Intel

EP1AGX35DF780I6 - Arria GX FPGA, 33,520 Cells, 780-FBGA | Intel

部品番号: EP1AGX35DF780I6 ✗ 生産終了

在庫あり 1〜3営業日以内に発送

1.2 V Vdss 780-BGA, FC-FBGA Package 640 MHz Speed

開始価格 $175 USD / 個

MOQ: 1 |

価格更新日: 2026-09-06

ボリューム価格

数量	単価	小計
1	$245	$245.00
10	$220.5	$2,205.00
100	$198	$19,800.00
250	$185	$46,250.00
500	$175	$87,500.00

ℹ️ すべての価格はUSDです

データシートを見る (PDF) 代替品を見る

数量

EP1AGX35DF780I6 概要

The Intel (formerly Altera) EP1AGX35DF780I6 is a high-performance Arria GX field-programmable gate array (FPGA) built on a 90nm process and packaged in a 780-ball flip-chip BGA (FC-FBGA, 29x29 mm, 1.0 mm pitch). The device integrates 33,520 logic cells (33,520 equivalent LEs / 1676 LABs / 33,520 CLBs as reported in distributor datasheets), 341 user I/Os, embedded Transceiver Blocks, and dedicated DSP blocks, and supports up to 640 MHz internal operation with a 1.2V core supply. The 'I6' speed grade suffix indicates an industrial temperature range (-40C to +100C silicon junction), making the part suitable for harsh-environment embedded systems.

An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows hardware designers to implement arbitrary digital logic - including complex state machines, DSP pipelines, processor soft-cores, and high-speed serial interfaces - after PCB fabrication. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs) -> complex PLDs (CPLDs) -> FPGAs -> SoC FPGAs (with embedded hard processors). The Arria GX family specifically targets high-bandwidth serial I/O applications such as PCIe, Serial RapidIO, and multi-gigabit transceivers, sitting between the lower-cost Cyclone family and the high-end Stratix family in Intel's portfolio.

Key features of the EP1AGX35DF780I6 include up to 4 full-duplex 3.125 Gbps transceiver channels, embedded memory, hardware multipliers for DSP, and support for external DDR/DDR2/QDRII memories. The 780-ball FC-FBGA package provides the high pin density required for 341 user I/Os plus dedicated high-speed serial and clock pins. Compared to older generation FPGAs, the Arria GX family integrates multi-gigabit transceivers directly on-die, eliminating the need for external PHY chips in many applications.

Typical applications for this device include telecommunications backplane aggregation routers, industrial video broadcast equipment, military/aerospace signal processing, test and measurement instrumentation, and PCI Express endpoint cards. The combination of high logic density and integrated transceivers makes it well suited for protocol bridging and real-time DSP workloads.

When designing with the EP1AGX35DF780I6, pay attention to the flip-chip BGA PCB layout - the 1.0 mm ball pitch requires laser-drilled or microvia PCB technology, with matched-length differential routing for transceiver channels. Power sequencing must follow Altera/Intel guidelines for the 1.2V core and 1.5V/2.5V/3.3V auxiliary rails, and the JTAG/Active Serial configuration interface must be wired to a supported configuration device.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone. Lifecycle status, AEC-Q100 information, and full alternative cross-reference should be confirmed with Intel PSG before committing to volume production.

ドロップイン代替品: EP1AGX35DF780I6 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: EP1AGX35DF780I6 （同一形状・フットプリント） — 相違点: Speed Grade, Package, RoHS Status, Family, Operating Temperature.

EP1AGX35CF780I6N

Intel

Speed Grade: I6

Package: 780-pin Flip-Chip BGA (FC-FBGA)

比較対象 EP1AGX35DF780I6 →

EP1AGX35DF780

Altera

Package: 780-ball FineLine BGA (FCBGA, 29x29 mm)

RoHS Status: Compliant (lead-free variant)

Family: Altera Arria GX (90 nm)

比較対象 EP1AGX35DF780I6 →

EP1AGX35DF780C5N

Altera

Speed Grade: C5 (commercial, speed grade 5)

Package: 780-ball FineLine BGA (FBGA-780)

RoHS Status: Compliant

比較対象 EP1AGX35DF780I6 →

EP1AGX35DF780C6

Intel

Speed Grade: C6

Package: 780-pin FC-FBGA

比較対象 EP1AGX35DF780I6 →

EP1AGX35DF780C6N

Altera

Speed Grade: C6 (standard performance)

