EP2A40F672I7 - APEX II 1.5M Gates FPGA, 672-pin FC-FBGA | Intel/Altera
部品番号: EP2A40F672I7 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256 | $2,560.00 |
| 100 | $228 | $22,800.00 |
| 500 | $205 | $102,500.00 |
| 1,000 | $185 | $185,000.00 |
EP2A40F672I7 概要
An FPGA is a reprogrammable semiconductor device whose logic function is defined by a user-supplied configuration bitstream rather than by the silicon vendor. APEX II sits in the FPGA taxonomy between traditional CPLDs (low density, glue logic) and high-end SoC FPGAs (multi-million LE with hardened CPUs). Within the broader programmable logic hierarchy, APEX II -> SRAM-based FPGA -> programmable logic -> semiconductor. Its reprogrammability, high pin count, and embedded MultiCore architecture made it popular for telecom line cards, baseband processing, and high-speed data-path prototyping in the early 2000s.
Key features of the EP2A40F672I7 include embedded MultiCore blocks combining lookup tables and product-term logic, a high-bandwidth MultiCore interconnect fabric, support for multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL, LVDS), and a configurable JTAG-based configuration port. The APEX II architecture combines fine-grain LUTs with coarse-grain Embedded System Blocks (ESBs) to balance logic density and arithmetic performance.
The 672-ball FC-FBGA package exposes 8 dedicated clock inputs, up to 24 user I/O banks, and a high pin density suitable for dense PCB escape routing. Multiple speed grades are available: -6 (fastest), -7, -8, and -9 (slowest). EP2A40F672I7 is the industrial-temperature speed-grade 7 variant.
Typical applications include telecommunications line interfaces, DSP co-processing, high-speed bus bridging, and legacy industrial control systems that require drop-in compatibility with other EP2A40 F672-pin FPGAs.
Designers should provide a stable 1.5 V core and a separate I/O VCCIO rail (3.3 V or 2.5 V typical), follow Altera's JTAG configuration guidelines, and observe the 220 °C peak reflow temperature limit required by the FC-FBGA's MSL-3 moisture sensitivity rating.
This page synthesizes distributor availability, pin-compatible speed-grade alternatives, and lifecycle observations not consolidated in the original APEX II datasheet.
ドロップイン代替品: EP2A40F672I7 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2A40F672I7 （同一形状・フットプリント） — 相違点: Speed Grade, Package, Process Technology, Operating Temperature, Operating Temperature Grade.
クイック比較ツール — 並列比較する代替部品を選択:
EP2A40F672I-8
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$125 / 個
データシートを見る →EP2A40F672I-9
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$165 / 個
データシートを見る →EP2A40F672C9N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$295 / 個
データシートを見る →EP2A40F672C8N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$122 / 個
データシートを見る →EP2A40F672C7N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$198 / 個
データシートを見る →EP2A40F672I7 最大定格＆電気的特性
| Family | APEX II |
| Logic Elements | 38,400 |
| Maximum System Gates | 1,500,000 |
| Core Voltage (VCCINT) | 1.5 V |
| Process Technology | 0.15 µm CMOS |
| Core Frequency (max) | 562 MHz |
| 動作温度 | -40 °C to +85 °C (Industrial) |
| パッケージ | 672-ball FC-FBGA |
| Package Family | Fine-pitch Chip-scale BGA |
| 実装タイプ | Surface Mount |
| Speed Grade | -7 (speed grade 7) |
| 湿気感度レベル（MSL） | 3 |
| Peak Reflow Temperature | 220 °C |
| Configuration Method | JTAG / Passive Serial / Active Serial |
| RoHS ステータス | unknown |
EP2A40F672I7 fine-pitch chip-scale bga ピン配置ガイド
EP2A40F672I7 (fine-pitch chip-scale bga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2A40F672I7.
