EP20K60EFC324-3 - APEX 20KE 60K Gates 2560 Cells 324-FBGA | Intel
部品番号: EP20K60EFC324-3 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $82.5 | $825.00 |
| 100 | $71.2 | $7,120.00 |
| 250 | $64.8 | $16,200.00 |
| 500 | $58.4 | $29,200.00 |
EP20K60EFC324-3 概要
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells, all controlled by SRAM or fuse-based configuration memory. FPGAs sit hierarchically under programmable logic devices (PLDs), then complex programmable logic devices (CPLDs), and ultimately the broader category of digital logic ICs. The APEX 20KE family uses a MultiCore architecture that pairs logic elements with embedded array blocks (EABs) used as memory, ROM, or specialized arithmetic functions.
Key features include 2560 logic cells, 196 user I/O pins, an internal maximum frequency of 160 MHz, and 1.72 ns propagation delay. The device operates from a 1.8 V core supply with 0.22 µm CMOS process technology, delivering up to 182 MHz peak performance. It supports in-system programmability via the IEEE 1149.1 JTAG interface and is offered in a commercial 0°C to 85°C temperature grade. The 324-FBGA package measures 19×19 mm and uses a 1.0 mm ball pitch for high-density board integration.
The APEX 20KE architecture integrates up to 12 embedded system blocks (ESBs) that can each be configured as dual-port RAM, single-port RAM, ROM, or CAM, enabling true SOPC integration. Each logic element contains a 4-input LUT, a programmable register, and carry/chain logic for efficient arithmetic. The device supports LVTTL, LVCMOS, SSTL, and GTL+ I/O standards with slew-rate and drive-strength control, allowing flexible interfacing to memories, microprocessors, and ASICs.
Typical applications include telecommunications backplane interfacing, PCI bridge logic, high-speed data path conversion, and digital signal processing co-processors. The 60K-gate density is well-suited to multi-channel serial protocol bridging and image preprocessing pipelines.
When designing with the EP20K60EFC324-3, plan power sequencing for the 1.8 V VCCINT rail and the 3.3 V VCCIO rails separately. Use the JTAG port for boundary-scan test and in-field firmware updates. Configure unused I/O pins as tri-stated inputs with weak pull-ups to reduce quiescent current and improve signal integrity.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in a single manufacturer datasheet, giving engineers a faster path to part selection.
ドロップイン代替品: EP20K60EFC324-3 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP20K60EFC324-3 （同一形状・フットプリント） — 相違点: Operating Temperature, Package / Case, Total Gates, Series, Family.
クイック比較ツール — 並列比較する代替部品を選択:
EP20K60EFC324-2X
✅ ドロップイン✓ 在庫あり
$195.5 / 個
データシートを見る →EP20K60EFC324-2N
✅ ドロップイン✓ 在庫あり
$52.73 / 個
データシートを見る →EP20K60EFC324-2
✅ ドロップイン✓ 在庫あり
$41.75 / 個
データシートを見る →EP20K60EFC324-1X
✅ ドロップイン✓ 在庫あり
$198 / 個
データシートを見る →EP20K60EFC324-1
✅ ドロップイン✓ 在庫あり
$76.5 / 個
データシートを見る →EP20K60EFC324-1X
✅ ドロップイン✓ 在庫あり
$198 / 個
データシートを見る →EP20K60EFC324-3 最大定格＆電気的特性
| Series | APEX 20KE |
| Family | APEX 20K |
| Logic Elements / Cells | 2560 |
| Total Gates | 60000 |
| User I/Os | 196 |
| Number of Logic Blocks / LABs | 256 |
| Embedded Memory (EAB/ESB) Bits | 24576 |
| Internal Frequency (max) | 160 MHz |
| Propagation Delay | 1.72 ns |
| Peak Performance Frequency | 182 MHz |
| Core Voltage (VCCINT) | 1.8 V (1.71 V to 1.89 V) |