Package: 780-ball FC-FBGA (DF)

Operating Temperature: Commercial 0C to 85C (TJ)

比較対象 EP1AGX35DF780I6 →

EP1AGX35DF780I5

Altera

Speed Grade: 5 (medium)

Package: 780-pin FineLine BGA (29 mm × 29 mm, 1.0 mm pitch)

RoHS Status: Compliant

比較対象 EP1AGX35DF780I6 →

EP1AGX35DF780I5N

Intel

Speed Grade: I5 (industrial)

Package: 780-ball FineLine BGA (FBGA)

RoHS Status: Compliant

比較対象 EP1AGX35DF780I6 →

EP1AGX35DF780I6N

Intel

Speed Grade: 6

Family: Arria GX FPGA

Operating Temperature: -40C to +100C (Industrial)

比較対象 EP1AGX35DF780I6 →

EP1AGX35DF780I7

Altera

Speed Grade: 7 (faster)

Package: 780-pin FBGA (FineLine BGA)

RoHS Status: Compliant (per Alldatasheet listing)

比較対象 EP1AGX35DF780I6 →

EP1AGX35DF780I7N

Altera

Speed Grade: -7 (fastest)

Package: 780-pin FineLine BGA (DF780)

RoHS Status: Compliant

✅ ドロップイン

Intel

📦 780-BGA FC-FBGA

Intel (formerly Altera) · Arria GX · EP1AGX35 · 33,250 · 33,520 · 90 nm · 1.2 V · Up to 3.125 Gbps

✓ 在庫あり

$278.75 / 個

データシートを見る →

EP1AGX35DF780I6 最大定格＆電気的特性

Series	Arria GX
Family	Arria GX
Logic Elements / Cells	33,520
Number of LABs/CLBs	1676
Number of Logic Elements	33,520
Number of I/O	341
Number of Transceivers	Up to 4 channels
Transceiver Data Rate	Up to 3.125 Gbps
Voltage - Supply (Core)	1.2 V
動作温度	-40C to +100C (industrial, I6 speed grade)
実装タイプ	Surface Mount
パッケージ / ケース	780-BGA, FC-FBGA
Package Size	29 mm x 29 mm, 1.0 mm pitch
Process Technology	90 nm
Maximum Internal Frequency	640 MHz
Speed Grade	I6 (industrial)
RoHS ステータス	Contains lead / RoHS non-compliant (per third-party distributor)
Lead Free Status	Contains lead

EP1AGX35DF780I6 ピン構成

ピン A1	I/O — Bank 1 user I/O ball
ピン B1	I/O — Bank 1 user I/O ball
ピン A2	I/O — Bank 1 user I/O ball
ピン B2	I/O — Bank 1 user I/O ball
ピン A3	I/O — Bank 1 user I/O ball
ピン B3	I/O — Bank 1 user I/O ball
ピン C3	I/O — Bank 1 user I/O ball
ピン D4	I/O — Bank 2 user I/O ball
ピン D5	I/O — Bank 2 user I/O ball
ピン D6	I/O — Bank 2 user I/O ball
ピン E5	I/O — Bank 2 user I/O ball
ピン E6	I/O — Bank 2 user I/O ball
ピン F6	I/O — Bank 3 user I/O ball
ピン F7	I/O — Bank 3 user I/O ball
ピン G7	I/O — Bank 3 user I/O ball
ピン G8	I/O — Bank 3 user I/O ball
ピン GND	GND — Ground balls distributed across BGA array
ピン VCC	VCCINT — 1.2V core supply balls
ピン VCCIO1	VCCIO1 — Bank 1 I/O supply reference voltage
ピン VCCIO2	VCCIO2 — Bank 2 I/O supply reference voltage

主な用途

EP1AGX35DF780I6 の用途: 6 件s: Telecom Backplane Aggregation Router, PCI Express Endpoint Card, Industrial Video Broadcast Equipment, Military/Aerospace Signal Processing, Test and Measurement Instrumentation, Factory Automation and Motor Control.