詳細は データシート をご参照ください。
主な用途
EP2A40F672I7 の用途: 6 件s: Telecommunications Line-Card Aggregation, Legacy DSP Co-Processor / FIR Accelerator, High-Speed Bus Bridge and Protocol Converter, Legacy Industrial Control and SCADA, Telecom Backplane Cross-Point Switch, Aerospace and Defense Avionics (Legacy).
Telecommunications Line-Card Aggregation
The EP2A40F672I7's 1.5M system gates and 38,400 logic elements are well-matched to telecom line-card aggregation duties, where multiple E1/T1 or STM-1 framers, HDLC controllers, and traffic-management state machines must coexist on a single programmable device. The 562 MHz core frequency gives the design enough headroom for high-rate crosspoint switching and packet-classification pipelines. The 672-ball FC-FBGA exposes sufficient user I/O to terminate multi-port PHY interfaces (MII, RMII, GMII, POS-PHY Level 2/3) without external bus muxing. Industrial -40 °C to +85 °C operation (the 'I' suffix) lets the line card populate outdoor cabinets and central-office frames without derating. The MultiCore interconnect fabric and Embedded System Blocks provide deterministic timing for time-division multiplexed backplane traffic.
おすすめ
Legacy DSP Co-Processor / FIR Accelerator
The APEX II MultiCore architecture integrates dedicated multiplier chains and Embedded System Block memories that the EP2A40F672I7 can instantiate as parallel FIR filters, FFT butterflies, and image-processing pipelines. At 562 MHz core frequency the device sustains multi-tap FIR throughput sufficient for video-rate DSP front-ends and software-defined radio baseband channels. The 0.15 µm CMOS process node gives balanced power and timing margins at 1.5 V VCCINT, allowing fanless operation with copper-pour-only heatsinking. Industrial temperature rating allows direct deployment in factory-floor DSP controllers and ruggedized signal-conditioning equipment. Designers typically pair the EP2A40F672I7 with external SRAM for coefficient storage and a host processor for control sequencing.
おすすめ
High-Speed Bus Bridge and Protocol Converter
Bus-bridging glue logic between legacy PCI/PMC interfaces and modern processors is a classic APEX II use case. The EP2A40F672I7's 672-ball FC-FBGA exposes enough user I/O to terminate a 64-bit PCI bus alongside a parallel RapidIO or POS-PHY interface, with the MultiCore fabric arbitrating between masters without external muxes. Industrial temperature grading permits deployment in factory automation and military vetronics chassis where commercial-only FPGAs fail reliability screens. The 1.5M-system-gate capacity absorbs full protocol stacks including DMA engines, scatter-gather descriptor controllers, and interrupt concentrators. Quartus II place-and-route produces predictable timing closure thanks to deterministic MultiCore routing.
おすすめ
Legacy Industrial Control and SCADA
Long-life industrial control platforms built around APEX II continue to operate in chemical, power, and transportation infrastructure. The EP2A40F672I7's industrial -40 °C to +85 °C operating range, 1.5 V regulated core, and 562 MHz timing margin suit deterministic PLC scanning, SCADA telemetry aggregation, and redundant controller supervision tasks. The 672-ball FC-FBGA package supports dense I/O expansion including differential RS-485, isolated 24 V digital inputs, and pulse-counter chains. Its obsolete lifecycle status is offset by long-term reliability records spanning two decades of installed base. Maintenance and refurbishment of these systems is the primary 2026 use case for the EP2A40F672I7.
おすすめ
Telecom Backplane Cross-Point Switch
The MultiCore interconnect fabric of the EP2A40F672I7 makes it well-suited for non-blocking crosspoint switches that route STS-1/STM-1 and STS-3/STM-3 streams across redundant backplanes. With 1.5 M system gates the device can switch hundreds of serial lanes in parallel and provide embedded diagnostics for BER monitoring, alarm generation, and protection-switching state machines. Industrial temperature rating ensures operation in uncontrolled central-office environments. The 672-ball FC-FBGA allows high pin-count LVDS links to multiple line cards without external transceivers. Quartus II timing closure is reliable across the -7 speed grade at 562 MHz.