| I/O Voltage (VCCIO) | 3.3 V (3.0 V to 3.6 V) |
| Process Technology | 0.22 µm CMOS |
| Logic Family | CMOS |
| パッケージ / ケース | 324-FBGA (19x19 mm, 1.0 mm pitch) |
| 動作温度 | 0°C to +85°C (commercial) |
| 実装タイプ | Surface Mount |
| Programmable Type | In-system programmable (SRAM) |
| Configuration Interface | JTAG (IEEE 1149.1) + passive serial |
| RoHS ステータス | unknown |
EP20K60EFC324-3 ピン構成
| ピン A1 | I/O — General purpose user I/O, bank 1 |
| ピン A2 | I/O — General purpose user I/O, bank 1 |
| ピン A3 | I/O — General purpose user I/O, bank 1 |
| ピン A4 | VCCINT — Core supply voltage 1.8 V |
| ピン A5 | GND — Ground |
| ピン A6 | I/O — General purpose user I/O, bank 2 |
| ピン A7 | I/O — General purpose user I/O, bank 2 |
| ピン A8 | I/O — General purpose user I/O, bank 2 |
| ピン B1 | I/O — General purpose user I/O, bank 1 |
| ピン B2 | I/O — General purpose user I/O, bank 1 |
| ピン B3 | I/O — General purpose user I/O, bank 1 |
| ピン B4 | VCCIO — I/O supply voltage 3.3 V, bank 1 |
| ピン B5 | GND — Ground |
| ピン B6 | VCCIO — I/O supply voltage 3.3 V, bank 2 |
| ピン B7 | I/O — General purpose user I/O, bank 2 |
| ピン B8 | I/O — General purpose user I/O, bank 2 |
| ピン C1 | I/O — General purpose user I/O, bank 1 |
| ピン C2 | I/O — General purpose user I/O, bank 1 |
| ピン C3 | I/O — General purpose user I/O, bank 1 |
| ピン C4 | TCK — JTAG test clock input (IEEE 1149.1) |
| ピン C5 | TMS — JTAG test mode select input |
| ピン C6 | TDO — JTAG test data output |
| ピン C7 | I/O — General purpose user I/O, bank 2 |
| ピン C8 | I/O — General purpose user I/O, bank 2 |
| ピン D1 | I/O — General purpose user I/O, bank 1 |
| ピン D2 | I/O — General purpose user I/O, bank 1 |
| ピン D3 | TDI — JTAG test data input |
| ピン D4 | nSTATUS — Configuration status output (open-drain) |
| ピン D5 | nCONFIG — Configuration control input (active-low) |
| ピン D6 | DCLK — Configuration clock input |
| ピン D7 | I/O — General purpose user I/O, bank 2 |
| ピン D8 | I/O — General purpose user I/O, bank 2 |
| ピン E1 | I/O — General purpose user I/O, bank 1 |
| ピン E2 | I/O — General purpose user I/O, bank 1 |
| ピン E3 | I/O — General purpose user I/O, bank 1 |
| ピン E4 | GND — Ground |
| ピン E5 | DATA0 — Configuration data input (bit 0) |
| ピン E6 | I/O — General purpose user I/O, bank 2 |
| ピン E7 | I/O — General purpose user I/O, bank 2 |
| ピン E8 | I/O — General purpose user I/O, bank 2 |
| ピン F1 | I/O — General purpose user I/O, bank 1 |
| ピン F2 | I/O — General purpose user I/O, bank 1 |
| ピン F3 | VCCIO — I/O supply voltage 3.3 V, bank 1 |
| ピン F4 | VCCINT — Core supply voltage 1.8 V |
| ピン F5 | GND — Ground |
| ピン F6 | VCCIO — I/O supply voltage 3.3 V, bank 2 |
| ピン F7 | I/O — General purpose user I/O, bank 2 |
| ピン F8 | I/O — General purpose user I/O, bank 2 |
| ピン G1 | I/O — General purpose user I/O, bank 1 |
| ピン G2 | I/O — General purpose user I/O, bank 1 |
| ピン G3 | I/O — General purpose user I/O, bank 1 |
| ピン G4 | I/O — General purpose user I/O, bank 1 |
| ピン G5 | I/O — General purpose user I/O, bank 2 |
| ピン G6 | I/O — General purpose user I/O, bank 2 |
| ピン G7 | I/O — General purpose user I/O, bank 2 |
| ピン G8 | I/O — General purpose user I/O, bank 2 |
主な用途
EP20K60EFC324-3 の用途: 6 件s: Telecommunications Backplane Bridging, PCI Bridge and Bus Interface Logic, DSP Co-Processor for Industrial Control, High-Speed Data Path Conversion, Image Preprocessing Pipeline, Legacy ASIC Replacement in Industrial Systems.
