DSPIC33FJ64GP706A-I/PT - 16-bit DSC, 40 MIPS, 64KB Flash | Microchip
部品番号: DSPIC33FJ64GP706A-I/PT ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $7.62 | $7.62 |
| 10 | $6.86 | $68.60 |
| 100 | $6.11 | $611.00 |
| 500 | $5.5 | $2,750.00 |
| 1,000 | $4.95 | $4,950.00 |
DSPIC33FJ64GP706A-I/PT 概要
A digital signal controller combines the computational throughput of a digital signal processor with the peripheral integration and control-oriented architecture of a microcontroller. DSCs occupy a mid-tier position in the embedded hierarchy: microcontroller -> digital signal controller -> DSP -> application processor. The dsPIC33FJ family executes most instructions in a single cycle and adds DSP-class engines for multiply-accumulate-heavy workloads while retaining familiar MCU peripherals such as UARTs, SPI, I2C, and PWM modules.
Key features of this part include the 16-bit modified Harvard architecture running at 40 MIPS, Flash program memory with In-Circuit Serial Programming (ICSP) support, a barrel shifter for fast bit manipulation, dual operand fetch for DSP multiply-accumulate operations, and boundary-scan capability for board-level test. The device operates from a 3.0V to 3.6V supply (3.3V nominal) per verified distributor data.
Architecturally, the dsPIC33FJ core pairs the 16-bit CPU with a dedicated DSP multiply-accumulate unit and flexible addressing modes. Program memory is executed from Flash with an internal line prefetch mechanism, and the device supports seamless migration to PIC24F/PIC24H MCUs and dsPIC30F DSCs in similar packages, protecting software and layout investment across product generations.
Typical applications include digital power conversion (PFC, inverters), motor control (BLDC, PMSM, stepper), sensor signal conditioning and filtering, and general-purpose embedded control where math acceleration matters. On-chip communication peripherals make it well suited to industrial networking nodes.
For design, verify that your compiler toolchain (MPLAB XC-DSC) targets the A-silicon revision of this device, and use ICSP with a compatible programmer/debugger such as MPLAB SNAP for in-circuit development. Budget GPIO mapping early, since 64 pins are shared among many peripherals.
This page synthesizes distributor pricing, drop-in alternatives, design notes, and application guidance not found in the manufacturer datasheet alone.
ドロップイン代替品: DSPIC33FJ64GP706A-I/PT — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: DSPIC33FJ64GP706A-I/PT （同一形状・フットプリント） — 相違点: Operating Temperature, Package, Core Architecture, Supply Voltage, Communication Interfaces.
クイック比較ツール — 並列比較する代替部品を選択:
DSPIC33FJ64GP706A-E/PT
✅ ドロップイン✓ 在庫あり
$5.55 / 個
データシートを見る →DSPIC33FJ64GP206A-E/PT
✅ ドロップイン✓ 在庫あり
$5.2 / 個
データシートを見る →DSPIC33FJ256GP506A-E/PT
✅ ドロップイン✓ 在庫あり
$6.6 / 個
データシートを見る →DSPIC33FJ128GP706A-I/PT
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$7.86 / 個
データシートを見る →DSPIC33FJ256GP506AT-I/PT
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$4.95 / 個
データシートを見る →DSPIC33FJ64GP706A-I/PT 最大定格＆電気的特性
| Core Architecture | 16-bit |
| Product Type | Digital Signal Controller (DSC) |
| Series | dsPIC33FJ64GP706A (dsPIC 33F) |
| Maximum CPU Speed | 40 MIPS |
| Program Memory Size | 64 KB (64K x 8) Flash |
| Program Memory Type | Flash, programmable |
| 電源電圧 | 3.3 V (3 V to 3.6 V) |
| Core Technology | CMOS |
| パッケージ | 64-TQFP (10x10 mm), 0.5 mm pitch |
| 実装タイプ | Surface Mount |
| 動作温度 | -40C to +85C (I grade) |
| DSP Engine | Yes (barrel shifter, DSP multiply-accumulate support) |
| Boundary Scan | Yes |
| Programming Interface | ICSP (In-Circuit Serial Programming) |
| Debugging Support | In-circuit debugging (2 device I/O pins + reset, e.g. MPLAB SNAP) |
| Toolchain | MPLAB XC-DSC C/C++ Compiler |
| Migration Path | PIC24F/PIC24H MCUs and dsPIC30F DSCs in similar packages |
DSPIC33FJ64GP706A-I/PT 64-tqfp (10x10 mm), 0.5 mm pitch ピン配置ガイド
DSPIC33FJ64GP706A-I/PT (64-tqfp (10x10 mm), 0.5 mm pitch パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: DSPIC33FJ64GP706A-I/PT.