おすすめ
Aerospace and Defense Avionics (Legacy)
Many avionics and defense subsystems designed in the early 2000s continue to operate using APEX II FPGAs, including flight-control test equipment, radar signal pre-processors, and secure-communication modems. The EP2A40F672I7's industrial temperature range and deterministic MultiCore routing make it acceptable for many non-flight-critical ground and lab environments. The 672-ball FC-FBGA supports the high I/O density demanded by parallel ADC/DAC interfaces and discrete digital control lines. Obsolescence management and DMSMS (Diminishing Manufacturing Sources and Material Shortages) programs drive 2026 demand for verified inventory of this part.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2A40F672I7 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2A40F672I-8 | EP2A40F672I-9 | EP2A40F672C9N | EP2A40F672C8N | EP2A40F672C7N |
|---|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | 672-ball FC-FBGA | 672-ball FC-FBGA (same) | 672-ball FC-FBGA (same) | 672-ball FC-FBGA (same) | 672-ball FC-FBGA (same) | 672-ball FC-FBGA (same) |
| Speed Grade | -7 | -8 (slower) | -9 (slowest) | -9 | -8 | -7 |
| Temperature Grade | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) | Commercial (0 to +70 C) | Commercial (0 to +70 C) | Commercial (0 to +70 C) |
| Logic Elements | 38,400 | 38,400 (same) | 38,400 (same) | 38,400 (same) | 38,400 (same) | 38,400 (same) |
| System Gates (max) | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M |
| Core Voltage (VCCINT) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| MSL | 3 | 3 | 3 | 3 | 3 | 3 |
主な差別化要因
- Industrial temperature screening on -7 speed grade （vs EP2A40F672C7N)
- Highest fMAX among APEX II F672-pin industrial variants （vs EP2A40F672I-9)
- Same package footprint as APEX 20K600 family （vs EP20K600CF672)
設計ノート
Estimated: APEX II static power at 1.5 V VCCINT and 25 °C junction for a fully populated EP2A40F672I7 is typically 1.5 W, with dynamic power scaling linearly with toggle rate up to several watts at 562 MHz fMAX. The 672-ball FC-FBGA requires a minimum 8-layer PCB stack-up with continuous inner ground planes to spread heat. For designs consuming more than 3 W sustained, attach a small copper heatsink or 2 oz copper pour directly under the BGA footprint. Keep junction temperature below 125 °C for industrial-grade reliability.
The 672-ball FC-FBGA uses 1.0 mm ball pitch; PCB escape routing requires microvia or via-in-pad technology on 4-layer stack-ups. Per Altera layout guidelines, place 0.1 µF and 10 µF decoupling capacitors within 100 mils of every VCCINT/VCCIO ball group. Maintain at least 4 ground balls per power ball for return-path integrity. MSL-3 handling requires dry-pack assembly within 168 hours of bag opening, otherwise rebake at 125 °C for 24 hours prior to reflow at the 220 °C peak profile.
Do not assume any APEX II speed grade can be swapped blindly: -7 to -8 to -9 each step reduces fMAX by roughly 15%, which can break timing closure. Verify Quartus II fMAX reports for every clock domain after substitution. JTAG configuration requires VCCIO bank 1 powered before nCONFIG toggles, otherwise configuration fails silently. Pin-compatible commercial-grade ('C' suffix) variants must NOT be used where industrial ('I' suffix) parts are specified — junction-temperature behavior diverges at the -40 °C lower bound and 85 °C upper bound.
コンプライアンス情報
Compliance data not published in verified web sources for this obsolete Altera/Intel FPGA. APEX II family predates RoHS-6 directive enforcement in many Altera part numbers, so historical lead-free status cannot be confirmed.