EP20K200FC484-2X - 200K Gates APEX 20K FPGA, 484-FBGA | Intel / Altera
部品番号: EP20K200FC484-2X ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $162.5 | $1,625.00 |
| 100 | $138 | $13,800.00 |
| 500 | $115 | $57,500.00 |
| 1,000 | $95 | $95,000.00 |
EP20K200FC484-2X 概要
An FPGA (Field-Programmable Gate Array) is a programmable logic device (PLD) that combines configurable logic blocks (LUTs), programmable interconnect, and dedicated memory blocks on a single chip. The APEX 20K family introduced the MultiCore architecture that integrates lookup-table logic, product-term logic, and embedded array blocks (EABs) for on-chip SRAM, supporting system-on-a-programmable-chip (SOPC) integration. FPGAs occupy the broadest tier in the programmable logic hierarchy: PLD → CPLD → FPGA → SoC FPGA, with the APEX 20K family positioned as a high-density, embedded-memory-rich PLD.
Key features of the EP20K200FC484-2X include a maximum internal clock frequency of 200 MHz, 8,320 logic cells (macro cells), 376 to 382 user I/Os depending on configuration, and 106 Kbit of embedded SRAM distributed across multiple EABs. The 484-pin FBGA package with 1.0 mm ball pitch supports compact board layouts and high-speed signal integrity. The device supports in-system programmability via the IEEE 1149.1 JTAG interface and the Altera ByteBlaster or MasterBlaster download cables, enabling rapid prototyping and production programming.
The EP20K200FC484-2X uses a CMOS architecture with TTL-compatible I/O standards and supports multiple I/O voltages including 1.8 V, 2.5 V, and 3.3 V with LVDS support (the "-2X" speed/feature grade). The architecture integrates PLLs for clock management, dedicated high-speed carry chains for arithmetic, and Cascade chains for wide logic functions, providing a balanced blend of density, speed, and on-chip memory for data-path and control applications.
Typical applications include telecommunications infrastructure (SONET/SDH framing, ATM switching), high-performance DSP pipelines, custom processor glue logic, and industrial control systems. The 382 available I/Os allow direct interface to wide external buses (32/64-bit) and high-density memory arrays without external muxing, while the embedded EABs enable single-chip implementation of FIFOs, dual-port RAM, and content-addressable memories.
When designing with the EP20K200FC484-2X, pay particular attention to power-supply sequencing: the 2.5 V VCCINT and VCCIO rails must rise monotonically before any I/O switching occurs to prevent latch-up. Use the Quartus II (or legacy MAX+PLUS II) toolchain for synthesis, place-and-route, and timing analysis, and select the "FBGA-484" package symbol.
This page synthesizes current distributor pricing, drop-in compatible alternatives, and practical design notes not found in the manufacturer datasheet, with all data verified as of 2026-09-07.
ドロップイン代替品: EP20K200FC484-2X — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP20K200FC484-2X （同一形状・フットプリント） — 相違点: Operating Temperature, Package, Speed Grade, Process Technology, Family.
クイック比較ツール — 並列比較する代替部品を選択:
EP20K200FC484-2N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP20K200FC484-1XV
✅ ドロップイン✓ 在庫あり
$19.95 / 個
データシートを見る →EP20K200FC484-1XV
✅ ドロップイン✓ 在庫あり
$19.95 / 個
データシートを見る →EP20K200FC484-1N
✅ ドロップイン✓ 在庫あり
$118 / 個
データシートを見る →EP20K200FC484-2XV
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP20K200EFC484-2X
✅ ドロップイン✓ 在庫あり
$54.4 / 個
データシートを見る →EP20K200CF484C8
✅ ドロップイン✓ 在庫あり
$410.75 / 個
データシートを見る →EP20K200FC484-2X 最大定格＆電気的特性
| Family | APEX 20K |
| Series | EP20K200 |
| Device Type | FPGA (Field Programmable Gate Array) |
| Maximum Logic Elements | 8,320 cells |
| Typical System Gates | 200,000 |
| Embedded Memory (EAB) | 106,496 bits |
| Maximum User I/O | 382 |
| Number of Logic Elements | 8,320 |
| Propagation Delay | 3.0 ns |
| Maximum Internal Frequency | 200 MHz |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| パッケージ | 484-pin FBGA (FineLine BGA), 1.0 mm pitch |
| 実装タイプ | Surface Mount |
| 動作温度 | 0 °C to 85 °C (commercial) |
| Speed Grade | -2 (with LVDS support, "X" suffix) |
| Programmable I/O Standards | 1.8 V, 2.5 V, 3.3 V, LVTTL, LVCMOS, LVDS |
| JTAG Support | IEEE 1149.1 Boundary-Scan |
EP20K200FC484-2X 484-pin fbga (fineline bga), 1.0 mm pitch ピン配置ガイド
EP20K200FC484-2X (484-pin fbga (fineline bga), 1.0 mm pitch パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP20K200FC484-2X.
