DSPIC33FJ32GS606T-50I/MR - 16-bit 50 MIPS DSC 32KB | Microchip
部品番号: DSPIC33FJ32GS606T-50I/MR ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $6.05 | $6.05 |
| 10 | $5.6 | $56.00 |
| 100 | $5.05 | $505.00 |
| 500 | $4.6 | $2,300.00 |
| 1,000 | $4.15 | $4,150.00 |
DSPIC33FJ32GS606T-50I/MR 概要
A digital signal controller combines the computational throughput of a DSP engine with the control peripherals and ease of use of a microcontroller. Within the power-management hierarchy, a DSC such as the dsPIC33F family member sits above a basic MCU: it executes closed-loop control algorithms for switching power supplies, digital lighting, and motor drives at switching frequencies in the hundreds of kilohertz while retaining general-purpose I/O and communication peripherals.
Key differentiating features include the dedicated SMPS PWM module with high-resolution PWM outputs, a high-speed 12-bit ADC with simultaneous multi-channel sampling, four analog comparators, two quadrature encoder interfaces (QEI), and on-chip DAC channels. These peripherals eliminate external analog control circuitry in switched-mode power conversion designs.
Architecturally, the dsPIC33FJ32GS606 integrates a 16-bit modified Harvard core with DSP multiply-accumulate instructions, operating up to 50 MIPS from an internal PLL. The GS (SMPS) variant of the dsPIC33F family is purpose-built for digital power: its PWM module supports complementary outputs, dead-time insertion, and current-limit trip inputs for cycle-by-cycle current limiting in half-bridge and full-bridge converters.
Typical applications include AC-DC and DC-DC digital power supplies, power factor correction (PFC) stages - Microchip provides an interleaved PFC reference design for this controller - digital ballasts, uninterruptible power supplies, and battery chargers.
Design consideration: the industrial temperature variant (-40C to +85C, suffix I) requires attention to VQFN exposed-pad thermal grounding; the exposed pad must be soldered to a ground plane for both thermal dissipation and signal integrity of the analog peripherals.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design guidance not found in the manufacturer datasheet, with pricing verified against LCSC, DigiKey, and Octopart as of 2026-09-27.
ドロップイン代替品: DSPIC33FJ32GS606T-50I/MR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: DSPIC33FJ32GS606T-50I/MR （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Supply Voltage, Core Architecture, Factory Pack Quantity.
クイック比較ツール — 並列比較する代替部品を選択:
DSPIC33FJ32GS606-50I/MR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
DSPIC33FJ64GS606T-50I/MR
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33FJ16GS606T-50I/MR
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33FJ64GS606-I/MR
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
価格はお問い合わせください
データシートを見る →DSPIC33FJ16GS606-I/MR
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33FJ32GS606T-50I/MR 最大定格＆電気的特性
| Core Architecture | 16-bit dsPIC DSC |
| Max CPU Speed | 50 MIPS |
| Program Memory (Flash) | 32 KB (32K x 8) |
| RAM | 4 KB |
| 電源電圧 | 3.3 V |
| パッケージ | 64-VQFN (9x9 mm), exposed pad |
| 動作温度 | -40C to +85C (Industrial) |
| SMPS PWM Channels | Yes (dedicated SMPS PWM module) |
| Comparators | 4 |
| Quadrature Encoder Interfaces | 2 |
| DAC | Yes (on-chip) |
| 実装タイプ | Surface Mount |
| Product Series | dsPIC33FJ32GS (SMPS DSC) |
| Product Type | Digital Signal Controller (DSC) |
| Factory Pack Quantity | 40 (Tube) |
| RoHS ステータス | Compliant |
DSPIC33FJ32GS606T-50I/MR 64-vqfn (9x9 mm), exposed pad ピン配置ガイド
DSPIC33FJ32GS606T-50I/MR (64-vqfn (9x9 mm), exposed pad パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: DSPIC33FJ32GS606T-50I/MR.