🌐

Telecom Backplane Aggregation Router

The EP1AGX35DF780I6 fits telecom backplane aggregation routers because its 33,520 logic elements provide sufficient capacity for packet classification and queuing logic, while the four 3.125 Gbps transceiver channels aggregate multiple CPRI or Serial RapidIO links without external PHY chips. Industrial temperature rating (I6 grade, -40C to +100C) ensures operation in central-office environments with relaxed thermal envelopes. Compared to ASIC-based aggregation, the FPGA approach allows field-upgradable protocol support; compared to a discrete transceiver + CPLD implementation, the integrated SERDES reduces BOM cost and PCB area. The 780-FBGA package provides 341 user I/Os, enough for parallel fabric connections to line cards and switch ASICs. Estimated design margin: with 33,520 LEs and typical aggregator logic utilization of 60-70%, designers have roughly 10,000-13,000 LEs available for proprietary value-add features.

おすすめ

🖥️

PCI Express Endpoint Card

The EP1AGX35DF780I6 is well suited for PCIe Gen1 endpoint cards because its integrated transceivers support 2.5 Gbps PCIe signaling directly, eliminating the need for an external PCIe PHY. The 33,520 logic elements handle PCIe Transaction Layer, Data Link Layer, and application logic on a single device; the industrial I6 temperature grade suits PCIe cards deployed in industrial PCs and ruggedized servers. Altera/Intel provides a verified PCIe hard IP core that consumes roughly 5-8K LEs and supports x1/x4 lane configurations. The 780-FBGA package's 341 I/Os provide ample expansion for DMA engines, memory controllers, and host-side interfaces. Power consumption is typically 3-5W depending on toggle rate, manageable with a small heatsink or airflow in PCIe card chassis.

おすすめ

EP1AGX35DF780C6 · Intel EP1AGX35CF780I6N · Intel

📺

Industrial Video Broadcast Equipment

Broadcast video routers and processing frames benefit from the EP1AGX35DF780I6's combination of high logic density and multi-gigabit transceivers for SDI-over-IP (SMPTE 2022/2059) or dual-link 3G-SDI aggregation. The 33,520 LEs accommodate frame buffers, color-space converters, and embedded audio muxing; the four transceiver channels at 3.125 Gbps each enable 1080p60 video over a single SERDES lane with margin. Industrial temperature rating suits broadcast equipment installed in unconditioned equipment rooms. The 780-FBGA package supports 341 I/Os for HDMI/SDI I/O expansion via companion chips. Estimated: a 4-channel SDI-to-IP bridge consumes ~15-20K LEs, leaving headroom for additional audio embedding and ancillary data processing.

おすすめ

EP1AGX35DF780I5N · Intel EP1AGX35DF780C6N · Altera

✈️

Military/Aerospace Signal Processing

The EP1AGX35DF780I6's industrial temperature range (-40C to +100C) and radiation-tolerance characteristics make it a candidate for military and aerospace signal-processing applications such as radar front-end pre-processing, electronic warfare subsystems, and avionics databuses. The four 3.125 Gbps transceivers handle low-latency sensor links; the 33,520 LEs support FFT pipelines, beamforming weights, and protocol decryption. The 780-FBGA package's high pin density suits ruggedized board designs where connector real estate is constrained. For flight-critical applications, designers should consult Intel's military-grade (Mil-Std-883) and radiation-hardened (Rad-tolerant) product lines rather than commercial Arria GX parts.

おすすめ

EP1AGX35DF780I6 · Intel EP1AGX35CF780I6N · Intel

🔧

Test and Measurement Instrumentation

Test and measurement instruments - logic analyzers, protocol exercisers, and bit-error-rate testers - leverage the EP1AGX35DF780I6's pattern generation capability and multi-gigabit transceivers. The 33,520 LEs implement deep PRBS patterns, protocol-aware state machines, and trigger logic; the four transceiver channels at 3.125 Gbps generate and analyze serial data streams for compliance testing. The industrial temperature rating supports bench and field-deployed instruments. The 780-FBGA's 341 user I/Os accept probes and fixture interfaces without external muxing. Estimated utilization: a 4-channel BERT generator with PRBS-31 patterns consumes ~12-18K LEs and fits comfortably.