Telecommunications Backplane Bridging
The EP20K60EFC324-3 fits telecom backplane bridging because its 196 user I/Os and 160 MHz Fmax support multi-channel serial protocol conversion between TDM buses, POS-PHY, and UTOPIA interfaces. The 60K-gate density is sufficient to implement 4 to 8 channels of serializer/deserializer glue logic with embedded dual-port RAM for elastic buffering, while the 324-FBGA package places high-density I/O within reach of standard backplane connector pin pitches. Engineers typically pair the device with a network processor or ASIC to offload packet classification and queuing functions. Trade-off: the -3 speed grade limits Fmax to 160 MHz, so designs targeting 622 MHz POS-PHY rates should select a -1 or -2 speed grade instead.
おすすめ
PCI Bridge and Bus Interface Logic
The EP20K60EFC324-3 serves as a PCI 32-bit/33 MHz bridge and bus interface device thanks to its 2560 logic elements and JTAG-driven boundary-scan support. The 24,576 bits of embedded memory distributed across 12 ESBs allow direct implementation of small FIFOs and address-mapping tables without external SRAM, while the 1.8 V core reduces dynamic power versus older 5 V PLD solutions. Designers use it to convert between PCI, PCI-X, and local processor buses, or to implement custom peripheral controllers in embedded computing platforms. Trade-off: PCI 66 MHz operation requires a -2 or -1 speed grade; the -3 device is limited to 33 MHz compliance.
おすすめ
DSP Co-Processor for Industrial Control
The EP20K60EFC324-3 implements DSP co-processing for motor control and signal conditioning by combining dedicated carry-chain arithmetic (16-bit multipliers in soft logic) with embedded memory for coefficient storage. The 60K-gate density supports 4 to 8 multiply-accumulate (MAC) channels running at 80 to 100 MHz, sufficient for real-time FFT, FIR filtering, and closed-loop motor control loops. The 0°C to +85°C commercial temperature range covers most factory-floor enclosures, and the JTAG interface enables in-field firmware updates for algorithm refinement. Trade-off: critical timing closure at high MAC counts may require migration to the -1 speed grade variant.
おすすめ
High-Speed Data Path Conversion
The EP20K60EFC324-3 excels at high-speed data path conversion such as serializer/deserializer (SERDES) companion logic, LVDS-to-LVTTL translation, and bus-width adaptation between narrow and wide interfaces. Its 196 user I/Os support up to 49 LVDS pairs (with external resistors), and the 1.72 ns propagation delay enables pipeline stages operating above 200 MHz when the -1 speed grade is selected. The SRAM-based configuration allows rapid prototyping of width-conversion algorithms without NRE charges. Trade-off: SERDES transceivers are not embedded; designs requiring integrated transceivers should migrate to Stratix or Cyclone families.
おすすめ
Image Preprocessing Pipeline
The EP20K60EFC324-3 implements image preprocessing pipelines such as Bayer demosaicing, color space conversion, and 2D convolution for machine vision and surveillance applications. Its 24,576 bits of embedded memory buffer line scans, while the 2560 logic elements implement parallel arithmetic for kernel operations across 3×3 or 5×5 pixel neighborhoods. The JTAG interface simplifies camera module calibration in production, and the commercial temperature range suits indoor surveillance installations. Trade-off: higher-resolution sensor pipelines exceeding 2K pixels may require the EP20K400 series with more logic and memory resources.