詳細は データシート をご参照ください。
主な用途
DSPIC33FJ32GS606T-50I/MR の用途: 6 件s: Digital Switch-Mode Power Supplies, Interleaved Power Factor Correction (PFC), Digital Lighting and Ballast Control, Motor Drives and Servo Control, Uninterruptible Power Supplies (UPS), Battery Chargers and DC-DC Converters.
Digital Switch-Mode Power Supplies
The DSPIC33FJ32GS606T-50I/MR is purpose-built for digital SMPS control: its dedicated SMPS PWM module provides complementary outputs with programmable dead-time and high-resolution duty-cycle control, while the high-speed ADC samples output voltage and inductor current synchronously with the PWM period. Running at 50 MIPS, the DSC executes voltage-mode or current-mode control loops with digital compensators at switching frequencies in the 100-500 kHz range. Four on-chip comparators support cycle-by-cycle overcurrent protection with hardware trip inputs, achieving protection latency independent of software. The 32KB Flash accommodates full PFC plus downstream DC-DC control with communication stacks in a single 64-VQFN device, eliminating dedicated analog control ICs.
おすすめ
Interleaved Power Factor Correction (PFC)
Microchip provides a dedicated reference design for interleaved PFC built on this SMPS dsPIC DSC family, and the DSPIC33FJ32GS606T-50I/MR fits this role directly. The SMPS PWM module generates multiple phase-shifted PWM channels for interleaved boost stages, while the high-speed ADC samples input current and bus voltage each switching cycle for average-current-mode control. The 50 MIPS DSP core implements harmonic-injection and notch-filter compensators achieving power factors above 0.99. Four comparators provide fast hardware overcurrent trips per phase. The 32KB Flash holds the PFC algorithm plus housekeeping and telemetry code, and the industrial -40C to +85C rating suits server and telecom front-end environments.
おすすめ
Digital Lighting and Ballast Control
For digital ballasts and LED drivers, the DSPIC33FJ32GS606T-50I/MR combines the SMPS PWM module's resonant-mode and phase-shift capabilities with the on-chip DAC for programmable reference generation, enabling dimming control without external DACs. The high-speed ADC monitors lamp current and bus voltage at PWM-synchronized intervals, and the four analog comparators implement fast lamp-fault and overcurrent protection in hardware. At 50 MIPS, the controller manages half-bridge or full-bridge resonant topologies common in fluorescent and HID ballasts. The 3.3V supply and 64-pin VQFN allow compact two-layer control boards, while 32KB Flash stores ignition, warm-up, run, and fault state machines with communication interfaces.
おすすめ
Motor Drives and Servo Control
The DSPIC33FJ32GS606T-50I/MR includes two quadrature encoder interfaces, making it well suited to servo and BLDC motor control with positional feedback. The SMPS PWM module drives three-phase inverters with complementary outputs and dead-time insertion, while the high-speed ADC performs simultaneous sampling of two phase currents for field-oriented control (FOC) at the 50 MIPS core's full rate. Hardware comparator trips provide shoot-through and overcurrent protection independent of software latency. The 4KB RAM supports FOC state variables, compensation filters, and a communication stack. Industrial temperature rating and 64-pin VQFN with exposed pad enable thermally robust drive boards for factory automation and robotics.
おすすめ
Uninterruptible Power Supplies (UPS)
In line-interactive and double-conversion UPS designs, the DSPIC33FJ32GS606T-50I/MR controls the AC-DC rectifier, DC-AC inverter, and battery charger stages with one device. The SMPS PWM module provides the multiple independent PWM channels needed for inverter bridges and buck charger stages, and the high-speed ADC samples AC input, inverter output, and battery current in synchronized slots. Four comparators give hardware-level fault detection for overload and short-circuit events, critical for transfer-time guarantees. The DSP engine executes waveform generation and distortion cancellation at 50 MIPS. The 32KB Flash and 4KB RAM leave headroom for battery-management state machines and PMBus-style host communication.