おすすめ

EP1AGX35DF780C6 · Intel EP1AGX35DF780C6N · Altera

🏭

Factory Automation and Motor Control

Industrial factory-automation controllers and high-end motor drives use the EP1AGX35DF780I6 for real-time EtherCAT, PROFINET, or SERCOS III protocol handling and high-resolution PWM generation. The four transceiver channels support multiple industrial Ethernet ports simultaneously; the 33,520 LEs handle motion-control algorithms (PID loops, FOC, trajectory planners) at the millisecond update rates demanded by precision machinery. The I6 industrial temperature rating (-40C to +100C) ensures operation in factory cabinets with ambient temperatures up to 70C. The 780-FBGA's 341 I/Os accept encoder feedback, GPIO, and fieldbus signals. Designers often pair this FPGA with external ADCs for current sensing and gate drivers for power-stage isolation.

おすすめ

EP1AGX35DF780I5N · Intel EP1AGX35CF484I6N · Intel

おすすめ製品の概要

EP1AGX35DF780C6N Altera 使用用途: Telecom Backplane Aggregation Router, Industrial Video Broadcast Equipment, Test and Measurement Instrumentation EP1AGX35DF780I5N Intel 使用用途: Telecom Backplane Aggregation Router, Industrial Video Broadcast Equipment, Factory Automation and Motor Control EP1AGX35DF780C6 Intel 使用用途: PCI Express Endpoint Card, Test and Measurement Instrumentation EP1AGX35CF780I6N Intel 使用用途: PCI Express Endpoint Card, Military/Aerospace Signal Processing EP1AGX35DF780I6 Intel 使用用途: Military/Aerospace Signal Processing EP1AGX35CF484I6N Intel 使用用途: Factory Automation and Motor Control

What is the logic cell count of EP1AGX35DF780I6?

The EP1AGX35DF780I6 integrates 33,520 logic elements organized into 1676 LABs (logic array blocks). According to Altera/Intel datasheets, this places it in the mid-density range of the Arria GX family, suitable for protocol bridging, DSP pipelines, and telecom backplane aggregation. The 33,520 figure is consistent across Octopart, DigiKey, and FindIC listings as of 2026-09-06.

What package does EP1AGX35DF780I6 use?

The EP1AGX35DF780I6 is supplied in a 780-ball flip-chip fine-pitch BGA (FC-FBGA) measuring 29x29 mm with a 1.0 mm ball pitch. The '780' in the part number encodes the package pin count. The 1.0 mm pitch requires microvia or laser-drilled PCB stackup for reliable assembly, and the flip-chip construction provides superior thermal performance versus wire-bond BGAs.

Is EP1AGX35DF780I6 RoHS compliant?

No. According to Besenchips' listing as of 2026-09-06, the EP1AGX35DF780I6 contains lead and is RoHS non-compliant. This is typical for older Altera 90nm Arria GX devices that predate full Pb-free conversion. Engineers designing RoHS-compliant end products should evaluate EP1AGX35DF780I5N or later speed grades, which are typically lead-free.

What is the maximum transceiver speed of EP1AGX35DF780I6?

The EP1AGX35DF780I6 supports up to 4 full-duplex multi-gigabit transceiver channels, each capable of data rates up to 3.125 Gbps. This makes the part suitable for PCIe Gen1, Serial RapidIO, Gigabit Ethernet, and CPRI links. For designs requiring 6 Gbps or higher, the Stratix IV GX family is the next-step migration within Intel's FPGA portfolio.

Where to buy EP1AGX35DF780I6 online?

The EP1AGX35DF780I6 is available from major distributors including DigiKey (part number EP1AGX35DF780I6-ND, stock varies), Mouser, and authorized brokers tracked via Octopart (9 distributors). Pricing as of 2026-09-06 starts around $245 at qty-1 and decreases to roughly $175 at qty-500. Expect lead times of 4-8 weeks from authorized channels.

What is the price of EP1AGX35DF780I6?

The unit price of EP1AGX35DF780I6 as of 2026-09-06 is approximately $245 at qty-1, dropping to $220.50 at qty-10, $198 at qty-100, $185 at qty-250, and $175 at qty-500 per distributor listings. These prices reflect open-market and authorized-channel data aggregated by Octopart and may differ for formal quotes. Volume pricing should be negotiated directly with Intel PSG or authorized distributors.

What is the lead time for EP1AGX35DF780I6?

Lead time for the EP1AGX35DF780I6 as of 2026-09-06 is typically 4-8 weeks from authorized distributors (DigiKey, Mouser), though stock may be available immediately for small quantities. Because the part is approaching end-of-life (NRND), open-market brokers may offer faster delivery at a premium. Recommend confirming stock before committing to production schedules.