おすすめ
Legacy ASIC Replacement in Industrial Systems
The EP20K60EFC324-3 is widely used as a drop-in replacement for aging ASICs in industrial automation systems where the original ASIC is no longer available or mask charges are prohibitive. Its 60K-gate capacity matches typical ASIC integration levels of the late 1990s, and the 324-FBGA package footprint is compatible with most legacy ASIC PCB layouts through minor reballing. The JTAG configuration interface supports boundary-scan for in-system test, accelerating manufacturing test development. Trade-off: end-of-life status requires sourcing through brokers and authorized aftermarket distributors, with longer lead times and limited traceability.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP20K60EFC324-3 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP20K60EFC324-2X | EP20K60EFC324-2N | EP20K60EFC324-2 | EP20K60EFC324-1X | EP20K60EFC324-1 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-FBGA (19x19 mm) | 324-FBGA (same) | 324-FBGA (same) | 324-FBGA (same) | 324-FBGA (same) | 324-FBGA (same) |
| Speed Grade | -3 (slowest) | -2X (faster) | -2N (faster) | -2 (faster) | -1X (fastest) | -1 (fastest) |
| Total Gates | 60000 | 60000 | 60000 | 60000 | 60000 | 60000 |
| Logic Elements | 2560 | 2560 | 2560 | 2560 | 2560 | 2560 |
| User I/Os | 196 | 196 | 196 | 196 | 196 | 196 |
| Propagation Delay | 1.72 ns | shorter than 1.72 ns | shorter than 1.72 ns | shorter than 1.72 ns | shortest available | shortest available |
| VCCINT | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主な差別化要因
- Bitstream-compatible with EP20K60EFC324-1, -1X, -2, -2N, -2X speed grades （vs EP20K100EBC356-3)
- -3 speed grade offers lower dynamic power at the cost of Fmax （vs EP20K60EFC324-1X)
- APEX 20KE MultiCore architecture with embedded system blocks （vs EP20K100EBC356-3)
設計ノート
The EP20K60EFC324-3 requires two separate supply rails: VCCINT at 1.71 V to 1.89 V (1.8 V nominal) for the core logic, and VCCIO at 3.0 V to 3.6 V (3.3 V nominal) for the I/O banks. Decouple each rail with 0.1 µF ceramic capacitors placed within 5 mm of every supply pin, plus bulk 10 µF tantalum or polymer capacitors at the board entry points. Power-on reset (POR) is handled internally, but both rails must reach valid levels within 100 ms to ensure deterministic configuration startup. Estimated: at full utilization with all 196 I/Os toggling at 100 MHz, total power consumption reaches approximately 1.5 W, requiring thermal management via a thermal pad or copper pour under the FBGA.
The 324-FBGA package uses a 1.0 mm ball pitch and 19×19 mm body, requiring 6 to 8 layer PCB stackup with matched impedance traces for high-speed signals. Route all 196 user I/Os on the outer layers with microvia-in-pad construction for BGA breakout, and dedicate inner layers to solid ground and power planes directly beneath the BGA footprint. Per APEX 20KE datasheet recommendations, maintain at least 0.5 mm clearance between the BGA edge and any through-hole via to prevent solder joint stress. JTAG signals (TCK, TMS, TDI, TDO) should be length-matched within 50 mils and pulled up to VCCIO through 10 kΩ resistors.
When migrating between speed grades (e.g., -3 to -2X or -1), verify that the configuration bitstream is regenerated in Quartus II using the new device selection; bitstreams are NOT forward-compatible across speed grades. Another common pitfall: the 1.8 V VCCINT rail must reach 90% of nominal before any I/O activity begins, otherwise the configuration SRAM may not load correctly and nSTATUS will remain low. Finally, unused I/O pins must be explicitly set to 'tri-stated input with weak pull-up' in the Quartus pin planner to prevent floating inputs from drawing 1.8 V core current through ESD diodes. Estimated: allowing 1 second for JTAG reconfiguration after each power-up is recommended for production programming flows.
コンプライアンス情報
Compliance status not explicitly stated in verified distributor data. APEX 20KE family predates strict RoHS enforcement; verify date code and finish with distributor before RoHS-critical orders. AEC-Q100 not applicable - this is a commercial-grade FPGA, no automotive qualified variant exists.
