GS80x full set) | GS80x full set - identical | GS80x full set - identical | Reduced GS50x set - verify PWM channels | Reduced GS50x set - verify PWM channels |
主な差別化要因
- Extended -40C to +125C temperature grade （vs DSPIC33EP64GS804-I/ML)
- 64KB dual-partition Flash for field updates （vs DSPIC33EP32GS804-E/ML)
- Full GS80x digital-power peripheral set （vs DSPIC33EP64GS504-I/ML)
- Exposed-pad QFN thermal performance （vs DSPIC33EP64GS804-E/PT)
設計ノート
The 44-QFN exposed pad is the primary thermal path for the DSPIC33EP64GS804-E/ML. Connect the exposed pad to a solid ground plane with an array of thermal vias (typically 5x5, 0.3 mm drill) to pull heat into inner copper layers. In digital power designs the DSC sits near hot switching components; at +125C ambient the margin to maximum junction temperature is limited, so verify junction temperature with your estimated dissipation before finalizing the enclosure. Estimated: if the controller dissipates roughly 0.2W and the effective theta_JA with a good via array is around 40 C/W, the rise is about 8C - acceptable, but poor pad soldering can multiply this.
Decouple all VDD/VDDCORE pin pairs with 0.1uF ceramics placed within 2 mm of each pin pair, plus one bulk 4.7-10uF per supply domain. Route the AVDD supply through an RC filter (ferrite or 10-ohm resistor plus 1uF) from the digital 3.3V rail so the high-speed ADC and PGA achieve their specified noise performance - digital rail ripple on AVDD directly degrades ADC ENOB. Keep the high-speed PWM outputs away from analog feedback traces, and return gate-drive currents on their own ground path to prevent ground bounce corrupting ADC readings sampled at PWM centers.
Three frequent mistakes with GS-series parts: (1) enabling dual-partition live-update mode halves usable program space per partition - a 64KB part gives only ~32KB per partition, which can overflow previously fitting firmware; plan memory before committing to field updates. (2) Distributor listings quote both 60 MIPS and 70 MIPS for this family - always derive your timing budget from the core frequency configured in the configuration bits, not from marketing MIPS. (3) Pin-multiplexing means peripheral assignments are set in PPS (peripheral pin select) registers - a wrong PPS mapping is invisible at compile time; simulate and scope every PWM output before applying power to the converter stage.
コンプライアンス情報
The -E suffix denotes extended temperature grade, not an environmental certification. Distributor listings classify the part as Automotive (FindIC), but AEC-Q100 qualification status was not explicitly stated in the provided data - verify with Microchip. RoHS/REACH status must be confirmed from the Microchip product page or datasheet.