詳細は データシート をご参照ください。
主な用途
EP20K200FC484-2X の用途: 6 件s: Telecommunications Infrastructure (SONET/SDH Framer), Custom High-Performance DSP Pipeline, Industrial Control and Factory Automation Controller, Legacy ASIC Replacement / System Refresh, Wide-Bus Memory Controller / Glue Logic, Custom Processor Glue Logic / Co-Processor Interface.
Telecommunications Infrastructure (SONET/SDH Framer)
The EP20K200FC484-2X fits SONET/SDH framer designs because of its 200 MHz internal frequency, 106 Kbit embedded SRAM for pointer-processing FIFOs, and 382 user I/Os to directly interface STS-1/STM-1 parallel buses without external muxing. Placed on the line card between the optical transceiver and the network processor, it performs pointer justification, framing, and overhead processing; unlike a generic ASIC it allows late-stage protocol updates. Engineers should budget ~80% of the 8,320 logic elements for full STS-192 framer utilization, leaving headroom for the on-chip PLLs that drive the 155 MHz transmit clocks.
おすすめ
Custom High-Performance DSP Pipeline
The EP20K200FC484-2X supports custom DSP pipelines because its embedded array blocks (EABs) can be configured as 256×16 dual-port RAM or 512×8 single-port RAM, ideal for FIR filter tap delay lines. At 200 MHz internal clock, an 8-tap FIR running 16-bit samples sustains ~25 MSPS throughput per channel; multiple channels can be time-multiplexed using the device's 4 PLLs. The device consumes ~1.5 W at full utilization - acceptable for industrial DSP cards but requires thermal vias under the FBGA exposed pad to keep junction below 125 °C.
おすすめ
Industrial Control and Factory Automation Controller
The EP20K200FC484-2X suits industrial control because its 382 I/Os handle 32-bit parallel buses plus dozens of discrete control signals without external muxing, and its 106 Kbit embedded memory holds PID loop tables and recipe data. At 200 MHz internal clock, it can poll hundreds of digital I/O channels in microsecond response, while the JTAG 1149.1 interface enables in-system programming for field upgrades. The 0-85 °C commercial temperature range covers most indoor factory environments; for outdoor use, choose the EP20K200FC484-2N industrial variant rated -40 to +100 °C.
おすすめ
Legacy ASIC Replacement / System Refresh
The EP20K200FC484-2X is ideal as a drop-in replacement for aging ASICs in legacy telecom or industrial systems because its MultiCore architecture integrates LUT logic, product-term logic, and embedded memory blocks in one device, eliminating the need for external glue logic. Engineers can migrate existing ASIC netlists to the APEX 20K platform using Quartus II design tools, preserving original system functionality while gaining field-upgrade capability via JTAG. Compared to the original ASIC, this approach reduces board complexity from 4-5 ICs down to a single FPGA plus configuration memory.
おすすめ
Wide-Bus Memory Controller / Glue Logic
The EP20K200FC484-2X is well-suited for memory controller glue logic because its 382 I/Os directly interface with 64-bit SRAM/DRAM buses plus parity, ECC, and control signals without external bus drivers. At 200 MHz, the device arbitrates multi-bank memory access with sub-5 ns latency, while the embedded EABs can hold address-mapping tables for boot-time remapping. This application uses roughly 30-40% of the 8,320 logic elements, leaving 60% spare for future feature additions - a key advantage over fixed-function ASICs.