おすすめ
Battery Chargers and DC-DC Converters
The DSPIC33FJ32GS606T-50I/MR implements multi-stage charging algorithms (CC, CV, float, and termination) with full telemetry. The high-resolution SMPS PWM controls buck, boost, or synchronous buck-boost power stages at hundreds of kilohertz, and the high-speed ADC monitors battery voltage and current with PWM-synchronized sampling that avoids switching noise. The on-chip DAC provides programmable current/voltage references, and comparators implement hardware termination and fault cutoffs. At 50 MIPS, the core runs coulomb counting, temperature-compensated charge curves, and CAN or UART communication simultaneously. The 3.3V, 64-VQFN industrial-grade device suits telecom rectifiers, e-bike chargers, and embedded DC-DC bricks.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: DSPIC33FJ32GS606T-50I/MR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | DSPIC33FJ32GS606-50I/MR | DSPIC33FJ64GS606T-50I/MR | DSPIC33FJ16GS606T-50I/MR | DSPIC33FJ64GS606-I/MR | DSPIC33FJ16GS606-I/MR |
|---|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm), exposed pad | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 50 MIPS | 50 MIPS | 50 MIPS | 50 MIPS | 50 MIPS | 50 MIPS |
| Flash Memory | 32 KB | 32 KB | 64 KB | 16 KB | 64 KB | 16 KB |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Packaging / Delivery | Tape & Reel (T suffix) | Tube (factory pack 40) | Tape & Reel | Tape & Reel | Tube | Tube |
主な差別化要因
- 32KB Flash balances code space and cost within the GS606 pinout （vs DSPIC33FJ64GS606T-50I/MR)
- Tape & Reel delivery for automated production （vs DSPIC33FJ32GS606-50I/MR)
- More code headroom than the 16GB-tier family member （vs DSPIC33FJ16GS606T-50I/MR)
- Dedicated SMPS PWM peripherals not found on generic dsPIC33F GP parts （vs DSPIC33FJ32GP304-I/ML)
設計ノート
The 64-VQFN (9x9 mm) exposed pad is the primary ground return for the dsPIC33FJ32GS606's high-speed ADC and SMPS PWM module. Solder the exposed pad to a solid ground plane via a 3x3 or larger via array - a solder-mask-defined paste pattern with ~60-70% pad coverage avoids excessive solder squeeze-out. Place 0.1 uF decoupling capacitors within 2-3 mm of each VDD/VSS pin pair, plus one bulk 10 uF ceramic near the supply entry. Analog AVDD should be filtered from DVDD with an ferrite bead or RC network to preserve ADC accuracy in power-conversion designs.
The controller operates from a single 3.3V rail; estimated power dissipation at 50 MIPS with typical activity is on the order of 100-200 mA core+I/O (consult the datasheet electrical characteristics table for exact ICC curves), yielding roughly 0.3-0.7W worst case. The exposed pad with a good ground plane typically keeps junction rise below 20-30C at 85C ambient, but verify with theta-JA from the datasheet package section for your board stack-up. Never float the exposed pad - it is electrically VSS.
In SMPS applications, configure PWM fault/current-limit trip inputs in hardware (comparator-to-PWM direct paths) rather than relying on software interrupts - software latency at 50 MIPS can be too slow for cycle-by-cycle current limiting at 300+ kHz switching frequencies. Also, when migrating from 16KB (GS502/GS504) to this 32KB part or upward to 64KB (GS606 64K variant), verify the linker scripts and programming files target the correct memory map; the family shares peripherals but not identical configuration-word settings across all members.
Keep the SMPS PWM output traces short and route them away from the ADC input pins and the analog ground region. Because the ADC is PWM-synchronized in typical digital-power designs, switching-noise coupling into sample-and-hold circuits appears as sampling artifacts; a dedicated analog ground island connected to the main plane at a single point under the exposed pad, plus RC filtering on current-sense inputs, preserves the 12-bit ADC's effective resolution in half-bridge and full-bridge converters.
コンプライアンス情報
RoHS compliance indicated in distributor specification data (DigChip listing). For REACH, lead-free, and conflict-minerals declarations, consult official Microchip environmental compliance documentation for this orderable part number.