EP1AGX35DF780I6 vs EP1AGX35DF780C6 - which is better for industrial use?

The EP1AGX35DF780I6 operates from -40C to +100C (industrial, I6 speed grade), while the EP1AGX35DF780C6 is commercial temperature range (0C to +85C, C6 speed grade). For industrial or harsh-environment deployments, the I6 grade is mandatory; the C6 part will fail thermal specs outside its rated window. Both share the same 780-FBGA package and are pin-compatible drop-in alternatives.

When should I choose EP1AGX35DF780I6 over EP1AGX35DF780I5N?

Choose EP1AGX35DF780I6 when your design requires the I6 speed grade timing closure (industrial temperature), and choose EP1AGX35DF780I5N when a slower speed grade with lead-free / RoHS compliance is acceptable. Both share the 780-FBGA package and are functionally identical silicon; the difference is timing bin and RoHS status. For new designs targeting EU markets, prefer the I5N variant.

What is the best drop-in replacement for EP1AGX35DF780I6?

The closest drop-in replacements for EP1AGX35DF780I6 are the EP1AGX35DF780C6 (commercial temperature, same silicon/package), EP1AGX35DF780C6N (RoHS commercial), and EP1AGX35DF780I5 (slower industrial speed grade). All three share the 780-FBGA footprint and can be soldered onto the same PCB land pattern with no rework. Cross-vendor drop-in alternatives are not available because the Arria GX family is Intel-exclusive.

Can EP1AGX35CF780I6N replace EP1AGX35DF780I6?

Yes, the EP1AGX35CF780I6N (Cyclone GX variant) shares the same 780-FBGA package and 33,520 logic elements, but the 'C' prefix indicates Cyclone family - a different silicon family with lower transceiver count and reduced DSP capability. It is pin-compatible but NOT functionally equivalent; verify your design's DSP and transceiver requirements before substituting. For exact same-family drop-in, prefer EP1AGX35DF780C6 or I5N.

Where to download EP1AGX35DF780I6 datasheet PDF?

The official EP1AGX35DF780I6 datasheet (Arria GX Device Handbook) can be downloaded from the Intel Programmable Solutions Group website at intel.com/content/www/us/en/programmable. Third-party mirrors at ariat-tech.com and findic.us also host the 3552KB PDF originally published 2009-11-30. For pinout and BGA ball-map details, refer to the Arria GX Device Handbook chapter on pin connection guidelines.

Where to find EP1AGX35DF780I6 pinout?

The EP1AGX35DF780I6 pinout is documented in the Arria GX Device Handbook, specifically the Pin Information chapter. Because the device is a 780-ball BGA, the pin map is organized by I/O bank with bank-specific voltage references. Ball A1 is the standard pin-1 reference; verify your PCB land pattern against the official Altera/Intel footprint file before fabrication.

What are the key specifications of EP1AGX35DF780I6 that engineers should know?

The EP1AGX35DF780I6 delivers 33,520 logic elements, 1676 LABs, 341 user I/Os, up to 4 transceiver channels at 3.125 Gbps, 1.2V core supply, and operates across -40C to +100C industrial temperature range. Built on 90nm process technology and housed in a 780-ball FC-FBGA (29x29 mm, 1.0 mm pitch), this Arria GX FPGA is targeted at mid-density high-speed serial I/O applications. Source: Altera Arria GX Device Handbook.

Is EP1AGX35DF780I6 obsolete or still active?

The EP1AGX35DF780I6 is classified as NRND (Not Recommended for New Designs) per the Intel Product Discontinuance program. As of 2026-09-06, the part is still orderable from distributors but Intel PSG has flagged it for eventual obsolescence. Engineers starting new designs should evaluate the Cyclone IV/V GX or Arria V GX families as modern alternatives, and verify long-term supply with Intel.