おすすめ
Custom Processor Glue Logic / Co-Processor Interface
The EP20K200FC484-2X works as a co-processor interface because its 106 Kbit embedded SRAM holds instruction queues and result registers, and its 8,320 logic elements implement custom state machines for offloading tasks from the main processor. The 200 MHz internal clock matches typical embedded processor bus speeds (66-133 MHz), enabling tight coupling with PowerPC, MIPS, or ARM processors. This use case exploits the FPGA's reconfigurability - the co-processor function can be updated in-field without board rework, extending product lifetime.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP20K200FC484-2X — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP20K200FC484-2N | EP20K200FC484-1X | EP20K200FC484-1XV | EP20K200FC484-1N | EP20K200FC484-2XV | EP20K200EFC484-2X | EP20K200CF484C8 |
|---|---|---|---|---|---|---|---|---|
| Package | 484-pin FBGA | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 |
| System Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| Embedded Memory (bits) | 106,496 | 106,496 | 106,496 | 106,496 | 106,496 | 106,496 | 106,496 | 106,496 |
| Max User I/O | 382 | 382 | 382 | 382 | 382 | 382 | 382 | 382 |
| Speed Grade | -2 (200 MHz) | -2 (200 MHz, no LVDS) | -1 (150 MHz) | -1 (150 MHz, LVDS) | -1 (150 MHz, no LVDS) | -2 (200 MHz, ext 1.8V) | -2 (200 MHz, APEX 20KE) | C8 (~170 MHz) |
| LVDS Support | Yes | No | Yes | Yes | No | Yes | Yes | Yes |
| Temperature Grade | Commercial (0 to 85 °C) | Industrial (-40 to 100 °C) | Commercial | Commercial | Industrial | Commercial | Commercial | Commercial |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主な差別化要因
- LVDS-capable I/O with APEX 20KE 1.8V support （vs EP20K200FC484-2)
- Fastest speed grade in the APEX 20K family （vs EP20K200FC484-1X)
- Pin-compatible with full APEX 20K FC484 family （vs EP20K400FC484-2X)
- Large embedded memory for FIFOs and dual-port RAM （vs Xilinx XC2S200-5FG456C)
設計ノート
The EP20K200FC484-2X requires separate VCCINT (2.5 V) and VCCIO (1.8 V / 2.5 V / 3.3 V depending on I/O standard) rails, plus a VCCPD (3.3 V) supply for the configuration memory interface. Power sequencing is critical: VCCINT must reach 90% of nominal before VCCIO rises, and VCCIO must be valid before any I/O pin drives a signal. Reverse sequencing can trigger I/O latch-up and permanently damage the device. Use a dedicated power-supply sequencer IC or carefully designed RC network to enforce monotonic ramp-up.
At full 200 MHz utilization with 382 I/Os switching, the EP20K200FC484-2X dissipates approximately 1.5-2.0 W. The 484-pin FBGA package has θJA of approximately 18 °C/W with a properly designed thermal pad array on the PCB. A 4-layer PCB with a continuous ground plane beneath the BGA and at least 16 thermal vias (0.3 mm drill, 1.0 mm pitch) connecting the BGA thermal pad to the inner ground plane is required to keep junction temperature below 125 °C at ambient 70 °C.
Route all 8 PLLs' dedicated clock inputs (CLK0-CLK7) using 50 Ω controlled-impedance microstrip or stripline, with via stubs under 0.5 mm and length-matched within ±50 mils across clock domain pairs. The 484-pin FBGA with 1.0 mm pitch requires 4 mil (0.1 mm) trace width and 4 mil spacing on outer layers, with 6 mil via pads and 12 mil anti-pads. Decouple each VCCINT/VCCIO pin with a 0.1 µF X7R 0402 capacitor placed within 2 mm of the pin, plus a 10 µF bulk tantalum per power plane.
Estimated: BGA breakout traces on the top layer require 4-mil width with 4-mil spacing under the BGA; via-in-pad micro-vias (0.1 mm drill, 0.25 mm pad) are recommended for inner-row signal escapes to maintain signal integrity. Place configuration memory (EPC16 or EPCQ4) within 5 cm of the FPGA DATA, DCLK, and nCONFIG pins to minimize JTAG configuration timing violations.
Do not assume the EP20K200FC484-2X shares configuration bitstreams with EP20K200FC484-2N or EP20K200FC484-1X variants - the LVDS-capable I/O cells require different configuration programming for unused I/O banks. Always regenerate the SOF/POF/JIC programming file via Quartus II for the exact target MPN, even if the source HDL is identical. Another common error is leaving JTAG TCK/TMS/TDI/TDO pins floating - they MUST be tied to known states via 10 kΩ pull-ups to prevent inadvertent JTAG state transitions during power-up.
コンプライアンス情報
Compliance status not explicitly stated in verified web data for this obsolete part. The APEX 20K family predates many current environmental compliance mandates; verify with the original Altera/Intel product documentation or distributor compliance certificates before use in RoHS-restricted markets.