詳細は データシート をご参照ください。
主な用途
DSPIC33FJ64GP706A-I/PT の用途: 6 件s: Digital Power Conversion, Motor Control (BLDC/PMSM), Sensor Signal Conditioning and DSP Filtering, Industrial Networking Nodes, Portable Test and Measurement Instruments, Embedded Audio and Signal Processing.
Digital Power Conversion
The DSPIC33FJ64GP706A-I/PT fits digital power conversion (PFC stages, LLC resonant converters, solar micro-inverters) because its 40 MIPS 16-bit core with single-cycle DSP multiply-accumulate can close current-mode control loops at switching frequencies in the tens to hundreds of kilohertz. The barrel shifter accelerates gain scheduling and scaling, while 64KB Flash holds compensation tables and soft-start state machines. Placed as the primary supervisory and modulating controller, it drives gate-control logic through its PWM-capable peripherals and communicates with a host via UART/SPI. Compared with an analog controller, it adds programmability and adaptive compensation; the trade-off is needing careful loop-latency budgeting in firmware.
おすすめ
Motor Control (BLDC/PMSM)
Sensorless BLDC and PMSM drives benefit directly from the DSPIC33FJ64GP706A-I/PT's 40 MIPS throughput and DSP engine: field-oriented control inner loops execute deterministically, and the barrel shifter speeds Clarke/Park transform scaling. The 3.3V supply pairs cleanly with gate-driver ICs, and 64KB Flash stores commutation tables plus fault handling. The controller outputs complementary PWM to the inverter stage and reads current-sense amplifiers on its analog-capable pins; boundary-scan support aids production test of the drive board. The trade-off versus a dedicated MC-series dsPIC33FJ is fewer motor-specific PWM/ADC features, so complex multi-axis drives should evaluate DSPIC33FJ32MC204 or similar.
おすすめ
Sensor Signal Conditioning and DSP Filtering
The DSPIC33FJ64GP706A-I/PT serves as a smart sensor front end: 40 MIPS performance runs FIR/IIR filters and FFTs on sampled analog inputs, converting raw transducer signals into calibrated engineering units. Its dual operand fetch and multiply-accumulate unit make it far faster at fixed-point DSP than a conventional 8-bit MCU, while 64KB Flash retains calibration coefficients and communication stacks. It interfaces with ADCs over SPI and streams results via UART or I2C to a host. Using it between the analog front end and the system bus offloads filtering from the host processor; the design consideration is sizing the 3.3V rail for peak DSP current during sustained filter execution.
おすすめ
Industrial Networking Nodes
In industrial automation nodes (remote I/O, actuators, condition-monitoring points), the DSPIC33FJ64GP706A-I/PT combines control processing with communication: its UART, SPI, and I2C peripherals link to RS-485 transceivers, CAN-capable companions, or isolated interfaces, while boundary-scan simplifies board-level test during manufacturing. The industrial -40C to +85C temperature grade matches cabinet and factory-floor environments, and the 40 MIPS core handles protocol framing plus local closed-loop control simultaneously. Using ICSP, firmware updates and field programming are performed in-circuit through a standard 8-pin SIL connector with MPLAB SNAP, reducing maintenance cost across deployed fleets.
おすすめ
Portable Test and Measurement Instruments
Handheld meters and bench instruments use the DSPIC33FJ64GP706A-I/PT as the acquisition and computation engine: 40 MIPS with DSP support enables true-RMS computation, harmonic analysis, and trigger logic, while 64KB Flash stores firmware, calibration data, and menus. The 10x10 mm 64-TQFP balances pin count against board area for compact instruments, and the low-risk 3.3V domain simplifies battery-powered design. Signals are conditioned ahead of its analog-capable inputs or an external ADC over SPI, and results drive a display via SPI/parallel GPIO. Boundary-scan support and ICSP programming streamline both prototyping and production programming of instrument boards.