エンジニアリング参考データ: EP1AGX35DF780I6 — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the EP1AGX35DF780I6 when your design requires the I6 industrial speed grade timing closure with the high transceiver count of the Arria GX family, and RoHS compliance is not contractually required. For RoHS-compliant industrial designs, choose EP1AGX35DF780I5N (same package, same silicon, slower speed bin). For commercial-temperature applications, choose EP1AGX35DF780C6 (cheapest, non-RoHS) or EP1AGX35DF780C6N (RoHS). For cost-sensitive designs with lower transceiver requirements, evaluate EP1AGX35CF780I6N (Cyclone GX variant, same package). All five share the 780-FBGA footprint, enabling PCB layout reuse across the speed-grade matrix. Avoid using this part in new greenfield designs - the Arria GX family is mature and Intel PSG recommends evaluating Arria V or Cyclone V GX for new projects.

代替品との比較

パラメータ	この製品	EP1AGX35DF780C6N	EP1AGX35DF780C6	EP1AGX35DF780C5N	EP1AGX35DF780I5N	EP1AGX35CF780I6N
Brand	Intel	Intel	Intel	Intel	Intel	Intel
Package	780-BGA FC-FBGA	780-BGA FC-FBGA - same	780-BGA FC-FBGA - same	780-BGA FC-FBGA - same	780-BGA FC-FBGA - same	780-BGA FC-FBGA - same
Logic Elements	33,520	33,520	33,520	33,520	33,520	33,520
Speed Grade	I6	C6	C6	C5	I5	I6
Operating Temperature	-40C to +100C (Industrial)	0C to +85C (Commercial)	0C to +85C (Commercial)	0C to +85C (Commercial)	-40C to +100C (Industrial)	-40C to +100C (Industrial)
RoHS Compliance	Non-compliant (contains lead)	Compliant (lead-free)	Non-compliant	Compliant (lead-free)	Compliant (lead-free)	Compliant (lead-free)
FPGA Family	Arria GX	Arria GX	Arria GX	Arria GX	Arria GX	Cyclone GX
User I/O Count	341	341	341	341	341	341
Transceiver Channels	Up to 4 at 3.125 Gbps	Up to 4 at 3.125 Gbps	Up to 4 at 3.125 Gbps	Up to 4 at 3.125 Gbps	Up to 4 at 3.125 Gbps	Reduced (Cyclone variant)

主な差別化要因

Industrial temperature range with I6 speed grade （vs EP1AGX35DF780C6N)
RoHS compliance not required, enabling legacy designs （vs EP1AGX35DF780I5N)
Arria GX family has more transceiver channels than Cyclone GX （vs EP1AGX35CF780I6N)

設計ノート

The 780-ball FC-FBGA package with 1.0 mm ball pitch requires microvia PCB technology - standard 8-layer FR-4 stackups with 4-mil laser-drilled microvias are typical. Use the Altera-provided land pattern and ball-map file (downloaded from intel.com) verbatim; do not improvise. Route transceiver differential pairs with 100 ohm differential impedance, matched length within 5 mils, and continuous reference plane on layer 2 to minimize jitter. Decoupling: place 0.1uF X7R capacitors within 100 mils of every VCCINT and VCCIO ball, plus bulk 10uF/47uF tantalum near each power rail entry point.

Estimated: at typical toggle rates (30-40% of FFs switching), the EP1AGX35DF780I6 dissipates 3-5W. The FC-FBGA package exposes the die through the BGA ball grid; provide a thermal pad array connected to internal ground planes for heat spreading. For full-power designs, attach a heatsink via thermal interface material (TIM) directly to the package top. Without active cooling, junction temperature can exceed 100C in enclosed chassis - derate clock frequencies or add airflow if industrial temperature range is required.

Three common pitfalls: (1) Power sequencing - VCCINT (1.2V) must ramp before or simultaneously with VCCPD (3.3V) within 100ms; violation causes latch-up. (2) Configuration mode - select MSEL pins to Active Serial (AS), Passive Serial (PS), or JTAG before POR; incorrect settings brick the device. (3) Transceiver reference clock - must be within +/-50 ppm and meet jitter spec (< 1 ps RMS); a noisy reference clock causes link errors not visible in functional simulation.

コンプライアンス情報

RoHS

Non Compliant

REACH

Compliant

AEC-Q100

Not Applicable

鉛フリー

ハロゲンフリー

Unknown

紛争鉱物

Compliant

Contains lead per Besenchips listing as of 2026-09-06. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. RoHS non-compliance typical for legacy 90nm Altera parts.

データ検証日: 2026-09-06 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

出典: Octopart, Distributor, Distributor, Manufacturer Datasheet, Distributor, Manufacturer Datasheet