おすすめ
Embedded Audio and Signal Processing
The DSPIC33FJ64GP706A-I/PT can implement low-channel-count audio processing: 40 MIPS fixed-point multiply-accumulate supports sample rates up to roughly 48 kHz with several biquad filters, AGC, or tone generation per channel. It pairs with an audio codec over I2C/SPI, handling control plus the processing loop, while 64KB Flash holds coefficient tables and boot logic. This makes it attractive for cost-sensitive intercoms, paging systems, and simple effects units where a full DSP is overkill. The key design limit is MIPS budgeting - a complex processing chain consumes most of the 40 MIPS, so larger-channel-count designs should step up to a higher-memory dsPIC33FJ member in the same package family.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: DSPIC33FJ64GP706A-I/PT — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | DSPIC33FJ64GP706A-E/PT | DSPIC33FJ64GP206A-E/PT | DSPIC33FJ256GP506A-E/PT | DSPIC33FJ128GP706A-I/PT |
|---|---|---|---|---|---|
| Package | 64-TQFP (10x10 mm) | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 64 KB | 64 KB | 64 KB | 256 KB | 128 KB |
| CPU Speed | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS |
| Core Width | 16-bit | 16-bit | 16-bit | 16-bit | 16-bit |
| Operating Temperature | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) | -40C to +85C (I) |
| Supply Voltage | 3.3 V (3 V to 3.6 V) | 3.3 V (3 V to 3.6 V) | 3.3 V (3 V to 3.6 V) | 3.3 V (3 V to 3.6 V) | 3.3 V (3 V to 3.6 V) |
| Toolchain | MPLAB XC-DSC / MPLAB X | MPLAB XC-DSC / MPLAB X | MPLAB XC-DSC / MPLAB X | MPLAB XC-DSC / MPLAB X | MPLAB XC-DSC / MPLAB X |
主な差別化要因
- Extended temperature headroom option in the same footprint （vs DSPIC33FJ64GP706A-E/PT)
- Flash upgrade path without footprint change （vs DSPIC33FJ128GP706A-I/PT)
- Balanced peripheral mix vs motor-control-optimized parts （vs DSPIC33FJ32MC204-I/ML)
設計ノート
Supply the DSPIC33FJ64GP706A-I/PT from a regulated 3.3V rail within the 3.0V to 3.6V operating window. Place a 0.1uF ceramic decoupling capacitor at each VDD/VSS pin pair plus one bulk 4.7uF to 10uF capacitor near the device; keep the high-frequency loop short because the 40 MIPS core and DSP engine create fast current transients. Follow the decoupling pattern in the dsPIC33FJ family datasheet typical application section rather than improvising, and verify all VDD pins are connected - floating supply pins on 64-TQFP devices are a common bring-up failure.
Use a solid ground plane under the 10x10 mm TQFP and route the ICSP programming pins (PGD/PGC plus MCLR) to a standard 8-pin SIL header so MPLAB SNAP can program and debug in-circuit, as described on Microchip's product page. Keep crystal routing short and symmetric if an external oscillator is used. Avoid running switching-regulator nodes under the device; digital power applications should separate the PWM/gate-driver routing from the analog-capable pins on the opposite package side to minimize coupling into measurement channels.
Confirm your MPLAB XC-DSC project targets the A-silicon revision of the dsPIC33FJ64GP706A - the 'A' suffix denotes a revised die and Microchip publishes family errata that may affect specific peripherals. Check the current errata before freezing firmware. Also remember that most of the 64 pins are multiplexed: lock your peripheral-to-pin allocation early with the pin-multiplexing tables in the family datasheet, because a late change can force a PCB respin. Do not exceed 3.6V on any supply pin, and observe MCLR voltage constraints during programming.
Estimated: at 40 MIPS the dsPIC33FJ core typically dissipates well under 0.5W at 3.3V in active mode, so a 64-TQFP on a standard four-layer or even two-layer PCB with a ground plane needs no heatsink. Verify against the family datasheet current-consumption tables for your actual clock configuration and peripheral loading - enabling all peripherals and running from the internal fast RC at maximum frequency is the worst case for supply current, not the external-oscillator case.
コンプライアンス情報
The /PT package suffix indicates lead-free matte-tin plating. Exact RoHS/REACH certificates were not present in the verified web data; obtain Microchip's product compliance documentation for formal confirmation.
